Isolated, Dual Channel, RS-232 Line Driver/Receiver Data Sheet ADM3252E FEATURES FUNCTIONAL BLOCK DIAGRAM 10F C1 C3 C2 C4 2.5 kV fully isolated (power and data) RS-232 transceiver 0.1F 0.1F 0.1F 0.1F 16V 10V 16V 16V 0.1F isoPower integrated, isolated dc-to-dc converter Operational from single 3.3 V or 5 V supply 460 kbps data rate C1+ C1 V+ V C2+ C2 V ISO 2 Tx and 2 Rx channels ADM3252E VOLTAGE VOLTAGE DOUBLER INVERTER Meets EIA/TIA-232E specifications ESD protection to IEC 61000-4-2 on R and T pins V INx OUTx CC RECT REG OSC Contact discharge: 8 kV Air gap discharge: 15 kV R DECODE ENCODE R R * OUT1 IN1 0.1 F charge pump capacitors T T High common-mode transient immunity: >25 kV/s IN1 ENCODE DECODE T OUT1 Safety and regulatory approvals (pending) R DECODE ENCODE R R * OUT2 IN2 UL recognition 2500 V rms for 1 minute per UL 1577 T T IN2 ENCODE DECODE T OUT2 VDE certificate of conformity IEC 60747-5-2 (VDE 0884, Part 2) GND GND ISO VIORM = 560 V peak *INTERNAL 5k PULL-DOWN RESISTOR ON THE RS-232 INPUTS. CSA Component Acceptance Notice 5A Figure 1. Operating temperature range: 40C to +85C 44-ball chip scale package ball grid array (CSP BGA) APPLICATIONS Isolated RS-232 interface High noise data communications Industrial communications Industrial/telecommunications diagnostic ports Medical equipment isoPower technology in the ADM3252E uses high frequency GENERAL DESCRIPTION switching elements to transfer power through its transformer. The ADM3252E is a high speed, 2.5 kV, fully isolated, dual- Special care must be taken during printed circuit board (PCB) channel RS-232/V.28 transceiver device that is operational from layout to meet emissions standards. Refer to the AN-0971 a single 3.3 V or 5 V power supply. Because of high ESD protection Application Note, Recommendations for Control of Radiated on the RIN1, RIN2, TOUT1, and TOUT2 pins, the ADM3252E is ideally Emissions with isoPower Devices, for details on board layout suited for operation in electrically harsh environments or where considerations. RS-232 cables are frequently plugged and unplugged. The ADM3252E conforms to the EIA/TIA-232E and ITU-T V.28 The ADM3252E provides four independent isolation channels specifications and operates at data rates of up to 460 kbps. Four using the integrated and isolated power of isoPower. There is external 0.1 F charge pump capacitors are used for the voltage no requirement to use a separate isolated dc-to-dc converter. Chip doubler/inverter, permitting operation from a single 3.3 V or 5 V scale transformer iCoupler technology from Analog Devices, Inc., supply. The ADM3252E is available in a 44-ball, chip scale is used for both the isolation of the logic signals and the integrated package ball grid array (CSP BGA) and is specified over the dc-to-dc converter. The result is a total isolation solution. 40C to +85C temperature range. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20122013 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. 10F 0.1F 10515-001ADM3252E Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Charge Pump Voltage Converter ............................................. 11 Applications ....................................................................................... 1 3.3 V Logic to EIA/TIA-232E Transmitter ............................. 11 Functional Block Diagram .............................................................. 1 EIA/TIA-232E to 3.3 V Logic Receiver ................................... 11 General Description ......................................................................... 1 High Baud Rate ........................................................................... 11 Revision History ............................................................................... 2 Applications Information .............................................................. 12 Specifications ..................................................................................... 3 PCB Layout ................................................................................. 12 Package Characteristics ............................................................... 4 Start-Up Behavior....................................................................... 12 Regulatory Information (Pending) ............................................ 4 DC Correctness and Magnetic Field Immunity ..................... 13 Insulation and Safety-Related Specifications ............................ 5 Power Considerations ................................................................ 13 Absolute Maximum Ratings ....................................................... 6 Thermal Analysis ....................................................................... 14 ESD Caution .................................................................................. 6 Insulation Lifetime ..................................................................... 14 Pin Configuration and Function Descriptions ............................. 7 Packaging and Ordering Information ......................................... 15 Typical Performance Characteristics ............................................. 8 Outline Dimensions ................................................................... 15 Theory of Operation ...................................................................... 10 Ordering Guide .......................................................................... 15 Isolation of Power and Data ...................................................... 10 REVISION HISTORY 1/13Rev. 0 to Rev. A Changes to Features Section............................................................ 1 Changes to Figure 20 ...................................................................... 12 4/12Revision 0: Initial Version Rev. A Page 2 of 16