Low Power, Programmable Impact Sensor and Recorder Data Sheet ADIS16240 FEATURES FUNCTIONAL BLOCK DIAGRAM Digital triple-axis accelerometer, 19 g AN VDD Programmable event recorder POWER ADIS16240 Internal and external trigger inputs MANAGEMENT Automatic event data storage in nonvolatile flash TRIPLE-AXIS CS Low power operation XA MEMS SCLK YA Sleep mode current: 100 A ACCELEROMETER DIGITAL ANALOG- DIN CONTROL TO-DIGITAL ZA DOUT Continuous sampling current: 1 mA, 1 kSPS AND CONVERSION SPI AND Wake-up and record function RST INTERFACE PROCESSING DIO1 TEMPERATURE External trigger input and SPI trigger command SENSOR DIO2 Peak acceleration sample-and-hold CMP1 ALARM EVENT Peak XYZ sum-of-squares output DETECTION CAPTURE 1600 Hz (X, Y) and 550 Hz (Z) sensor bandwidth BUFFER EVENT TRIGGER CMP2 Digitally controlled sample rate, up to 4096 SPS Programmable alarms for condition monitoring Figure 1. Programmable digital input/output lines Data-ready output and alarm indicator output Real-time clock Digitally activated self-test Embedded temperature sensor Programmable power management SPI-compatible serial interface Auxiliary 10-bit ADC input Two analog trigger inputs with programmable threshold Single-supply operation: 2.4 V to 3.6 V >4000 g powered shock survivability APPLICATIONS Crash or impact detection Condition monitoring of valuable goods Safety, shut-off sensing Impact event recording Security sensing and tamper detection GENERAL DESCRIPTION The programmable event recorder offers two trigger modes. The The ADIS16240 is a fully integrated digital shock detection and internal mode monitors continuous sampled data and triggers the recorder system. It combines industry-leading iMEMS technology capture, based on the user-defined threshold. The external mode with a signal processing solution that optimizes dynamic perfor- uses the two comparator inputs and a user-defined threshold to mance for low power applications. The triple-axis sensing element trigger the event captures. This function also provides user configu- enables shock measurement in all directions, eliminating the need ration controls for capture length, pretrigger data, and data storage. for additional sensors and complex mechanical structures for Each event is stored with a header that captures temperature, power many applications. The digital serial peripheral interface (SPI) supply, and time. Several power management features, including uses four wires and is compatible with most processor platforms. sleep mode and a wake-up function, enable power optimization The SPI interface provides access to sensor data and a set of config- with respect to specific mechanical system requirements. uration registers that control such operational parameters as offset bias correction, sample rate, sleep mode, peak detection, The ADIS16240 is available in a 12 mm 12 mm laminate-based and event capture. ball grid array (BGA) that meets IPC/JEDEC standards for Pb-free solder reflow processing (J-STD-020C and J-STD-033). Rev. C Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20092012 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Technical Support www.analog.com 08133-001ADIS16240 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 User Interface .................................................................................8 Applications ....................................................................................... 1 Capture ...........................................................................................8 Functional Block Diagram .............................................................. 1 Basic Operation .................................................................................9 General Description ......................................................................... 1 Memory Map .............................................................................. 10 Revision History ............................................................................... 2 Output Data Registers................................................................ 11 Specifications ..................................................................................... 3 Event Recorder............................................................................ 12 Timing Specifications .................................................................. 4 Operational Control ................................................................... 14 Absolute Maximum Ratings ............................................................ 5 Applications Information .............................................................. 17 ESD Caution .................................................................................. 5 Assembly ...................................................................................... 17 Pin Configuration and Function Descriptions ............................. 6 Interface Printed Circuit Board (PCB) .................................... 17 Typical Performance Characteristics ............................................. 7 Outline Dimensions ....................................................................... 18 Theory of Operation ........................................................................ 8 Ordering Guide .......................................................................... 18 Sensing Element ........................................................................... 8 Data Sampling and Processing ................................................... 8 REVISION HISTORY 12/12Rev. B to Rev. C Changes to Features Section............................................................ 1 Removed Bias Voltage Sensitivity from Table 1............................ 3 Changes to Table 7 .......................................................................... 10 Changes to Event Recorder Section ............................................. 12 Added Flash Memory Endurance Management Section .......... 16 Updated Outline Dimensions ....................................................... 18 Changes to Ordering Guide .......................................................... 18 8/12Rev. A to Rev. B Updated Outline Dimensions ........................................................ 17 10/11Rev. 0 to Rev. A Added Applications Information Section, Figure 23, Figure 24, Figure 25, Renumbered Sequentially ........................................... 16 Updated Outline Dimensions ....................................................... 18 Changes to Ordering Guide .......................................................... 18 4/09Revision 0: Initial Version Rev. C Page 2 of 20