INVENTEC 500 Main Street, Suite 18 PO Box 989 Deep River, CT 06417 USA Toll Free: 800.435.0317 Phone: 860.526.8300 Fax: 860.526.8243 LF-4300 Lead-Free, Water Washable Solder Paste www.inventecusa.com Product Data Sheet Available Alloys Product Highlights n REL0 flux classification in a Water Washable Alloy Temp C Temp F Solder Paste 42Sn/58Bi 138 280 n Tier I Military/Avionic OEM approved 42Sn/57Bi/Ag1 138 280 n Exceptional print definition at high printing speeds 96.5Sn/3.0Ag/0.5Cu 217-220 423-428 up to 100mm/sec 99.0Sn/0.3Ag/0.7Cu 217-221 423-430 n Residue can be left on the board in most assemblies 96.5Sn/3.5Ag 221 430 (not recommended for high impedance assemblies) 99.3Sn/0.7 Cu 227 441 n Clear Residue 95Sn/5Sb 235-240 455-464 n Low voiding, including LGA components 95Sn/5Ag 221-245 430-473 n RoHS II and REACH compliant n Compatible with enclosed print heads Packaging n Print and dispense grade solder paste available 500 gram jars 500 gram cartridges 35 or 100 gram syringes ProFlow cassettes Test Results Test J-STD-004 or Test Requirement Result other requirements (as stated) Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough Corrosion IPC-TM-650: 2.6.15 L: No corrosion Quantitative Halides IPC-TM-650: 2.3.28.1 L: <.05% Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (no-clean) o Surface Insulation Resistance 85 C, IPC-TM-650: 2.6.3.7 L: 100 M (no-clean) 85% RH 168 Hours Tack Value IPC-TM-650: 2.4.44 37g o Viscosity - Malcom 10 RPM/25 C IPC-TM-650: 2.4.34.4 Print: 155-215 3 (x10 mPa/s)- SAC305 T3/T4 Dispensing: 80-115 Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation Conflict Minerals Compliance Electronic Industry Citizenship Coalition (EICC) Compliant REACH Compliance Articles 33 and 67 of Regulation Contains no substance (EC) No 1907/2006 >0.1% w/w that is listed as a SVHC or restricted for use in solder materialsLF-4300 Lead-Free, Water Washable Solder Paste Printer Operation Amtech Low Oxide Powder Distribution The following are general guidelines for stencil printer Micron Size Type Pitch Requirements optimization with LF-4300. Some adjustments may be 45-75 Type-2 24 mil and above necessary based on your process requirements. 25-45 Type-3 16-24 mil 20-38 Type-4 12-16 mil Print Speed: 25-100 mm/sec 15-25 Type-5 8-12 mil Squeegee Pressure: 70-250g/cm of blade 5-15 Type-6 5-8 mil Under Stencil Wipe: Once every 10-25 prints, or as 2-11 Type-7 < 5 mil necessary Note: Type-6 and Type-7 may not be available in certain alloys. Other powder distributions are available on request. Stencil Life o Storage > 8 hours 30-45% RH and 20-25 C o o Solder paste should be stored between 3-8 C ~ 4 hours 45-75% RH and 20-25 C o (37-46 F) to obtain the maximum refrigerated shelf life of six months. Unopened solder paste stored Cleaning o o at room temperature, 25 C (77 F) will have a one LF-4300 can be cleaned using deionized water at month shelf life. Syringes and cartridges should be 40-60C with a recommended water pressure of stored vertically in the refrigerator with the dispens- 30-50 PSI. ing tip down. Allow 4-8 hours for solder paste to o reach an operating temperature of 20-25 C (68-77 o F). Keep the solder paste container sealed while warming the solder paste to operating temperature. NEVER FREEZE SOLDER PASTE. Recommended Profile This profile is designed to serve as a starting point for process optimization using LF-4300. To achieve better results with voiding or to reduce tombstoning, consider using a longer soaking zone, o (170-220 C) for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <90 seconds. Revised August 18, 2016