DS1624+ Analog Devices

DS1624 Digital Thermometer and Memory General Description Benefits and Features The DS1624 consists of two separate functional units: a Reduces Component Count with Integrated 2 2 256-byte nonvolatile E memory and a direct-to-digital Temperature Sensor and Nonvolatile E Memory temperature sensor. Measures Temperatures from -55C to +125C in 0.0625C Increments 2 The nonvolatile memory is made up of 256 bytes of E 0.5C Accuracy from 0C to 70C memory. This memory can be used to store any type of 2 256 Bytes of E Memory for Storing Information information the user wishes. These memory locations are Such as Frequency Compensation Coefficients accessed through the 2-wire serial bus. No External Components The direct-to-digital temperature sensor allows the Easy-to-Use 2-Wire Serial Interface DS1624 to measure the ambient temperature and report Temperature is Read as a 12-Bit Value the temperature in a 12-bit word with 0.0625C resolu- (2-Byte Transfer) tion. The temperature sensor and its related registers are Available in 8-Pin SO and DIP Packages accessed through the 2-wire serial interface. Figure 1 shows a block diagram of the DS1624. Ordering Information appears at end of data sheet. VDD STATUS REGISTER AND SCL CONTROL LOGIC SDA A0 TEMPERATURE ADDRESS AND SENSOR I/O CONTROL A1 A2 EEPROM MEMORY GND (256 BYTES) DS1624 Figure 1. Block Diagram 19-6288 Rev 5 8/15DS1624 Digital Thermometer and Memory Absolute Maximum Ratings Voltage Range on Any Pin Relative to Ground ....-0.5V to +6.0V Storage Temperature Range ............................ -55C to +125C Continuous Power Dissipation (T = +70C) Soldering Temperature (reflow) .......................................+260C A PDIP (derate 9.10mW/C above +70C) ................727.30mW Lead Temperature (soldering, 10s) .................................+300C Operating Temperature Range ......................... -55C to +125C This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect device reliability. (Note 1) Package Thermal Characteristics PDIP Junction-to-Ambient Thermal Resistance ( ) ........110C/W Junction-to-Case Thermal Resistance ( ) ...............40C/W JA JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Recommended Operating Conditions PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V (Note 2) 2.7 5.0 5.5 V DD DC Electrical Characteristics (V = 2.7V to 5.5V, T = -55C to +125C, unless otherwise noted.) (Note 3) DD A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 0C to +70C 0.5 Thermometer Error T C ERR -55C to +125C 2.0 Thermometer Resolution 12-bit 0.0625 C Low-Level Input Voltage V -0.3 0.3 x V V IL DD High-Level Input Voltage V 0.7 x V V + 0.3 V IH DD DD Pulse Width of Spikes That Must t Fast mode 0 50 ns SP Be Suppressed by the Input Filter V 3mA sink current (Note 2) 0 0.4 OL1 Low-Level Output Voltage (SDA) V V 6mA sink current (Note 2) 0 0.6 OL2 Input Current Each I/O Pin 0.4 < V < 0.9V (Note 4) -1 +1 A I/O DD I/O Capacitance C 10 pF I/O Temperature conversion 1250 2 Active Supply Current I E write (Notes 5, 6) 400 A CC Communication only 125 Standby Supply Current I (Notes 5, 6, 7) 1 3 A STBY Maxim Integrated 2 www.maximintegrated.com