Programmable 360 Inclinometer Data Sheet ADIS16203 ADIS16203 provides factory-calibrated, sensor-to-digital incline- FEATURES angle data in a convenient format that can be accessed using a 0 to 360 Inclinometer serial peripheral interface (SPI). The SPI interface provides access 180 output format option to multiple measurements: 360 linear inclination angles, 180 14-bit digital inclination outputs linear incline angles, temperature, power supply, and one auxiliary Linear output, 0.025 resolution analog input. Easy access to calibrated digital sensor data provides 12-bit digital temperature sensor output developers with a system-ready device, reducing development Digitally controlled bias calibration time, cost, and program risk. Digitally controlled sample rate Digitally controlled filtering Unique characteristics of the end system are accommodated Digitally controlled direction/orientation easily through several built-in features, such as a single-command Dual alarm settings with rate/threshold limits offset calibration, along with convenient sample rate and band- Auxiliary digital I/O width control. Digitally activated self-test Digitally activated low power mode The ADIS16203 offers the following embedded features that SPI-compatible serial interface eliminate the need for external circuitry and provide a simplified Auxiliary 12-bit ADC input and DAC output system interface: Single-supply operation: 3.0 V to 3.6 V Configurable alarm function 3500 g powered shock survivability Auxiliary 12-bit analog-to-digital converter (ADC) APPLICATIONS Auxiliary 12-bit digital-to-analog converter (DAC) Tilt sensing, inclinometers Configurable digital I/O port Platform control, stabilization, and leveling Digital self-test function Motion/position measurement Monitor/alarm devices (security, medical, safety) The ADIS16203 offers two power management features for Robotics managing system-level power dissipation: low power mode and GENERAL DESCRIPTION a configurable shutdown feature. The ADIS16203 is a complete incline-angle measurement system in The ADIS16203 is available in a 9.2 mm 9.2 mm 3.9 mm a single compact package enabled by the Analog Devices, Inc., laminate-based land grid array (LGA) package with a temper- iSensor integration. By enhancing the Analog Devices iMEMS ature range of 40C to +125C. sensor technology with an embedded signal processing solution, the FUNCTIONAL BLOCK DIAGRAM AUX AUX ADC DAC VREF ADIS16203 TEMPERATURE SENSOR CS SIGNAL CALIBRATION INERTIAL CONDITIONING AND MEMS AND DIGITAL SCLK SENSOR SPI CONVERSION PROCESSING PORT DIN DIGITAL SELF-TEST CONTROL DOUT VDD POWER AUXILIARY ALARMS MANAGEMENT I/O COM AUX COM RST DIO0 DIO1 Figure 1. Rev. C Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20062019 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. 06108-001ADIS16203 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Alarms .......................................................................................... 15 Applications ....................................................................................... 1 Sample Period Control .............................................................. 18 General Description ......................................................................... 1 Filtering Control ......................................................................... 18 Functional Block Diagram .............................................................. 1 Power-Down Control ................................................................ 19 Revision History ............................................................................... 2 Status Feedback........................................................................... 20 Specifications ..................................................................................... 3 COMMAND Control ................................................................ 20 Timing Specifications .................................................................. 5 Miscellaneous Control Register................................................ 21 Timing Diagrams .......................................................................... 5 Peripherals ....................................................................................... 22 Absolute Maximum Ratings ............................................................ 6 Auxiliary ADC Function ........................................................... 22 ESD Caution .................................................................................. 6 Auxiliary DAC Function ........................................................... 22 Pin Configuration and Function Descriptions ............................. 7 General-Purpose I/O Control .................................................. 23 Typical Performace Characteristics ................................................ 8 Applications Information .............................................................. 24 Theory of Operation ...................................................................... 11 Hardware Considerations ......................................................... 24 Output Response ........................................................................ 11 Grounding and Board Layout Recommendations ................. 24 Temperature Sensor ................................................................... 11 Self-Test Tips ............................................................................... 24 Basic Operation ............................................................................... 12 Band Gap Reference ................................................................... 24 Serial Peripheral Interface (SPI) ............................................... 12 Power Supply Considerations ................................................... 25 Data Output Register Access ..................................................... 13 Assembly ...................................................................................... 25 Programming and Control ............................................................ 14 Example Pad Layout ................................................................... 25 Control Register Overview ........................................................ 14 X-Ray Sensitivity ........................................................................ 25 Control Register Access ............................................................. 14 Outline Dimensions ....................................................................... 26 Control Register Details................................................................. 15 Ordering Guide .......................................................................... 26 Calibration ................................................................................... 15 Calibration Register Definition ................................................ 15 REVISION HISTORY 3/2019Rev. B to Rev. C Added Power Supply Considerations Section, Power-On-Reset Added Endnote 2 to Inclinometer, Relative Accuracy Parameter, Function Section, Transient Current from VDD Ramp Rate Table 1 Renumbered Sequentially ................................................. 2 Section, and Assembly Section ...................................................... 25 Added X-Ray Sensitivity Section .................................................. 25 Changes to Ordering Guide .......................................................... 26 1/2010Rev. 0 to Rev. A Changes to Figure 25 ...................................................................... 11 7/2018Rev. A to Rev. B Changes to Table 19 ........................................................................ 20 Changed Applications Section to Applications Information Changes to Table 23 ........................................................................ 21 Section .............................................................................................. 24 Updated Outline Dimensions ........................................................ 26 Deleted Power-On Reset Operation Section, Figure 33, 8/2006Revision 0: Initial Version Second-Level Assembly Section, Figure 34, and Table 24 Renumbered Sequentially .............................................................. 25 Rev. C Page 2 of 26