1 MHz to 2.7 GHz RF Gain Block Data Sheet AD8353 FEATURES FUNCTIONAL BLOCK DIAGRAM Fixed gain of 20 dB Operational frequency of 1 MHz to 2.7 GHz BIAS AND VREF VPOS Linear output power up to 9 dBm Input/output internally matched to 50 RFIN RFOUT Temperature and power supply stable Noise figure: 5.3 dB Power supply: 3 V or 5 V COM1 COM2 AD8353 APPLICATIONS Figure 1. VCO buffers General Tx/Rx amplification Power amplifier predrivers Low power antenna drivers GENERAL DESCRIPTION The AD8353 is a broadband, fixed-gain, linear amplifier that The noise figure is 5.3 dB at 900 MHz. The reverse isolation operates at frequencies from 1 MHz up to 2.7 GHz. It is (S12) is 36 dB at 900 MHz and 30 dB at 2.7 GHz. intended for use in a wide variety of wireless devices, including The AD8353 can also operate with a 5 V power supply in cellular, broadband, CATV, and LMDS/MMDS applications. which case, no external inductor is required. Under these By taking advantage of Analog Devices, Inc., high performance, conditions, the AD8353 delivers 8 dBm with 20 dB of gain at complementary Si bipolar process, these gain blocks provide 900 MHz. The dc supply current is 42 mA. At 900 MHz, the excellent stability over process, temperature, and power supply. OIP3 is greater than 22 dBm and is 19 dBm at 2.7 GHz. The noise This amplifier is single-ended and internally matched to 50 figure is 5.6 dB at 900 MHz. The reverse isolation (S12) is 35 dB. with a return loss of greater than 10 dB over the full operating The AD8353 is fabricated on Analog Devices proprietary, high frequency range. performance, 25 GHz, Si complementary, bipolar IC process. The AD8353 provides linear output power of 9 dBm with 20 dB The AD8353 is available in a chip scale package that uses an of gain at 900 MHz when biased at 3 V and an external RF exposed paddle for excellent thermal impedance and low choke is connected between the power supply and the output impedance electrical connection to ground. It operates over a pin. The dc supply current is 42 mA. At 900 MHz, the output 40C to +85C temperature range, and an evaluation board is third-order intercept (OIP3) is greater than 23 dBm and is also available. 19 dBm at 2.7 GHz. Rev. F Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. 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Technical Support www.analog.com 02721-001AD8353 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................7 Applications ....................................................................................... 1 Theory of Operation ...................................................................... 13 Functional Block Diagram .............................................................. 1 Basic Connections ...................................................................... 13 General Description ......................................................................... 1 Applications Information .............................................................. 14 Revision History ............................................................................... 2 Low Frequency Applications Below 100 MHz ........................... 14 Specifications ..................................................................................... 3 Evaluation Board ............................................................................ 15 Absolute Maximum Ratings ............................................................ 5 Outline Dimensions ....................................................................... 16 ESD Caution .................................................................................. 5 Ordering Guide .......................................................................... 16 Pin Configuration and Function Descriptions ............................. 6 REVISION HISTORY 2/2017Rev. E to Rev. F 8/2005Rev. 0 to Rev. A Changed CP-8-1 to CP-8-23 ........................................ Throughout Updated Format .................................................................. Universal Changes to Figure 2 .......................................................................... 6 Changes to Product Title .................................................................. 1 Changes to Ordering Guide .......................................................... 16 Changes to Features, Figure 1, and General Description ............. 1 Updated Outline Dimensions ....................................................... 16 Changes to Table 1 ............................................................................. 3 Changes to Table 2 ............................................................................. 4 12/2013Rev. D to Rev. E Changes to Figure 2 and Table 4 ...................................................... 6 Changes to Figure 35 ...................................................................... 12 Changes to Figure 3 caption and Figure 6 caption........................ 7 Changes to Figure 17 caption and Figure 20 caption ................... 9 9/2013Rev. C to Rev. D Changes to Basic Connections Section ....................................... 13 Changes to Figure 2 .......................................................................... 6 Added Low Frequency Applications Below 100 MHz Section ....... 14 Added EPAD Row, Table 4 .............................................................. 6 Changes to Table 5 .......................................................................... 15 Added Figure 35 Renumbered Sequentially .............................. 12 Changes to Ordering Guide .......................................................... 16 Added Exposed Pad Notation to Outline Dimensions ............. 16 Updated Outline Dimensions ....................................................... 16 3/2009Rev. B to Rev. C 2/2002Revision 0: Initial Version Changes to Lead Temperature (Soldering, 60 sec) Parameter, Table 3 ................................................................................................ 5 Changes to Ordering Guide .......................................................... 16 12/2005Rev. A to Rev. B Changes to Table 1 ............................................................................ 3 Changes to Table 2 ............................................................................ 4 Changes to Figure 16 ........................................................................ 9 Changes to Figure 32 ...................................................................... 11 Moved Figure 39 to Page 15 Renumbered Sequentially ........... 15 Changes to Ordering Guide .......................................................... 16 Rev. F Page 2 of 16