AD8345ARE Analog Devices

140 MHz to 1000 MHz Quadrature Modulator AD8345 FEATURES FUNCTIONAL BLOCK DIAGRAM 140 MHz to 1000 MHz operating frequency AD8345 1 16 IBBP QBBP +2.5 dBm P1dB 800 MHz 155 dBm/Hz noise floor IBBN 2 15 QBBN 0.5 degree RMS phase error (IS95) 3 14 COM3 COM3 + 0.2 dB amplitude balance 4 13 COM3 Single 2.7 V to 5.5 V supply COM1 Pin-compatible with AD8346 and AD8349 5 12 LOIN VPS2 16-lead TSSOP EP package PHASE LOIP 6 11 VOUT SPLITTER APPLICATIONS 7 10 VPS1 COM2 Cellular communication systems BIAS ENBL 8 9 COM3 W-CDMA/CDMA/GSM/PCS/ISM transceivers Fixed broadband access systems LMDS/MMDS Figure 1. Wireless LAN Wireless local loop Digital TV/CATV modulators Single sideband upconverter PRODUCT DESCRIPTION APPLICATIONS The AD8345 is a silicon RFIC quadrature modulator, designed The AD8345 modulator can be used as the IF transmit for use from 140 MHz to 1000 MHz. Its excellent phase modulator in digital communication systems such as GSM and accuracy and amplitude balance enable the high performance PCS transceivers. It can also directly modulate an LO signal to direct modulation of an IF carrier. produce QPSK and various QAM formats for 900 MHz communication systems as well as digital TV and CATV The AD8345 accurately splits the external LO signal into two systems. quadrature components through the polyphase phase splitter network. The I and Q LO components are mixed with the Additionally, this quadrature modulator can be used with direct baseband I and Q differential input signals. Finally, the outputs digital synthesizers in hybrid phase-locked loops to generate signals over a wide frequency range with millihertz resolution. of the two mixers are combined in the output stage to provide a single-ended 50 drive at VOUT. The AD8345 modulator is supplied in a 16-lead TSSOP EP package. Its performance is specified over a 40C to +85C temperature range. This device is fabricated on Analog Devices advanced silicon bipolar process. Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Fax: 781.461.3113 2005 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. 00932-001AD8345 TABLE OF CONTENTS Features .............................................................................................. 1 Basic Connections .......................................................................... 12 Applications....................................................................................... 1 LO Drive...................................................................................... 12 Functional Block Diagram .............................................................. 1 LO Frequency Range ................................................................. 12 Product Description......................................................................... 1 Baseband I and Q Channel Drive ............................................ 13 Applications....................................................................................... 1 Reduction of LO Leakage.......................................................... 13 Revision History ............................................................................... 2 Single-Ended I and Q Drive...................................................... 13 Specifications..................................................................................... 3 RF Output.................................................................................... 14 Absolute Maximum Ratings............................................................ 4 Application with TxDAC......................................................... 14 ESD Caution.................................................................................. 4 Soldering Information ............................................................... 15 Pin Configuration and Function Descriptions............................. 5 Evaluation Board........................................................................ 15 Typical Performance Characteristics ............................................. 6 Characterization Setups................................................................. 17 Equivalent Circuits ......................................................................... 10 SSB Setup..................................................................................... 17 Circuit Description......................................................................... 11 Modulated Waveform Setup ..................................................... 18 Overview...................................................................................... 11 CDMA IS95................................................................................. 18 LO Interface................................................................................. 11 WCDMA 3GPP .......................................................................... 18 Differential Voltage-to-Current Converter............................. 11 GSM ............................................................................................. 18 Mixers .......................................................................................... 11 Outline Dimensions....................................................................... 19 Differential-to-Single-Ended Converter ................................. 11 Ordering Guide .......................................................................... 19 Bias ............................................................................................... 11 REVISION HISTORY 12/05Rev. A to Rev. B Updated Format..................................................................Universal Changes to Ordering Guide .......................................................... 19 4/05Rev. 0 to Rev. A Updated Format..................................................................Universal Change to Part Name .........................................................Universal Updated Outline Dimensions ....................................................... 19 Changes to Ordering Guide .......................................................... 19 7/01Revision 0: Initial Version Rev. B Page 2 of 20