DS5003 Rev 0 3/08 Secure Microprocessor Chip General Description Features The DS5003 secure microprocessor incorporates 8051-Compatible Microprocessor for sophisticated security features including an array of Secure/Sensitive Applications mechanisms that are designed to resist all levels of Access 32kB, 64kB, or 128kB of Nonvolatile threat, including observation, analysis, and physical SRAM for Program and/or Data Storage attack. As a result, a massive effort is required to obtain 128 Bytes of RAM any information about its memory contents. 128 Bytes of Indirect Scratchpad RAM Furthermore, the soft nature of the DS5003 allows fre- In-System Programming Through On-Chip quent modification of the secure information, thereby Serial Port minimizing the value of any secure information obtained Can Modify Its Own Program or Data Memory in by such a massive effort. The device is an enhanced the End System version of the DS5002FP secure microprocessor chip with additional scratchpad RAM. Firmware Security Features Memory Stored in Encrypted Form Differences from the DS5002FP Encryption Using On-Chip 64-Bit Key The DS5003 implements only one additional feature Automatic True Random-Key Generator from the DS5002FP: it adds 128 bytes of internal Self-Destruct Input (SDI) scratchpad memory (for a total of 256 bytes) similar to Top Coating Prevents Microprobing that used in 8032/8052 architectures. This additional Protects Memory Contents from Piracy memory is accessible through indirect addressing 8051 instructions such as mov a, r1, where r1 now can Crash-Proof Operation have a value between 0 and 255. It is also usable as Maintains All Nonvolatile Resources for Over stack space for pushes, pops, calls, and returns. 10 Years (at Room Temperature) in the Register indirect addressing is used to access the Absence of Power scratchpad RAM locations above 7Fh. It can also be Power-Fail Reset used to reach the lower RAM (0h7Fh) if needed. The Early Warning Power-Fail Interrupt address is supplied by the contents of the working reg- Watchdog Timer ister specified in the instruction. Thus, one instruction can be used to reach many values by altering the con- tents of the designated working register. Note that only Ordering Information R0 and R1 can be used as pointers. An example of reg- ister indirect addressing is as follows: INTERNAL TEMP MICRO PIN- ANL A, R0 Logical AND the Accumulator with PART RANGE PROBE PACKAGE the contents of SHIELD the register pointed to by the DS5003FPM-16+ 0C to +70C Yes 80 MQFP value stored in R0 +Denotes a lead(Pb)-free/RoHS-compliant package. Applications PIN Pads Pin Configuration appears at end of data sheet. Gaming Machines Any Application Requiring Software Protection Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.Secure Microprocessor Chip ABSOLUTE MAXIMUM RATINGS Voltage Range on Any Pin Operating Temperature Range.............................40C to +85C Relative to Ground..................................-0.3V to (V + 0.5V) Storage Temperature* .......................................-55C to +125C CC Voltage Range on V Relative Soldering Temperature...........................Refer to the IPC/JEDEC CC to Ground ..........................................................-0.3V to +6.0V J-STD-020 Specification. *Storage temperature is defined as the temperature of the device when V = 0V and V = 0V. In this state, the contents of SRAM CC LI are not battery backed and are undefined. Note: The DS5003 adheres to all AC and DC electrical specifications published for the DS5002FP. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS (V = 5V 10%, T = 0C to +70C.) CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Operating Voltage V (Note 1) V 5.5 V CC CCMIN Minimum Operating Voltage V 0C to +70C (Note 1) 4.00 4.12 4.25 V CCMIN Power-Fail Warning Voltage V 0C to +70C (Note 1) 4.25 4.37 4.50 V PFW Lithium Supply Voltage V (Note 1) 2.5 4.0 V LI Operating Current at 16MHz I (Note 2) 36 mA CC Idle-Mode Current at 12MHz I 0C to +70C (Note 3) 7.0 mA IDLE Stop-Mode Current I (Note 4) 80 A STOP Pin Capacitance C (Note 5) 10 pF IN V - CC Output Supply Voltage (V ) V (Notes 1, 2) V CCO CCO1 0.45 Output Supply Battery-Backed V - LI Mode (V ,CE1CE4, PE1, V 0C to +70C (Notes 1, 6) V CCO CCO2 0.65 PE2) Output Supply Current (Note 7) I V = V - 0.45V 75 mA CCO1 CCO CC Lithium-Backed Quiescent I 0C to +70C 5 75 nA LI Current (Note 8) BAT = 3.0V (0C to +70C) (Note 1) 4.00 4.25 Reset Trip Point in Stop Mode V BAT = 3.3V (0C to +70C) (Note 1) 4.40 4.65 Input Low Voltage V (Note 1) -0.3 +0.8 V IL V + CC Input High Voltage V (Note 1) 2.0 V IH1 0.3 Input High Voltage V + CC V (Note 1) 3.5 V IH2 (RST, XTAL1, PROG) 0.3 Output Low Voltage at V (Notes 1, 9) 0.15 0.45 V OL1 I = 1.6mA (Ports 1, 2, 3, PF) OL 2 DS5003