High Accuracy, Dual-Axis Digital Inclinometer and Accelerometer Data Sheet ADIS16209 FEATURES FUNCTIONAL BLOCK DIAGRAM AUX AUX ADC Dual-mode inclinometer system DAC VREF Dual-axis, horizontal operation, 90 ADIS16209 Single-axis, vertical operation, 180 TEMPERATURE SENSOR High accuracy, 0.1 Digital inclination data, 0.025 resolution DUAL-AXIS CS SIGNAL CALIBRATION ACCELEROMETER Digital acceleration data, 0.244 mg resolution CONDITIONING AND AND DIGITAL SCLK 1.7 g accelerometer measurement range CONVERSION PROCESSING SPI PORT Digital temperature sensor output DIN Digitally controlled bias calibration DIGITAL DOUT SELF-TEST CONTROL Digitally controlled sample rate Digitally controlled frequency response VDD Dual alarm settings with rate/threshold limits POWER AUXILIARY ALARMS MANAGEMENT I/O Auxiliary digital I/O Digitally activated self-test GND Digitally activated low power mode SPI-compatible serial interface RST DIO1 DIO2 Auxiliary 12-bit ADC input and DAC output Figure 1. Single-supply operation: 3.0 V to 3.6 V 3500 g powered shock survivability APPLICATIONS Platform control, stabilization, and alignment Tilt sensing, inclinometers, leveling Motion/position measurement Monitor/alarm devices (security, medical, safety) Navigation GENERAL DESCRIPTION The ADIS16209 is a high accuracy, digital inclinometer that Configurable operating parameters include sample rate, accommodates both single-axis (180) and dual-axis (90) power management, digital filtering, auxiliary analog and operation. The standard supply voltage (3.3 V) and serial digital output, offset/null adjustment, and self-test for sensor peripheral interface (SPI) enable simple integration into most mechanical structure. industrial system designs. A simple internal register structure The ADIS16209 is available in a 9.2 mm 9.2 mm 3.9 mm handles all output data and configuration features. This LGA package that operates over a temperature range of 40C includes access to the following output data: calibrated to +125C. It can be attached using standard RoHS-compliant acceleration, accurate incline angles, power supply, internal solder reflow processes. temperature, auxiliary analog and digital input signals, diagnostic error flags, and programmable alarm conditions. Rev. H Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20082019 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. 07096-001ADIS16209 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Introduction ................................................................................ 12 Applications ....................................................................................... 1 Register Structure ....................................................................... 12 Functional Block Diagram .............................................................. 1 SPI................................................................................................. 12 General Description ......................................................................... 1 Reading Sensor Data .................................................................. 12 Revision History ............................................................................... 2 Device Configuration ................................................................ 12 Specifications ..................................................................................... 4 Output Data Registers................................................................ 15 Timing Specifications .................................................................. 6 Operation Control Registers ..................................................... 17 Timing Diagrams .......................................................................... 6 Calibration Registers .................................................................. 20 Absolute Maximum Ratings ............................................................ 7 Alarm Registers .......................................................................... 20 Thermal Resistance ...................................................................... 7 Applications Information .............................................................. 22 ESD Caution .................................................................................. 7 Power Supply Considerations ................................................... 22 Pin Configuration and Function Descriptions ............................. 8 Assembly ...................................................................................... 22 Recommended Pad Geometry .................................................... 8 Interface Board ........................................................................... 23 Typical Performance Characteristics ............................................. 9 X-Ray Sensitivity ........................................................................ 23 Theory of Operation ...................................................................... 11 Outline Dimensions ....................................................................... 24 Basic Operation............................................................................... 12 Ordering Guide .......................................................................... 24 REVISION HISTORY 3/2019Rev. G to Rev. H 5/2017Rev. E to Rev. F Changes to Figure 3 and Figure 4 .................................................... 5 Added Endnote 1, Table 1 Renumbered Sequentially ................ 5 Deleted Figure 20 Renumbered Sequentially............................. 11 Change to Basic Operation Section ............................................. 11 Changes to Basic Operation Section ............................................ 12 Added Introduction Section, Register Structure Section, 1/2015Rev. D to Rev. E Figure 20, SPI Section, Figure 21, Reading Sensor Data Section, Changes to Power Supply Considerations Section and Figure 22, Figure 23, and Device Configuration Section .......... 12 Assembly Section ............................................................................ 19 Added Table 6 and Table 7 Renumbered Sequentially ............. 12 Deleted VDD Ramp Rate Requirements Section and Transient Added Figure 24, Memory Structure Section, Figure 25, and Current Demand from ADIS16209 Section ............................... 19 Added Power-On Reset Function Section .................................. 19 Figure 26 .......................................................................................... 13 Moved Table 8 ................................................................................. 14 Changes to Figure 23 ...................................................................... 20 Changes to Global Commands Section ....................................... 19 Change to the Power Supply Considerations Section ................ 22 6/2014Rev. C to Rev. D Added X-Ray Sensitivity Section .................................................. 23 Changes to Table 2 ............................................................................. 5 Changes to Ordering Guide .......................................................... 24 Changes to Table 26 and Self-Test Section .................................. 15 Changes to Status Section .............................................................. 18 8/2018Rev. F to Rev. G Added Power Supply Considerations Section ............................ 19 Change to Note 5, Table 1 ................................................................ 4 Changes to Accelerometers Section ............................................. 12 7/2012Rev. B to Rev. C Change to Digital Filtering Section .............................................. 14 Changes to Endnote 5 in Table 1 ..................................................... 4 Changes to Global Commands Section ....................................... 16 Changed Digital Input/Output Voltage to GND Maximum Changes to Assembly Section ....................................................... 19 Rating from 5.5 V to 5.3 V ............................................................... 6 Added Figure 23 Renumbered Sequentially .............................. 19 Added 0x40 to 0x49 and 0x4A Addresses to Table 6 ................. 11 Changes to Output Data Registers Section ................................ 12 Changes to Digital Filtering Section ............................................ 14 Changes to Self-Test Section ......................................................... 15 Added Applications Information Section ................................... 18 Updated Outline Dimensions ....................................................... 19 Rev. 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