0.25 dB LSB, 7-Bit, Silicon Digital Attenuator, 0.1 GHz to 6.0 GHz Data Sheet HMC1119 FEATURES FUNCTIONAL BLOCK DIAGRAM Attenuation range: 0.25 dB LSB steps to 31.75 dB 24 23 22 21 20 19 Low insertion loss: 1.1 dB at 1.0 GHz D0 1 18 SERNIN 1.3 dB at 2.0 GHz V 2 DD 17 CLK Typical step error: less than 0.1 dB SERIAL/ PARALLEL Excellent attenuation accuracy: less than 0.2 dB P/S 3 16 LE CONTROL Low phase shift error: 6 phase shift at 1.0 GHz GND 4 15 GND Safe state transitions 7-BIT DIGITAL High linearity ATTNIN 5 14 ATTNOUT ATTENUATOR 1 dB compression (P1dB): 31 dBm typical GND 6 13 GND Input third-order intercept (IP3): 54 dBm typical RF settling time (0.05 dB final RF output): 250 ns 7 8 9 10 11 12 PACKAGE Single supply operation: 3.3 V to 5.0 V BASE ESD rating: Class 2 (2 kV human body model (HBM)) GND 2 24-lead, 4 mm 4 mm LFCSP package: 16 mm Figure 1. APPLICATIONS Cellular infrastructure Microwave radios and very small aperture terminals (VSATs) Test equipment and sensors IF and RF designs GENERAL DESCRIPTION The HMC1119 is a broadband, highly accurate, 7-bit digital The HMC1119 has an on-chip regulator that can support a wide attenuator, operating from 0.1 GHz to 6.0 GHz with 31.5 dB supply operating range from 3.3 V to 5.0 V with no performance attenuation control range in 0.25 dB steps. change in electrical characteristics. The HMC1119 incorporates a driver that supports serial (3-wire) and parallel controls of the The HMC1119 is implemented in a silicon process, offering attenuator. very fast settling time, low power consumption, and high ESD robustness. The device features safe state transitions and is The HMC1119 comes in a RoHS-compliant, compact, 4 mm optimized for excellent step accuracy and high linearity over 4 mm LFCSP package. frequency and temperature range. The RF input and output are A fully populated evaluation board is available. internally matched to 50 and do not require any external matching components. The design is bidirectional therefore, the RF input and output are interchangeable. Rev. C Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20162018 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. GND D1 GND D2 GND D3 GND D4 GND D5 GND D6 12962-001HMC1119 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Insertion Loss, Return Loss, State Error, Step Error, and Relative Phase ................................................................................8 Applications ....................................................................................... 1 Input Power Compression and Third-Order Intercept ......... 10 Functional Block Diagram .............................................................. 1 Theory of Operation ...................................................................... 11 General Description ......................................................................... 1 Serial Control Interface ............................................................. 11 Revision History ............................................................................... 2 RF Input Output ......................................................................... 11 Specifications ..................................................................................... 3 Parallel Control Interface .......................................................... 12 Electrical Specifications ............................................................... 3 Power-Up Sequence ................................................................... 12 Timing Specifications .................................................................. 4 Applications Information .............................................................. 13 Absolute Maximum Ratings ....................................................... 5 Evaluation Printed Circuit Board ............................................ 13 ESD Caution .................................................................................. 5 Packaging and Ordering Information ......................................... 15 Pin Configuration and Function Descriptions ............................. 6 Outline Dimensions ................................................................... 15 Interface Schematics..................................................................... 7 Ordering Guide .......................................................................... 15 Typical Performance Characteristics ............................................. 8 REVISION HISTORY 4/2018Rev. B to Rev C 8/2017Rev. 0 to Rev. A Changes to Figure 23 ...................................................................... 12 Added Timing Specifications Section ............................................. 4 Change to PCB Description, Table 7 ............................................ 13 Moved Table 2 ....................................................................................4 Updated Outline Dimensions ....................................................... 15 Changes to Figure 5 and Figure 6 .................................................... 7 Changes to Serial Control Interface Section ............................... 11 9/2017Rev. A to Rev. B Moved Figure 22 and Table 6 ........................................................ 11 Changed CP-24-16 to HCP-24-3 ................................. Throughout Changes to Figure 23 ...................................................................... 12 Updated Outline Dimensions ....................................................... 15 Moved Parallel Control Interface Section, Direct Parallel Mode Changes to Ordering Guide .......................................................... 15 Section, Latched Parallel Mode Section, Power-Up Sequence Section, and Power-Up States Section ......................................... 12 Updated Outline Dimensions ....................................................... 15 9/2016Revision 0: Initial Version Rev. C Page 2 of 15