X-On Electronics has gained recognition as a prominent supplier of DS26522GN+ Telecom Interface ICs across the USA, India, Europe, Australia, and various other global locations. DS26522GN+ Telecom Interface ICs are a product manufactured by Analog Devices. We provide cost-effective solutions for Telecom Interface ICs, ensuring timely deliveries around the world.

DS26522GN+ Analog Devices

DS26522GN+ electronic component of Analog Devices
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Part No.DS26522GN+
Manufacturer: Analog Devices
Category: Telecom Interface ICs
Description: Telecom Interface ICs 2-Port E1/T1/J1 Transceiver
Datasheet: DS26522GN+ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
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1 : USD 48.2674
10 : USD 42.0235
25 : USD 36.4657
50 : USD 33.7236
1000 : USD 31.7321
N/A

Obsolete
   
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We are delighted to provide the DS26522GN+ from our Telecom Interface ICs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DS26522GN+ and other electronic components in the Telecom Interface ICs category and beyond.

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19-5012 Rev 2 11/09 DEMO KIT AVAILABLE DS26522 Dual T1/E1/J1 Transceiver www.maxim-ic.com GENERAL DESCRIPTION FEATURES Complete T1, E1, or J1 Long-Haul/Short-Haul The DS26522 is a dual-channel framer and line Transceiver (LIU plus Framer) interface unit (LIU) combination for T1, E1, and J1 applications. Each channel is independently Internal Software-Selectable Transmit- and configurable, supporting both long-haul and short-haul Receive-Side Termination for 100 T1 Twisted lines. Pair, 110 J1 Twisted Pair, 120 E1 Twisted Pair, and 75 E1 Coaxial Applications APPLICATIONS Crystal-Less Jitter Attenuator can be Selected for Transmit or Receive Path Jitter Attenuator Routers Meets ETS CTR 12/13, ITU-T G.736, G.742, Channel Service Units (CSUs) G.823, and AT&T Pub 62411 Data Service Units (DSUs) External Master Clock can be Multiple of Muxes 2.048MHz or 1.544MHz for T1/J1 or E1 Switches Operation This Clock is Internally Adapted for T1 or E1 Usage in the Host Mode Channel Banks T1/E1 Test Equipment Receive-Signal Level Indication from -2.5dB to -36dB in T1 Mode and -2.5dB to -44dB in E1 Mode in Approximate 2.5dB Increments TYPICAL OPERATING CIRCUIT Transmit Open- and Short-Circuit Detection LIU LOS in Accordance with G.775, ETS 300 DS26522 T1/E1/J1 233, and T1.231 NETWORK Transmit Synchronizer Flexible Signaling Extraction and Insertion T1/J1/E1 BACKPLANE Using Either the System Interface or x2 Transceiver Microprocessor Port TDM Alarm Detection and Insertion T1 Framing Formats of D4, SLC-96, and ESF E1 G.704 and CRC-4 Multiframe Controlled by 8-Bit Parallel Port Interface or ORDERING INFORMATION Serial Peripheral Interface (SPI) PART TEMP RANGE PIN-PACKAGE Features Continued in Section 2. DS26522G 0 C to +70 C 144 CSBGA DS26522G+ 0 C to +70 C 144 CSBGA DS26522GN -40 C to +85 C 144 CSBGA DS26522GN+ -40 C to +85 C 144 CSBGA +Denotes a lead(Pb)-free/RoHS-compliant device. Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata. 1 of 258 DS26522 Dual T1/E1/J1 Transceiver TABLE OF CONTENTS 1. DETAILED DESCRIPTION...............................................................................................9 1.1 MAJOR OPERATING MODES.............................................................................................................9 2. FEATURE HIGHLIGHTS ................................................................................................10 2.1 GENERAL......................................................................................................................................10 2.2 LINE INTERFACE............................................................................................................................10 2.3 CLOCK SYNTHESIZER ....................................................................................................................10 2.4 JITTER ATTENUATOR .....................................................................................................................10 2.5 FRAMER/FORMATTER....................................................................................................................10 2.6 SYSTEM INTERFACE ......................................................................................................................11 2.7 HDLC CONTROLLERS ...................................................................................................................12 2.8 TEST AND DIAGNOSTICS ................................................................................................................12 2.9 MICROCONTROLLER PARALLEL PORT.............................................................................................12 2.10 SLAVE SERIAL PERIPHERAL INTERFACE (SPI) FEATURES ............................................................12 3. APPLICATIONS..............................................................................................................13 4. SPECIFICATIONS COMPLIANCE .................................................................................14 5. ACRONYMS AND GLOSSARY......................................................................................16 6. BLOCK DIAGRAMS .......................................................................................................17 7. PIN DESCRIPTIONS ......................................................................................................19 7.1 PIN FUNCTIONAL DESCRIPTION......................................................................................................19 8. FUNCTIONAL DESCRIPTION........................................................................................25 8.1 MICROPROCESSOR INTERFACE......................................................................................................25 8.1.1 Parallel Port Mode................................................................................................................................ 25 8.1.2 SPI Serial Port Mode............................................................................................................................ 25 8.1.3 SPI Functional Timing Diagrams ......................................................................................................... 25 8.2 CLOCK STRUCTURE.......................................................................................................................28 8.2.1 Backplane Clock Generation ............................................................................................................... 28 8.3 RESETS AND POWER-DOWN MODES..............................................................................................29 8.4 INITIALIZATION AND CONFIGURATION..............................................................................................30 8.4.1 Example Device Initialization Sequence.............................................................................................. 30 8.5 GLOBAL RESOURCES ....................................................................................................................30 8.6 PORT RESOURCES ........................................................................................................................30 8.7 DEVICE INTERRUPTS .....................................................................................................................30 8.8 SYSTEM BACKPLANE INTERFACE ...................................................................................................32 8.8.1 Elastic Stores ....................................................................................................................................... 32 8.8.2 IBO Multiplexer..................................................................................................................................... 35 8.8.3 H.100 (CT Bus) Compatibility .............................................................................................................. 36 8.8.4 Receive and Transmit Channel Blocking Registers............................................................................. 37 8.8.5 Transmit Fractional Support (Gapped Clock Mode) ............................................................................ 37 8.8.6 Receive Fractional Support (Gapped Clock Mode) ............................................................................. 37 8.9 FRAMERS......................................................................................................................................38 8.9.1 T1 Framing........................................................................................................................................... 38 8.9.2 E1 Framing........................................................................................................................................... 41 8.9.3 T1 Transmit Synchronizer.................................................................................................................... 43 8.9.4 Signaling .............................................................................................................................................. 44 8.9.5 T1 Data Link......................................................................................................................................... 48 8.9.6 E1 Data Link......................................................................................................................................... 50 8.9.7 Maintenance and Alarms ..................................................................................................................... 51 2 of 258

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Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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