D-SUBMINIATURE HIGH DENSITY CONNECTORS The new High Density D-Subminiature range is part of Amphenols I/O-Connector portfolio which provides customers access to a wide range of industry standard and application specific I/O interconnect solutions. Amphenols I/O connector solutions complete your board and system designs by providing high-density and high- speed interfaces to enable interconnect technologies for networking, storage and memory and complementary products for power distribution. Our range of standardized I/O solutions enables full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI. Amphenol also has the capability to provide customized I/O solutions optimized to address application specific requirements. TARGET MARKETS Through Amphenols high-speed, power, assembly and mechanical packaging expertise, you gain the advantage of getting your signals out of the box at optimal cost and performance. Amphenols I/O connectors - coupled with Amphenols extensive range of backplane and board-to- board connectors and cable assembly products-enable complete link solutions for your equipment designs. Amphenols D-Subminiature connectors are part of an industry standard for applications requiring robust and reliable connectors. These D-Subminiature connectors are one of the most popular Input - Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. Since many years Amphenol offers a wide range of D-Subminiature connectors to meet all design requirements, and to address increasing needs for high density packaging, Amphenol developed the D-Subminiature High Density Range. FEATURES BENEFITS High density Dsub connectors can accommodate more Answer to the increasing need for higher density packaging number of contacts in the basic shell sizes Selected layouts are also available in Press-fit and Pin-in- Meets different termination needs Paste versions Pin-in-Paste connectors comes in Tape & Reel packaging Time saving as it can be automatically positioned on the board using pick and place processes Various PCB and Panel mounting accessory options Wide variety of choices for secure connection available Hoods available in plastic, metalized and metallic form Supports cable connection Prevents risks of pulling up and with locking screws accidental un-mating Lead-free and RoHS compliant Meets environmental, health and safety requirements Amphenol Information Communications and Commercial Products www.amphenol-icc.comD-SUBMINIATURE HIGH DENSITY CONNECTORS TECHNICAL INFORMATION MATERIAL TARGET MARKETS/APPLICATIONS Insulator: Glass filled thermoplastic (UL94V-0) black Asymmetric Digital Subscriber Line Contact: Copper alloy (ADSL) Base Station Shell: SPCC steel Switching Transmission ELECTRICAL PERFORMANCE Current Rating: Rated current: 2.5A Set-top Box Rated Voltage: 250V Desktop and Laptop Contact Resistance: 25m max. Initial and 40mmax. after Storage System Insulation Resistance: 5000m min. at 500V DC Router and Server Dielectric Strength: 750V RMS Automotive Diagnostics Control Drives Operating Temperature Range: 55C to +105C Energy Meter Gaming Machine MECHANICAL PERFORMANCE Test Equipment Mating/Un-mating Cycles: 200/500 Office Automation POS & Handheld terminal Insertion/Extraction Force per contact: 5N max. / 0.2N min. Power Supplies Parking Meter Printer and Copier Renewable Energy Robotics Surveillance Camera Avionics Medical Instrument Military Equipment Disclaimer www.amphenol-icc.com Please note that the above information is subject to change without notice.