Storage & Server IO DDR5 Memory Module Sockets (SMT) COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023 Vertical DDR5 DIMM sockets from Amphenol ICC provide 288 contacts on 0.85mm pitch and are designed to accept DDR5 memory modules that conform to JEDEC MO-329. The sockets facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. Able to withstand high level system level shock and vibration testing module weight Easy to insert and extract the module card Supports thicker multilevel motherboard TARGET MARKETS Optimizes airflow Meets environmental requirements FEATURES BENEFITS Smaller pitch and lower operating voltage Results in less energy consumption Supports faster data rates Faster transition Reduced product width Saves board space Lower insertion force Easier for module card insertion and extraction Different color options for housing and latches Facilitates quick visual identification from PCB Narrow latch option Facilitates good airflow Amphenol Information Communications and Commercial Products www.amphenol-icc.comDDR5 Memory Module Sockets (SMT) TECHNICAL INFORMATION MATERIAL ENVIRONMENTAL Contacts: Copper alloy, Gold flash or 15 in min. Solderability: 95% min. of gold or 30 in min. of gold (Contact area), Tin Resistance to Soldering Heat: Visual-no damage or or matte tin plating (Solder Area), Nickel plating discoloration of connector materials over all (Underplate) Temperature Life, Thermal Shock Insulator: High temperature, thermal plastic Cycling Temperature and Humidity (UL94V-0), color option Temperature Rise: 30C max. Boardlock: Copper alloy, Tin plating (Solder Area), Nickel plating overall (Underplate) Mixed Flowing Gas, Thermal Disturbance, Salt Spray ELECTRICAL PERFORMANCE APPROVALS & CERTIFICATION Voltage Rating: 30V AC (RMS)/DC UL E66906 Current Rating: 1.0 Amps/pin max. SPECIFICATIONS MECHANICAL PERFORMANCE Amphenol Product Specification: S-DDR-005 Insertion Force: 106.8N max. Amphenol Packaging Specification: PKSDDR5002 Withdrawal Force: 19.77N min. Amphenol Application Specification: S-DDR-006 Retention Force: JEDEC Module Outlines: MO-329 Contact: 300gf min. per pin JEDEC Socket Outlines: SO-023 Boardlock: 13.3N min. PACKAGING Durability: 25 cycles Tray Vibration, Mechanical Shock Latch Overstress Force: 3.5kg min. force held for TARGET MARKETS/APPLICATIONS 10s with no damage Routers Reseating: No damage Switches Wireless Infrastructure Latch Actuation Force: The force to fully actuate Desktop PCs the latch open shall be 4.0kgf max. per latch Server and Storage Systems Super Computers Module Rip Out Force: 9.1kgf min. retention Workstations force of the module in connector with no damage Embedded Systems Retention of Connector to PCB: No lifting of connector from applicable PCB Total Insertion Force: 35N max. Disclaimer www.amphenol-icc.com Please note that the above information is subject to change without notice.