LTM8001 36V , 5A Module IN Regulator with 5-Output Configurable LDO Array FEATURES DESCRIPTION n Complete Step-Down Switch Mode Power Supply The LTM 8001 is a 36V , 5A step-down Module regu- IN with Configurable Array of Five LDOs lator with a 5-output configurable LDO array. Operating n Step-Down Switching Power Supply over an input voltage range of 6V to 36V, the LTM8001 n Adjustable 10% Accurate Output Current Limit buck regulator supports an output voltage range of 1.2V n Constant-Current, Constant-Voltage Operation to 24V. Following the buck regulator is an array of five n Wide Input Voltage Range: 6V to 36V 1.1A linear regulators whose outputs may be connected n 1.2V to 24V Output Voltage in parallel to accommodate a wide variety of load combi- n Configurable Output LDO Array nations. Three of these LDOs are tied to the output of the n Five 1.1A Parallelable Outputs buck regulator, while the other two are tied together to an n Outputs Adjustable from 0V to 24V undedicated input. n Low Output Noise: 90V (100Hz to 1MHz) RMS The low profile package (3.42mm) enables utilization of n 15mm 15mm 3.42mm Surface Mount unused space on the bottom of PC boards for high density BGAPackage point of load regulation. The LTM8001 is packaged in a thermally enhanced, compact (15mm 15mm) and low profile (3.42mm) overmolded ball grid array (BGA) pack- APPLICATIONS age suitable for automated assembly by standard surface n FPGA, DSP, ASIC and Microprocessor Supplies mount equipment. The LTM8001 is available with SnPb n Servers and Storage Devices (BGA) or RoHS compliant terminal finish. n RF Transceivers All registered trademarks and trademarks are the property of their respective owners. Protected by U.S. patents, including 7199560, 7321203. TYPICAL APPLICATION 5A Output DC/DC Module Converter 1.8V V IN45 V OUT0 1A V 1.2V IN V V IN0 OUT1 6V TO 36V LDO 1 1A 10F SET1 510k 1.1V RUN V OUT2 1.5A LDO 2 BIAS123 STEP-DOWN SET2 SWITCHING 3.3V BIAS45 LTM8001 V OUT3 REGULATOR COMP LDO 3 SET3 SS 0.9V V OUT4 V 1.5A LDO 4 REF SET4 ILIM V + SYNC OUT5 LDO 5 GND RT FBO SET5 4.7F 4.7F 2.2F 470F 100F 45.3k 54.9k 121k 118k 19.6k 8001 TA01 350kHz Rev. F 1 Document Feedback For more information www.analog.comLTM8001 ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) V ...........................................................................40V TOP VIEW IN0 V SET4 V SET3 SET2 V OUT4 OUT3 OUT2 V , BIAS45 ...........................................................25V IN45 11 BIAS123 ....................................................................25V V OUT5 V OUT1 10 FB0, RT, COMP, ILIM, V .........................................3V REF SET5 9 SET1 V .....................................................................25V OUT0-5 V BIAS45 REF 8 ILIM RUN, SYNC, SS ...........................................................6V BIAS123 SYNC 7 RT V SET1-5 (Relative to V , Respectively) ............0.3V IN45 OUT1-5 GND BANK 3 6 COMP Current Into SET1-5 ............................................. 10mA BANK 2 5 FBO Current Into RUN Pin ............................................100A SS V OUT0 4 RUN BANK 4 Maximum Junction Temperature (Notes 2, 3) ....... 125C 3 Peak Solder Reflow Body Temperature ................. 245C V IN0 2 BANK 1 Storage Temperature.............................. 55C to 125C 1 A B C D E F G H J K L BGA PACKAGE 121 PADS (15mm 15mm 3.42mm) T = 125C, = 16.1C/W, = 5.99C/W, = 13.4C/W, = 4.98C/W JMAX JA JCbottom JCtop JB VALUES DETERMINED PER JESD 51-9, 51-12 WEIGHT = 1.8 GRAMS ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2) LTM8001EY PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 40C to 125C LTM8001IY PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 40C to 125C LTM8001IY SnPb (63/37) LTM8001Y e0 BGA 3 40C to 125C LTM8001MPY PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 55C to 125C LTM8001MPY SnPb (63/37) LTM8001Y e0 BGA 3 55C to 125C Contact the factory for parts specified with wider operating temperature ranges. Recommended LGA and BGA PCB Assembly and *Pad or ball finish code is per IPC/JEDEC J-STD-609. Manufacturing Procedures Device temperature grade is indicated by a label on the shipping container. LGA and BGA Package and Tray Drawings Rev. F 2 For more information www.analog.com