700 MHz to 2700 MHz Quadrature Modulator Data Sheet AD8349 FEATURES FUNCTIONAL BLOCK DIAGRAM Output frequency range: 700 MHz to 2700 MHz AD8349 1 16 IBBP QBBP Modulation bandwidth: dc to 160 MHz (large signal BW) 1 dB output compression: 5.6 dBm 2140 MHz IBBN 2 15 QBBN Output disable function: output below 50 dBm in < 50 ns Noise floor: 156 dBm/Hz 3 14 COM1 COM3 Phase quadrature error: 0.3 degrees 2140 MHz COM1 4 13 COM3 Amplitude balance: 0.1 dB Single supply: 4.75 V to 5.5 V LOIN 5 12 VPS2 Pin compatible with AD8345/AD8346s PHASE 16-lead, exposed-paddle TSSOP package LOIP 6 SPLITTER 11 VOUT VPS1 7 10 COM3 APPLICATIONS BIAS Cellular/PCS communication systems infrastructure ENOP 8 9 COM2 WCDMA/CDMA2000/PCS/GSM/EDGE Wireless LAN/wireless local loop Figure 1. LMDS/broadband wireless access systems PRODUCT DESCRIPTION The AD8349 is a silicon, monolithic, RF quadrature modulator The AD8349 can be used as a direct-to-RF modulator in digital that is designed for use from 700 MHz to 2700 MHz. Its communication systems such as GSM, CDMA, and WCDMA excellent phase accuracy and amplitude balance enable high base stations, and QPSK or QAM broadband wireless access performance direct RF modulation for communication systems. transmitters. Its high dynamic range and high modulation accuracy also make it a perfect IF modulator in local multipoint The differential LO input signal is buffered, and then split into distribution systems (LMDS) using complex modulation an in-phase (I) signal and a quadrature-phase (Q) signal using a formats. polyphase phase splitter. These two LO signals are further buffered and then mixed with the corresponding I channel and The AD8349 is fabricated using Analog Devices advanced Q channel baseband signals in two Gilbert cell mixers. The complementary silicon bipolar process, and is available in a 16- mixers outputs are then summed together in the output lead, exposed-paddle TSSOP package. Its performance is amplifier. The output amplifier is designed to drive 50 loads. specified over a 40C to +85C temperature range. The RF output can be switched on and off within 50 ns by applying a control pulse to the ENOP pin. Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. 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All rights reserved. 03570-0-001AD8349 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Single-Ended LO Drive ............................................................. 17 Applications ....................................................................................... 1 RF Output .................................................................................... 17 Functional Block Diagram .............................................................. 1 Output Enable ............................................................................. 17 Product Description ......................................................................... 1 Baseband DAC Interface ........................................................... 18 Revision History ............................................................................... 2 AD9777 Interface ....................................................................... 18 Specif icat ions ..................................................................................... 3 Biasing and Filtering .................................................................. 18 Absolute Maximum Ratings ............................................................ 5 Reducing Undesired Sideband Leakage .................................. 19 ESD Caution .................................................................................. 5 Reduction of LO Feedthrough .................................................. 19 Pin Configuration and Function Descriptions ............................. 6 Sideband Suppression and LO Feedthrough vs. Temperature ................................................................................ 20 Equivalent Circuits ........................................................................... 7 Single Sideband Performance vs. Baseband Drive Level ...... 20 Typical Performance Characteristics ............................................. 8 Improving Third Harmonic Distortion .................................. 20 Circuit Description ......................................................................... 14 Applicat ions ..................................................................................... 21 O ver vie w ...................................................................................... 14 3GPP WCDMA Single-Carrier Application ........................... 21 LO Interface................................................................................. 14 WCDMA MultiCarrier Application ........................................ 21 V-to-I Converter ......................................................................... 14 GSM/EDGE Application ........................................................... 22 Mixers .......................................................................................... 14 Soldering Information ............................................................... 23 D-to-S Amplifier ......................................................................... 14 LO Generation Using PLLs ....................................................... 23 Bias Circuit .................................................................................. 14 Transmit DAC Options ............................................................. 23 Output Enable ............................................................................. 14 Evaluation Board ............................................................................ 24 Basic Connections .......................................................................... 15 Characterization Setups ................................................................. 26 Baseband I and Q Inputs ........................................................... 15 SSB Setup ..................................................................................... 26 Single-Ended Baseband Drive .................................................. 15 Outline Dimensions ....................................................................... 27 LO Input Drive Level ................................................................. 16 Ordering Guide .......................................................................... 27 Frequency Range ........................................................................ 16 LO Input Impedance Matching ................................................ 16 REVISION HISTORY 2/12Rev. A to Rev. B Added EPAD Note ............................................................................ 6 Changes to Ordering Guide .......................................................... 27 11/04Data Sheet Changed from Rev. 0 to Rev. A Changes to Figure 25 through Figure 30 ..................................... 11 Changes to Figure 37 through Figure 39 ..................................... 13 Change to WCDMA MultiCarrier Application section ............ 21 Change to Figure 60 and Figure 61 .............................................. 21 11/03Revision 0: Initial Version Rev. B Page 2 of 28