HDB-D4-160M032X Amphenol

Product Data Sheet 3 Amphenol HDB Series High Density Mother Board & Daughter Board Connectors No. 201-3 Rectangular Interconnects with .070 X .060 Grid Spacing 3 HDB Mother Board Connector This new connector series incorporates a higher density contact pattern and lower mated height than Amphenols original Low Mating Force rectan- gular connectors while utilizing the same durable 3 and reliable B contact. 3 The B brush (bristle brush bunch) contact is comprised of multiple strands of high tensile wire that intermesh to create an electrical connection. 3 HDB Daughter Board Connector 3 HDB CONNECTOR PERFORMANCE BENEFITS OF THE BRUSH CONTACT Durability: 100,000 mating cycles Redundant current paths: 14-70 gas tight points Insertion/Extraction Force: 1.5 ounce typical per contact of contact per mated bunch Operating Temperature: -65 to 150C Very smooth low friction interface Current Rating: 2 amperes Low mating forces: 1.5 oz. typical per contact, Hot swap 1 ampere maximum 70-90% lower than conventional contacts (load dependent) Long contact life: 100,000 cycles of mating and Insulation Resistance: 5 gigaohms minimum unmating without performance degradation Dielectric Withstanding Documented intermittency free performance: No Voltage: 750 volts, 60 hertz, rms Sea 10 nano-second discontinuities during Level 250 volts, 60 hertz, 50,000,000 cycles of 0.010 displacement rms 70,000 feet Elevation Impervious to fretting Contact interface meets M55302/166 thru /171 Solderability: MIL-STD-202, Method 208 Salt Fog: 48 Hours IAW MIL-STD-1344, method 1001, test condition B 3 Humidity: IAW MIL-STD-1344, method HDB FEATURES 1002, type II Polarization: D shaped design Vibration: 4 hours in each of 3 mutually Keying: Optional keys offer 36 unique perpendicular axes IAW MIL-ST keying combinations 1344, method 2005, Guide Pins Optional guide pins provide test condition V, letter H additional alignment Shock: 1 shock along each of three Radial Misalignment: Capable of correcting up to a mutually perpendicular axes IAW .020 initial radial misalign- MIL-STD-1344, method 2004, ment test condition G Angular Misalignment: Capable of mating with up to a Data Rate: Capable of 3.125 Gbps (consult 2 initial angular misalignment Amphenol for arrangement) 2009 Amphenol Corporation Printed in U.S.A. 1/8/2009 Amphenol 15 E D 4 6 F 1 3 A C 2 B 3 HDB MATERIALS Insulator: Liquid crystal polymer, 30% glass filled Contact: Wire: Beryllium copper per ASTM B197 finish is gold per ASTM B488 over nickel per AMS-QQ-N-290. Holder: Brass similar to UNS C33500 finish is gold per MIL-G-45204 or tin-lead per MIL-P-81728 or tin per MIL-T-10727 (RoHS Compliant). Sleeve: Stainless Steel per AMS-5514, passivated IAW QQ-P-35 (Daughter Board connector only) Keys/Guide Pins: Stainless Steel MOTHER BOARD DAUGHTER BOARD .335 MAX086 MIN. DIA. THRU HOLE .350 .350 .325 .150 .005 .086 MIN. DIA. (USE NO. 2 SCREW) THRU HOLE (USE NO. 2 SCREW) .150 .020 PIN 1 PIN 1 TYP035 TYP. A B C BA .070 TYP016 .001 .016 .001 TYP. DIA. TYP090 TYP150 .020 .195 MIN. HEX .060 TYP025 .030 TYP. TYP070 MIN DEEP (USE 3/16 HEX HEAD) .540 .420 Number of Dimension Dimension Dimension Contacts A B C 040 40 1.375 0.800 1.075 080 80 2.075 1.500 1.775 120 120 1.775 2.200 2.475 .350 160 160 3.475 2.900 3.175 .410 .470 .530 All dimensions for reference only. CUSTOM CONFIGURATIONS Hybrid configurations are available with any combination of brush and power, coax, and/or fiber optic contacts Partially populated arrangements for high voltage or high speed data transfer up to 3.125 Gbps. (shown at right) Consult Amphenol Aerospace with your design requirements. 2 B 2 A C 1 3 D F 4 6 E 5