X-On Electronics has gained recognition as a prominent supplier of DS3112+ Telecom Interface ICs across the USA, India, Europe, Australia, and various other global locations. DS3112+ Telecom Interface ICs are a product manufactured by Analog Devices. We provide cost-effective solutions for Telecom Interface ICs, ensuring timely deliveries around the world.

DS3112+ Analog Devices

DS3112+ electronic component of Analog Devices
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Part No.DS3112+
Manufacturer: Analog Devices
Category: Telecom Interface ICs
Description: Telecom Interface ICs TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX
Datasheet: DS3112+ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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We are delighted to provide the DS3112+ from our Telecom Interface ICs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DS3112+ and other electronic components in the Telecom Interface ICs category and beyond.

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DS3112 TEMPE T3/E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 Mux www.maxim-ic.com FEATURES FUNCTIONAL DIAGRAM Operates as M13 or E13 Multiplexer or as Stand-Alone T3 or E3 Framer T1/E1 Flexible Multiplexer can be Programmed for T2/E2 T1/E1 Multiple Configurations Including: T1/E1 M13 Multiplexing (28 T1 Lines into a T3 T1/E1 Data Stream) E13 Multiplexing (16 E1 Lines into an E3 T3/E3 Data Stream) E1 to T3 Multiplexing (21 E1 Lines into a T3 T1/E1 Data Stream) T1/E1 Two T1/E1 Drop and Insert Ports T2/E2 T1/E1 DS3112 Supports T3 C-Bit Parity Mode T1/E1 B3ZS/HDB3 Encoder and Decoder Generates and Detects T3/E3 Alarms Generates and Detects T2/E2 Alarms APPLICATIONS Integrated HDLC Controller Handles LAPD Wide Area Network Access Equipment Messages Without Host Intervention PBXs Integrated FEAC Controller Access Concentrators Integrated BERT Supports Performance Digital Cross-Connect Systems Monitoring Switches T3/E3 and T1/E1 Diagnostic (Tx to Rx), Line Routers (Rx to Tx), and Payload Loopback Optical Multiplexers Supported ADMs Nonmultiplexed or Multiplexed 16-Bit Test Equipment Control Port (with Optional 8-Bit Mode) ORDERING INFORMATION 3.3V Supply with 5V Tolerant I/O Available in 256-Pin 1.27mm Pitch PBGA PART TEMP RANGE PIN-PACKAGE Package DS3112 0C to +70C 256 PBGA IEEE 1149.1 JTAG Support DS3112+ 256 PBGA 0C to +70C DS3112N 256 PBGA -40C to +85C DS3112N+ -40C to +85C 256 PBGA +Denotes lead-free/RoHS-compliant package. Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata. 1 of 133 REV: 092706 DS3112 TABLE OF CONTENTS 1 DETAILED DESCRIPTION 7 1.1 APPLICABLE STANDARDS ..............................................................................................................8 1.2 MAIN DS3112 TEMPE FEATURES................................................................................................9 1.2.1 General Features ................................................................................................................................... 9 1.2.2 T3/E3 Framer ......................................................................................................................................... 9 1.2.3 T2/E2 Framer ......................................................................................................................................... 9 1.2.4 HDLC Controller..................................................................................................................................... 9 1.2.5 FEAC Controller..................................................................................................................................... 9 1.2.6 BERT.................................................................................................................................................... 10 1.2.7 Diagnostics........................................................................................................................................... 10 1.2.8 Control Port .......................................................................................................................................... 10 1.2.9 Packaging and Power .......................................................................................................................... 10 2 PIN DESCRIPTION 14 2.2 CPU BUS SIGNAL DESCRIPTION .................................................................................................19 2.3 T3/E3 RECEIVE FRAMER SIGNAL DESCRIPTION...........................................................................21 2.4 T3/E3 TRANSMIT FORMATTER SIGNAL DESCRIPTION...................................................................23 2.5 LOW-SPEED (T1 OR E1) RECEIVE PORT SIGNAL DESCRIPTION....................................................25 2.6 LOW-SPEED (T1 OR E1) TRANSMIT PORT SIGNAL DESCRIPTION..................................................26 2.7 HIGH-SPEED (T3 OR E3) RECEIVE PORT SIGNAL DESCRIPTION ...................................................28 2.8 HIGH-SPEED (T3 OR E3) TRANSMIT PORT SIGNAL DESCRIPTION .................................................28 2.9 JTAG SIGNAL DESCRIPTION .......................................................................................................29 2.10 SUPPLY, TEST, RESET, AND MODE SIGNAL DESCRIPTION............................................................29 3 MEMORY MAP 31 4 MASTER DEVICE CONFIGURATION AND STATUS/INTERRUPT 33 4.1 MASTER RESET AND ID REGISTER DESCRIPTION.........................................................................33 4.2 MASTER CONFIGURATION REGISTERS DESCRIPTION ...................................................................34 4.3 MASTER STATUS AND INTERRUPT REGISTER DESCRIPTION..........................................................38 4.3.1 Status Registers................................................................................................................................... 38 4.3.2 MSR ..................................................................................................................................................... 39 4.4 TEST REGISTER DESCRIPTION ....................................................................................................47 5 T3/E3 FRAMER 48 5.1 T3/E3 LINE LOOPBACK ...............................................................................................................48 5.2 T3/E3 DIAGNOSTIC LOOPBACK ...................................................................................................48 5.3 T3/E3 PAYLOAD LOOPBACK........................................................................................................48 5.4 T3/E3 FRAMER CONTROL REGISTER DESCRIPTION .....................................................................49 5.5 T3/E3 FRAMER STATUS AND INTERRUPT REGISTER DESCRIPTION ...............................................53 5.6 T3/E3 PERFORMANCE ERROR COUNTERS ..................................................................................59 6 M13/E13/G.747 MULTIPLEXER AND T2/E2/G.747 FRAME 62 6.1 T1/E1 AIS GENERATION.............................................................................................................62 6.2 T2/E2/G.747 FRAMER CONTROL REGISTER DESCRIPTION ..........................................................62 6.3 T2/E2/G.747 FRAMER STATUS AND INTERRUPT REGISTER DESCRIPTION ....................................64 6.4 T1/E1 AIS GENERATION CONTROL REGISTER DESCRIPTION .......................................................68 7 T1/E1 LOOPBACK AND DROP AND INSERT FUNCTIONALITY 70 7.1 T1/E1 LINE LOOPBACK ...............................................................................................................70 7.2 T1/E1 DIAGNOSTIC LOOPBACK ...................................................................................................70 7.3 T1 LINE LOOPBACK COMMAND....................................................................................................70 7.4 T1/E1 DROP AND INSERT............................................................................................................70 7.5 T1/E1 LOOPBACK CONTROL REGISTER DESCRIPTION .................................................................71 2 of 133

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8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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