8-Bit, High Speed, Multiplying D/A Converter Data Sheet DAC08 Direct interface to all popular logic families with full noise FEATURES immunity is provided by the high swing, adjustable threshold Fast settling output current: 85 ns logic input. Full-scale current prematched to 1 LSB Direct interface to TTL, CMOS, ECL, HTL, PMOS High voltage compliance complementary current outputs are Nonlinearity to 0.1% maximum over temperature range provided, increasing versatility and enabling differential operation High output impedance and compliance: 10 V to +18 V to effectively double the peak-to-peak output swing. In many Complementary current outputs applications, the outputs can be directly converted to voltage Wide range multiplying capability: 1 MHz bandwidth without the need for an external op amp. All DAC08 series models Low FS current drift: 10 ppm/C guarantee full 8-bit monotonicity, and nonlinearities as tight as Wide power supply range: 4.5 V to 18 V 0.1% over the entire operating temperature range are available. Low power consumption: 33 mW at 5 V Device performance is essentially unchanged over the 4.5 V to Low cost 18 V power supply range, with 33 mW power consumption attainable at 5 V supplies. GENERAL DESCRIPTION The compact size and low power consumption make the DAC08 The DAC08 series of 8-bit monolithic digital-to-analog convert- attractive for portable and military/aerospace applications ers provide very high speed performance coupled with low cost devices processed to MIL-STD-883, Level B are available. and outstanding applications flexibility. DAC08 applications include 8-bit, 1 s A/D converters, servo Advanced circuit design achieves 85 ns settling times with very motor and pen drivers, waveform generators, audio encoders low glitch energy and at low power consumption. Monotonic and attenuators, analog meter drivers, programmable power multiplying performance is attained over a wide 20 to 1 reference supplies, LCD display drivers, high speed modems, and other current range. Matching to within 1 LSB between reference and applications where low cost, high speed, and complete full-scale currents eliminates the need for full-scale trimming in input/output versatility are required. most applications. FUNCTIONAL BLOCK DIAGRAM (MSB) (LSB) V+ V B2 B3 B4 B5 B6 B7 LC B1 B8 13 1 5 6 7 8 9 10 11 12 DAC08 I OUT BIAS 4 NETWORK 2 CURRENT 14 SWITCHES I OUT V (+) REF 15 V () REF REFERENCE AMPLIFIER 16 3 COMP V Figure 1. Rev. D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20022016 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Technical Support www.analog.com 00268-C-001DAC08 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Application Information ................................................................ 14 General Description ......................................................................... 1 Reference Amplifier Setup ........................................................ 14 Functional Block Diagram .............................................................. 1 Reference Amplifier Compensation for Multiplying Applications ................................................................................ 14 Revision History ............................................................................... 2 Logic Inputs................................................................................. 14 Specif icat ions ..................................................................................... 3 Analog Output Currents ........................................................... 14 Electrical Characteristics ............................................................. 3 Power Supplies ............................................................................ 15 Typical Electrical Characteristics ............................................... 4 Temperature Performance......................................................... 15 Absolute Maximum Ratings ............................................................ 5 Multiplying Operation ............................................................... 15 Thermal Resistance ...................................................................... 5 Settling Time ............................................................................... 15 ESD Caution .................................................................................. 5 Analog Devices Current Output DACs ....................................... 17 Pin Configuration and Function Descriptions ............................. 6 Outline Dimensions ....................................................................... 18 Test and Burn-In Circuits ................................................................ 7 Ordering Guide .......................................................................... 19 Typical Performance Characteristics ............................................. 8 Basic Connections .......................................................................... 11 REVISION HISTORY 3/16Rev. C to Rev. D 2/02Rev. A to Rev. B Added Thermal Resistance Section ............................................... 5 Edits to Specifications ....................................................................... 2 Changes to Table 4 ............................................................................ 5 Edits to Absolute Maximum Ratings .............................................. 3 Edits to Ordering Guide ................................................................... 3 Change to Figure 29 ....................................................................... 12 Updated Outline Dimensions ....................................................... 18 Edits to Wafer Test Limits ................................................................ 5 Changes to Ordering Guide .......................................................... 10 Edit to Figure 13 ................................................................................ 8 Edits to Figures 14 and 15 ................................................................ 9 11/04Rev. B to Rev. C Changed SO to SOIC ......................................................... Universal Removed DIE ...................................................................... Universal Changes to Figure 30, Figure 31, Figure 32 ................................. 12 Change to Figure 33 ....................................................................... 15 Added Table 4 .................................................................................. 16 Updated Outline Dimensions ....................................................... 17 Changes to Ordering Guide .......................................................... 18 Rev. D Page 2 of 21