2.5 GHz to 8.5 GHz, I/Q Mixer Data Sheet HMC8193 FEATURES FUNCTIONAL BLOCK DIAGRAM Passive I/Q mixer RF and LO range: 2.5 GHz to 8.5 GHz 1 NIC 18 NIC HMC8193 Wide IF range: dc to 4 GHz 2 NIC 17 NIC Single-ended RF, LO, and IF 3 Conversion loss (downconverter): 9 dB (typical) GND 16 GND Image rejection (downconverter): 25 dBc (typical) 4 RF 15 LO SSB noise figure (downconverter): 11.5 dB (typical) 5 GND GND 14 Input IP3 (downconverter): 20 dBm (typical) 6 NIC NIC 13 Input P1dB compression point (downconverter): 13 dBm (typical) PACKAGE BASE Input IP2 (downconverter): 58 dBm (typical) GND RF to IF isolation (downconverter): 22 dB (typical) Figure 1. LO to RF isolation (downconverter): 48 dB (typical) LO to IF isolation (downconverter): 38 dB (typical) Amplitude balance (downconverter): 0.5 dB (typical) Phase balance (downconverter): 5 (typical) RF return loss: 13 dB (typical) LO return loss 13 dB (typical) IF return loss: 17 dB (typical) Exposed pad, 4 mm 4 mm, 24-terminal, ceramic LCC package APPLICATIONS Test and measurement instrumentation Military, aerospace, and radar Direct conversion receivers GENERAL DESCRIPTION The HMC8193 is a passive, in phase/quadrature (I/Q), monolithic Being the HMC8913 is a passive mixer, it does not require any microwave integrated circuit (MMIC) mixer that can be used dc power sources. The device offers a lower noise figure than an either as an image rejection mixer for receiver operations, or as active mixer, ensuring superior dynamic range for high a single-sideband upconverter for transmitter operations from performance and precision applications. 2.5 GHz to 8.5 GHz. The inherent I/Q architecture of the The HMC8193 is fabricated on a gallium arsenide (GaAs), HMC8193 offers excellent image rejection and thereby eliminates metal semiconductor field effect transistor (MESFET) process the need for expensive filtering of unwanted sidebands. The and uses Analog Devices, Inc., mixer cells and a 90 hybrid. It is mixer also provides excellent local oscillator (LO) to radio available in a compact, 4 mm 4 mm, 24-lead LCC package frequency (RF) and LO to intermediate frequency (IF) isolation and operates over the 40C to +85C temperature range. An and reduces the effect of LO leakage to ensure signal integrity. evaluation board for this device is also available. Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20172018 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Technical Support www.analog.com NIC NIC NIC NIC IF1 NIC NIC NIC IF2 NIC GND NIC 14353-001 7 24 8 23 9 22 10 21 11 20 12 19HMC8193 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Upconverter Performance ......................................................... 18 Applications ....................................................................................... 1 Isolation and Return Loss ......................................................... 24 Functional Block Diagram .............................................................. 1 IF Bandwidth .............................................................................. 26 General Description ......................................................................... 1 Amplitude and Phase Imbalance ............................................. 27 Revision History ............................................................................... 2 Spurious and Harmonics Performance ................................... 29 Specifications ..................................................................................... 3 Theory of Operation ...................................................................... 32 Absolute Maximum Ratings ............................................................ 4 Applications Information .............................................................. 33 Thermal Resistance ...................................................................... 4 Soldering Information and Recommended Land Pattern .... 34 ESD Caution .................................................................................. 4 Evaluation Board Information.................................................. 35 Pin Configuration and Function Descriptions ............................. 5 Outline Dimensions ....................................................................... 36 Interface Schematics..................................................................... 5 Ordering Guide .......................................................................... 36 Typical Performance Characteristics ............................................. 6 Downconverter Performance ...................................................... 6 REVISION HISTORY 5/2018Rev. A to Rev. B Changes to Applications Information Section ............................ 33 1/2018Rev. 0 to Rev. A Changes to Features .......................................................................... 1 Changed Single-Sideband (SSB) Noise Figure Parameter from 15 dB Typical to 11.5 dB Typical, Table 1 ...................................... 3 Changes to Ordering Guide .......................................................... 36 8/2017Revision 0: Initial Version Rev. B Page 2 of 36