VIPER Hi-Speed, High Density Amphenol Modular Interconnects Backplane Systems VITA 46, VITA 48 & VITA 60 FOOTPRINT COMPATIBLE The VIPER Connector is a shielded, high-density, hi-speed modular interconnect with press-fit termination. Amphenol Backplane Systems* developed the VIPER interconnect platform to meet or exceed future avionic high-level requirements such as: High-level vibration and mechanical shock protection Condensing moisture resistance Ruggedization in packaging that can scale to VIPER Module Connector on a Board higher bandwidths without costly and time- consuming chassis redesigns. The VIPER connector platform offers the ability to scale from 80 Mbps to over 10 Gb/s while retaining the same Vita 46 platform slot pitch at 20.3mm to 25.4mm. Key Features of VIPER Fully footprint-compatible with VITA 60, VITA 46 and VITA 48 standards Hi-Speed: the VIPER is designed for 10 + Gb/s data rate performance 100 ohm impeda nce for differential pair configuration The daughtercard assembly is optimized for differential pair architecture on a 1.8mm x 1.35mm grid. The daughtercard is waferized, and provides single-ended and power wafer options integrated onto a stainless steel stiffener with stainless steel frame** and keying elements The backplane has signal contacts that incorporate a highly reliable 4-point-of-contact beam design, and ground contacts which are robust compliant pin & contact fork design 0.52mm nom. translation in fully mated condition ESD protection supports 2-level maintenance designs VIPER Backplane Closeup Flexible modular design is ideal for standard 3U and 6U applications, as well as unique custom configurations incorporating RF and fiber optic MT solutions Amphenols VIPER Interconnect is Designed in accordance with the VPX Technology Roadmap VIPER Module Closeup Overmolded Wafers that Populate the Module Note: VPX Tecnology Roadmap, VPX and Open VPX Logos are copywrite of VITA Compliant Pin Fork & Blade * Consult Amphenol Backplane Systems for more information on VIPER Interconnects: Contacts Contacts Amphenol Backplane Systems, 18 Celina Avenue, Nashua, NH 03063 Phone: 603-883-5100. Website: www.amphenol-abs.com ** Light-weight alternative available consult Amphenol-Backplane Systems. VIPER Hi-Speed, High Density Amphenol Modular Interconnects (VITA 60) Backplane Systems SPECIFICATIONS VIPER Electrical Specifications Data Rate: 10 Gbps Differential Impedance: 100 ohms Differential Insertion Loss: 5 dB up to 5 GHz (10 Gbps) Differential Return Loss: 5 dB up to 5 GHz (10 Gbps) Far End Crosstalk: 35 dB up to 8 GHz Near End Crosstalk: 33 dB up to 8 GHz Signal Contacts: 1 amp Backplane Assembly Power Wafer: 12 amps per wafer at 30 C T-Rise with VIPER Backplane Connectors (also has a Compliant Pin to Plated Through Hole Brush Rack & Panel Connector Pair on left side) Resistance: 1 milliohm max Dielectric Withstanding Voltage: 500 volts RMS One VIPER Backplane Insulation Resistance: 1000 on a Board megohms VIPER Mechanical Specifications Signal and Ground Contact: Normal Force: 85 grams per beam Engagement force: 45 grams max, 35 grams typical Separation force: 30 grams max, 25 grams typical Durability: 500 cycles minimum Backplane Signal and Ground Compliant Pin: Insertion Force: 4.9 kilograms maximum 1.5 kilograms to 4.9 kilograms depending on the surface finish of PCB Retention Force: 1.4 kilograms minimum Daughtercard Wafer Compliant Pin: Insertion Force: 1.8 kilograms to 3.6 kilograms depending on the surface finish of PCB Six VIPER Backplane Connectors on a Board and one Mating Retention Force: 1.6 kilograms minimum Viper Module above Radial hole wall deformation: 0.04mm per side measured from drilled hole VIPER Materials and Finishes Axial hole wall deformation: 0.03mm measured in the Backplane Signal and Ground Contacts: C7025 copper alloy, 0.23mm. Finish is 0.00127mm nickel minimum all over vertical plane per SAE-AMS-QQ-N-290, Class I. Selective 0.00127mm gold Translation: 0.52mm nom. fully mated minimum per ASTM-B488, Type II, Grade C, Class 1.27 in Slot Pitch: 20.30mm the mating area. 0.0076mm 60/40 reflowed tin/lead minimum selectively plated in the compliant pin area. VIPER Environmental Specifications Differential, Power, and Single-ended Daughtercard Temperature: 55C to 125C Wafer Leadframes: C7025 copper alloy, 0.38mm. Finish is 0.00127mm nickel minimum all over per SAEAMS-QQ-N-290, Random Vibration: 90 minutes per X, Y and Z axis at 2 class I. Selective 0.00127 gold minimum per ASTM-B488, 0.6 G /Hz Type II, Grade C, Class 1.27 in the mating area. 0.0076mm Mechanical Shock: 50 Grms in Y axis, 80 Grms in X 60/40 reflowed tin/lead minimum selectively plated in the com - and Z axis, 11 milliseconds, half sine pliant pin area. Temperature Life: 1000 hours at 125C Backplane Insulators and Daughtercard Wafer Insert Mold Material: Glass reinforced polyester (Liquid Crystal Polymer), UL 94V-0, color black. Printed Circuit Board Specifications Front and Rear Stiffeners: Stainless steel, 0.6mm, Type 301, Minimum Backplane and Daughtercard thickness: 1/2 Hard. finish per Mill 2B. 1.85mm and 1.53mm Backplane Guide Pin: Stainless steel, Type 303, passivated. Daughtercard pattern primary drilled hole size: 0.55mm Daughtercard Connector Header* and Keying Compo- Daughtercard pattern finished hole size: 0.46 0.05mm nents: Stainless steel, Type 440, passivated. Backplane pattern primary drilled hole size: 0.65mm Backplane pattern finished hole size: 0.56 0.05mm * Light-weight aluminum header version available consult Amphenol Backplane Systems Rev. 2. Printed Jan. 2011