NC-559-V2 is a no-clean flux designed to be used with a variety of printed circuit board manufacturing processes. It is designed to provide excellent corrosion resistance, wetting, and residues that are free from corrosion and oxidation. Its properties make it ideal for forming strong and permanent solder joints on copper, brass, and aluminum surfaces. NC-559-V2 is free of halides, solvents, halogen, and halide-forming elements. Because of its minimal residues and no-clean characteristics, NC-559-V2 allows engineers to create a more reliable connection with fewer potential failure points.