X-On Electronics has gained recognition as a prominent supplier of DS32512N+ Telecom Interface ICs across the USA, India, Europe, Australia, and various other global locations. DS32512N+ Telecom Interface ICs are a product manufactured by Analog Devices. We provide cost-effective solutions for Telecom Interface ICs, ensuring timely deliveries around the world.

DS32512N+ Analog Devices

DS32512N+ electronic component of Analog Devices
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Part No.DS32512N+
Manufacturer: Analog Devices
Category: Telecom Interface ICs
Description: Telecom Interface ICs 12-Port DS3/E3/STS-1 Line Interface Unit
Datasheet: DS32512N+ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
Multiples : 1
1 : USD 128.6624
25 : USD 127.1112
50 : USD 127.1112
100 : USD 127.1112
500 : USD 125.7963
1000 : USD 122.2227
N/A

Obsolete
   
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We are delighted to provide the DS32512N+ from our Telecom Interface ICs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DS32512N+ and other electronic components in the Telecom Interface ICs category and beyond.

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+ DS32506/DS32508/DS32512 6-/8-/12-Port DS3/E3/STS-1 LIU www.maxim-ic.com FEATURES GENERAL DESCRIPTION Pin-Compatible Family of Products The DS32506 (6 port), DS32508 (8 port), and Each Port Independently Configurable DS32512 (12 port) line interface units (LIUs) are Receive Clock and Data Recovery for Up to 457 highly integrated, low-power, feature-rich LIUs for meters (1500 feet) of 75 Coaxial Cable DS3, E3, and STS-1 applications. Each LIU port in Standards-Compliant Transmit Waveshaping these devices has independent receive and transmit Uses 1:1 Transformers on Both Tx and Rx paths, a jitter attenuator, full-featured pattern Three Control Interface Options: 8/16-Bit generator and detector, performance-monitoring Parallel, SPI, and Hardware Mode counters, and a complete set of loopbacks. An on- Jitter Attenuators (One Per Port) Can be Placed chip clock adapter generates all line-rate clocks from in the Receive Path or the Transmit Path a single input clock. Ports are independently software configurable for DS3, E3, and STS-1 and can be Jitter Attenuators Have Provisionable Buffer individually powered down. Control interface options Depth: 16, 32, 64, or 128 Bits include 8-bit parallel, SPI, and hardware mode. Built-In Clock Adapter Generates All Line-Rate Clocks from a Single Input Clock (DS3, E3, STS-1, APPLICATIONS 12.8MHz, 19.44MHz, 38.88MHz, 77.76MHz) Per-Port Programmable Internal Line Termination SONET/SDH and PDH Digital Cross- Requiring Only External Transformers Multiplexers Connects High-Impedance Tx and Rx, Even When V = 0, ATM and Frame Relay Access Concentrators DD Enables Hot-Swappable, 1:1 and 1+1 Board Equipment CSUs/DSUs Redundancy Without Relays WAN Routers and PBXs Per-Port BERT for PRBS and Repetitive Pattern Switches DSLAMs Generation and Detection Tx and Rx Open and Short Detection Circuitry FUNCTIONAL DIAGRAM Transmit Driver Monitor Circuitry Receive Loss-of-Signal (LOS) Monitoring EACH LIU Compliant with ANSI T1.231 and ITU G.775 LINE IN RECEIVE Automatic Data Squelching on Receive LOS RXP CLK DS3, E3, CLOCK Large Line Code Performance-Monitoring RXN DATA OR STS-1 AND DATA Counters for Accumulation Intervals Up to 1s Local and Remote Loopbacks CONTROL Dallas Transmit Common Clock Option Semiconductor AND Power-Down Capability for Unused Ports DS325xx STATUS Low-Power 1.8V/3.3V Operation (5V Tolerant I/O) Industrial Temperature Range: -40C to +85 C LINE OUT TRANSMIT TXP CLK DS3, E3, CLOCK Small Package: 23mm x 23mm, 484-Pin BGA TXN DATA OR STS-1 AND DATA IEEE 1149.1 JTAG Support ORDERING INFORMATION PART LIUs TEMP RANGE PIN-PACKAGE DS32506 6 0C to +70C 484 BGA DS32506N 6 -40C to +85C 484 BGA DS32508 8 0C to +70C 484 BGA DS32508N 8 -40C to +85C 484 BGA DS32512 12 0C to +70C 484 BGA DS32512N 12 -40C to +85C 484 BGA Note: Add the + suffix for the lead-free package option. Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata. 1 of 130 REV: 103008 DS32506/DS32508/DS32512 TABLE OF CONTENTS 1. STANDARDS COMPLIANCE .............................................................................................6 2. BLOCK DIAGRAM ..............................................................................................................7 3. APPLICATION EXAMPLE ..................................................................................................8 4. DETAILED DESCRIPTION..................................................................................................9 5. DETAILED FEATURES.....................................................................................................11 5.1 GLOBAL FEATURES .......................................................................................................................11 5.2 RECEIVER.....................................................................................................................................11 5.3 TRANSMITTER ...............................................................................................................................11 5.4 JITTER ATTENUATOR.....................................................................................................................11 5.5 BIT ERROR-RATE TESTER (BERT) FEATURES ...............................................................................12 5.6 CLOCK ADAPTER...........................................................................................................................12 5.7 PARALLEL MICROPROCESSOR INTERFACE FEATURES.....................................................................12 5.8 SPI SERIAL MICROPROCESSOR INTERFACE FEATURES ..................................................................12 5.9 MISCELLANEOUS FEATURES..........................................................................................................12 5.10 TEST FEATURES............................................................................................................................12 5.11 LOOPBACK FEATURES...................................................................................................................12 6. CONTROL INTERFACE MODES......................................................................................13 7. PIN DESCRIPTIONS .........................................................................................................14 7.1 SHORT PIN DESCRIPTIONS ............................................................................................................14 7.2 DETAILED PIN DESCRIPTIONS ........................................................................................................17 8. FUNCTIONAL DESCRIPTION ..........................................................................................24 8.1 LIU MODE ....................................................................................................................................24 8.2 TRANSMITTER ...............................................................................................................................24 8.2.1 Transmit Clock .................................................................................................................................... 24 8.2.2 Framer Interface Format and the B3ZS/HDB3 Encoder..................................................................... 24 8.2.3 Error Insertion ..................................................................................................................................... 24 8.2.4 AIS Generation.................................................................................................................................... 25 8.2.5 Waveshaping ...................................................................................................................................... 25 8.2.6 Line Build-Out ..................................................................................................................................... 25 8.2.7 Line Driver........................................................................................................................................... 25 8.2.8 Interfacing to the Line ......................................................................................................................... 25 8.2.9 Driver Monitor and Output Failure Detection ...................................................................................... 26 8.2.10 Power-Down........................................................................................................................................ 26 8.2.11 Jitter Generation (Intrinsic).................................................................................................................. 26 8.2.12 Jitter Transfer...................................................................................................................................... 26 8.3 RECEIVER.....................................................................................................................................30 8.3.1 Interfacing to the Line ......................................................................................................................... 30 8.3.2 Optional Preamp ................................................................................................................................. 30 8.3.3 Automatic Gain Control (AGC) and Adaptive Equalizer ..................................................................... 30 8.3.4 Clock and Data Recovery (CDR)........................................................................................................ 31 8.3.5 Loss-of-Signal (LOS) Detector............................................................................................................ 31 8.3.6 Framer Interface Format and the B3ZS/HDB3 Decoder .................................................................... 32 8.3.7 Power-Down........................................................................................................................................ 33 8.3.8 Input Failure Detection........................................................................................................................ 33 8.3.9 Jitter and Wander Tolerance............................................................................................................... 34 8.3.10 Jitter Transfer...................................................................................................................................... 35 8.4 JITTER ATTENUATOR.....................................................................................................................35 8.5 BERT...........................................................................................................................................36 2 of 130

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Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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