Storage & Server IO PCIe M.2 Gen 3 and Gen 4 Card Edge Connectors HIGH DENSITY HIGH PERFORMANCE CONNECTOR Amphenols PCIe M.2 Gen 3 and Gen 4 connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options and supports higher data rates compared to PCIe Mini Card connector. It is designed for PCIe 3.0, USB 3.0 and SATA 3.0 applications, making it suitable for tablets, laptops and low profile storage and server applications. PCIe M.2 connectors also support higher data rate transmission with both single and double-sided modules. Various connector height and keying options Accepts angled insertion of add-in module cards Some product options support both angled and straight TARGET MARKETS insertion Provide both right angle and vertical orientation M.2 connectors FEATURES BENEFITS Card edge connector with 67 contacts on a 0.50mm pitch Fully compliant with PCI-SIG PCIe M.2 specification Compliant with PCIe 3.0, USB 3.0 and SATA 3.0 Serves multiple high speed peripheral applications 75 positions with 8 connector key options Design flexibility Available in various connector height Options to reduce overall height Supports both single and double-sided modules Enables higher data rates Upgradable to Gen 4 (16Gb/s) Supports higher speeds with backward compatibility to Gen 3 Provides both right-angle and vertical orientations Allows for application flexibility Vertical M.2 supports 5,000 mating cycles Higher durability Offers dual port M.2 and supports straight insertion z Saves mother board space in X axis and Z axis respectively height of 2.00mm Amphenol Information Communications and Commercial Products www.amphenol-icc.com PCIe M.2 Gen 3 and Gen 4 Card Edge Connectors TECHNICAL INFORMATION MATERIAL SPECIFICATIONS Contact: Copper alloy with gold plating sufficient to meet all Amphenol Product Specification: mechanical and environmental requirements GS-12-1142 Contact Finish: Must be compatible with lead-free soldering process GS-12-1195 GS-12-1248 Housing: Complies with UL 94 V-0. Must be compatible with lead-free soldering process PACKAGING ELECTRICAL PERFORMANCE Tape & Reel Low Level Contact Resistance: EIA-364-23, 55m max. (initial) per TOOLING INFORMATION contact, *20m max. change allowed Tooled Up Insulation Resistance: EIA-364-21, *>5 x 108 at 500V DC Dielectric Withstanding Voltage: EIA-364-20, *>300V AC (RMS) at TARGET MARKETS/APPLICATIONS sea level Current Rating: *0.5A/Power contact (continuous), * The temperature Wireless rise above ambient shall not exceed 30C, * The ambient condition is still air at 25C, * EIA-364-70 Method 2 Laptop Voltage Rating: 50V AC per contact Tablet MECHANICAL PERFORMANCE Storage Durability: Normal M.2: 25-60 mating cycles M.2 with 30Au: Can meet 5000 mating cycles MPN: MDT-350-X-XX-001VT ENVIRONMENTAL Durability: EIA-364-9 *Option 1 - 25 Cycles, *Option 2 - 60 Cycles, Upon completion of cycles the sample must meet all visual and electrical performance requirements Insertion Force: 20N (2.04 2 KgF, 1 Newton = 1 Kg* m/s ) max., EIA-364-13, Method A Shock: * 250 G (notebook) and 285 G (tablet), *at 2 ms half sine, *on all six (6) axis Vibration: EIA-364-1000 Test group 3, EIA-364-28 Operating Temperature: -40C to +80C Environmental Test Methodology: EIA-364-1000 Test group 1, 2, 3, 4 Useful Field Life: Three (3) years Disclaimer www.amphenol-icc.com Please note that the above information is subject to change without notice.