DDR4288S0221TF Amphenol

Storage & Server IO DDR4 Memory Module Sockets NEXT-GENERATION HIGH SPEED DIMM MODULE CONNECTOR Vertical DDR4 DIMM sockets from Amphenol ICC provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The sockets facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. The DDR4 series complies to new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and support module variants in UDIMM, RDIMM and LRDIMM. Allows space to mount small passive components on the TARGET MARKETS board bottom to maximize PCB space utilization Easy to insert and extract the module Support 1.60mm or 2.40mm thick motherboards Optimizes airflow Meets environment requirements FEATURES BENEFITS Smaller pitch and lower operating voltage Less energy consumption Supports faster data rates Faster transition Reduced product width Saves board space Various pin tail lengths for PCB thickness Compatible to different customer requirements Lower insertion force Easier for module card insertion and extraction Narrow housing solutions Saves board space and benefits air-flow Provide option for one side latch fixed Saves board space Robust design for housing, contact and latches Meet severe shock and vibration test criteria for high end servers Amphenol Information Communications and Commercial Products www.amphenol-icc.comDDR4 Memory Module Sockets TECHNICAL INFORMATION MATERIAL SPECIFICATIONS Amphenol: Insulator: High temperature thermal plastic (UL94V-0), color option Product Specification: GS-12-1092 Contacts: Copper alloy, gold flash or 15 microinches Packaging Specification: GS-14-2267 min. of gold or 30 microinches min. of gold (Contact Application Specification: GS-20-0353 area), tin or matte tin plating (solder area), nickel plating over all (underplate) JEDEC: Boardlock: Copper alloy, tin plating (solder area), Module Outline: MO-309 nickel plating overall (underplate) Socket Outlines: ELECTRICAL PERFORMANCE PTH solder: SO-016 Voltage Rating: 30V AC (RMS)/DC Surface-Mount: SO-017 Current Rating (0.7A/pin max. Press-fit: SO-019 MECHANICAL PERFORMANCE APPROVALS & CERTIFICATION Insertion Force: 10.88Kgf max. UL E66906 Withdrawal Force: 14gf min. per contact pair ENVIRONMENTAL Retention Force: Contact: 0.30Kgf min. Solderability (Solder coverage - 95% min.) Boardlock: 1.36Kgf min. Resistance to Soldering Heat (Visual: no damage or discoloration Durability of connector materials) Vibration, Mechanical Shock Temperature life, Thermal shock Latch Overstress Force (3.5kg min. force held for 10s Cycling temperature and humidity with no damage) Temperature Rise: 30C max. Reseating - No damage Mixed Flowing Gas, Thermal Disturbance, Salt Spray Latch Actuation Force - The force to fully actuate the latch open shall be 4.5kgf max. per latch PACKAGING Module Rip Out Force - 9.1kgf min. retention force Tray of the module in connector with no damage Retention of Connector to PCB - No lifting of TARGET MARKETS/APPLICATIONS connector from applicable PCB Routers Switches Total Insertion force to be 6.8kgf max. Wireless Infrastructure Desktop PCs Servers Storage Systems Supercomputers Workstations Embedded Systems Disclaimer www.amphenol-icc.com Please note that the above information is subject to change without notice.