X-On Electronics has gained recognition as a prominent supplier of AD6657EBZ Data Conversion IC Development Tools across the USA, India, Europe, Australia, and various other global locations. AD6657EBZ Data Conversion IC Development Tools are a product manufactured by Analog Devices. We provide cost-effective solutions for Data Conversion IC Development Tools, ensuring timely deliveries around the world.

AD6657EBZ Analog Devices

AD6657EBZ electronic component of Analog Devices
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Part No.AD6657EBZ
Manufacturer: Analog Devices
Category: Data Conversion IC Development Tools
Description: Data Conversion IC Development Tools EVAL BRD - Quad IF Receiver
Datasheet: AD6657EBZ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Quad IF Receiver Data Sheet AD6657 FEATURES FUNCTIONAL BLOCK DIAGRAM AVDD AGND DRVDD DRGND 11-bit, 200 MSPS output data rate per channel Integrated noise shaping requantizer (NSR) AD6657 Performance with NSR enabled DC0AB 14 11 VIN+A SNR: 75.5 dBFS in 40 MHz band to 70 MHz 185 MSPS PIPELINE NOISE SHAPING D0AB ADC REQUANTIZER VINA SNR: 73.7 dBFS in 60 MHz band to 70 MHz 185 MSPS PORT A VCMA Performance with NSR disabled 14 11 VIN+B NOISE SHAPING PIPELINE D10AB SNR: 66.5 dBFS to 70 MHz 185 MSPS REQUANTIZER ADC VINB SFDR: 83 dBc to 70 MHz 185 MSPS VCMB DC0CD Low power: 1.2 W 185 MSPS 14 11 VIN+C NOISE SHAPING PIPELINE D0CD REQUANTIZER 1.8 V analog supply operation ADC VINC PORT B 1.8 V LVDS (ANSI-644 levels) output VCMC 14 11 1-to-8 integer clock divider VIN+D NOISE SHAPING PIPELINE D10CD REQUANTIZER ADC VIND Internal ADC voltage reference VCMD 1.75 V p-p analog input range (programmable to 2.0 V p-p) MODE REFERENCE Differential analog inputs with 800 MHz bandwidth CLOCK SYNC DIVIDER 95 dB channel isolation/crosstalk PDWN Serial port control SERIAL PORT User-configurable built-in self-test (BIST) capability Energy-saving power-down modes SCLK SDIO CSB CLK+ CLK Figure 1. APPLICATIONS Communications PRODUCT HIGHLIGHTS Diversity radio and smart antenna (MIMO) systems 1. Four ADCs are contained in a small, space-saving, Multimode digital receivers (3G) 10 mm 10 mm 1.4 mm, 144-ball CSP BGA package. WCDMA, LTE, CDMA2000 2. Pin selectable noise shaping requantizer (NSR) function WiMAX, TD-SCDMA that allows for improved SNR within a reduced bandwidth I/Q demodulation systems of up to 60 MHz at 185 MSPS. General-purpose software radios 3. LVDS digital output interface configured for low cost FPGA families. 4. 230 mW per ADC core power consumption. 5. Operation from a single 1.8 V supply. 6. Standard serial port interface (SPI) that supports various product features and functions, such as data formatting (offset binary or twos complement), NSR, power-down, test modes, and voltage reference mode. 7. On-chip integer 1-to-8 input clock divider and multichip sync function to support a wide range of clocking schemes and multichannel subsystems. Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Fax: 781.461.3113 20092011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. DATA MULTIPLEXER AND LVDS DRIVERS 08557-001AD6657 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Power Dissipation and Standby Mode .................................... 20 Applications....................................................................................... 1 Channel/Chip Synchronization................................................ 20 Functional Block Diagram .............................................................. 1 Digital Outputs ........................................................................... 21 Product Highlights ........................................................................... 1 Timing ......................................................................................... 21 Revision History ............................................................................... 2 Noise Shaping Requantizer (NSR) ............................................... 22 General Description ......................................................................... 3 22% BW Mode (>40 MHz 184.32 MSPS)........................... 22 Specifications..................................................................................... 4 33% BW Mode (>60 MHz 184.32 MSPS)........................... 22 DC Specifications ......................................................................... 4 MODE Pin................................................................................... 23 AC Specifications.......................................................................... 5 Built-In Self-Test (BIST) and Output Test .................................. 24 Digital Specifications ................................................................... 6 Built-In Self-Test (BIST)............................................................ 24 Switching Specifications .............................................................. 7 Output Test Modes..................................................................... 24 Timing Specifications .................................................................. 8 Serial Port Interface (SPI).............................................................. 25 Absolute Maximum Ratings............................................................ 9 Configuration Using the SPI..................................................... 25 Thermal Characteristics .............................................................. 9 Hardware Interface..................................................................... 25 ESD Caution.................................................................................. 9 Memory Map .................................................................................. 26 Pin Configuration and Function Descriptions........................... 10 Reading the Memory Map Register Table............................... 26 Typical Performance Characteristics ........................................... 12 Memory Map Register Table..................................................... 27 Equivalent Circuits ......................................................................... 15 Memory Map Register Descriptions........................................ 29 Theory of Operation ...................................................................... 16 Applications Information .............................................................. 30 ADC Architecture ...................................................................... 16 Design Guidelines ...................................................................... 30 Analog Input Considerations.................................................... 16 Outline Dimensions....................................................................... 31 Clock Input Considerations...................................................... 18 Ordering Guide .......................................................................... 31 REVISION HISTORY 8/11Rev. A to Rev. B 7/10Rev. 0 to Rev. A Changes to Logic Input/Output (SDIO) Parameter Note, Changes to ADC Architecture Section........................................ 16 Table 3 ................................................................................................ 6 Changes to Figure 34 and Figure 35............................................. 18 Added Wake-Up Time (from Standby) Parameter, Table 4 and Changes to Timing Section and Data Clock Output (DCO) Section.............................................................................................. 21 Wake-Up Time (from Power Down) Parameter, Table 4............ 7 Changes to Figure 2.......................................................................... 8 Changes to 22% BW Mode (>40 MHz 184.32 MSPS) Section Changes to Table 11........................................................................ 21 and 33% BW Mode (>60 MHz 184.32 MSPS) Section ......... 22 Updated Outline Dimensions ....................................................... 31 Changed 0x0C to 0x79, Address 0x01, Table 13......................... 27 Changed DCO Output Delay (Global) to DCO Output Delay (Local), Address 0x17, Table 13.................................................... 28 Changes to Design Guidelines Section........................................ 30 10/09Revision 0: Initial Version Rev. B Page 2 of 32

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