True Accuracy, 16-Bit 12 V/15 V, Serial Input Voltage Output DAC AD5570 FEATURES FUNCTIONAL BLOCK DIAGRAM V V SS DD DGND Full 16-bit performance 1 LSB maximum INL and DNL AD5570 POWER-ON RESET Output voltage range up to 14 V REFGND On-board reference buffers, eliminating the need for a negative reference 2R 16-BIT Controlled output during power-on V OUT DAC Temperature ranges of 40C to +85C for A/B version/40C R AGND to +125C for W/Y version AGNDS R Settling time of 10 s to 0.003% DAC REGISTER REFIN Clear function to 0 V Asynchronous update of outputs (LDAC pin) POWER-DOWN CONTROL LOGIC PD SHIFT REGISTER Power-on reset LDAC Serial data output for daisy chaining Data readback facility SDIN SCLK SDO SYNC CLR 5 kV HBM ESD classification Figure 1. APPLICATIONS Industrial automation Automatic test equipment Process control Data acquisition systems General-purpose instrumentation GENERAL DESCRIPTION readback allows the user to read the contents of the DAC The AD5570 is a single 16-bit serial input, voltage output DAC register via the SDO pin. that operates from supply voltages of 11.4 V up to 16.5 V. Integral linearity (INL) and differential nonlinearity (DNL) are Features on the AD5570 include LDAC which is used to update accurate to 1 LSB. During power-up, when the supply voltages the output of the DAC. The device also has a power-down pin are changing, V is clamped to 0 V via a low impedance path. OUT ( ), allowing the DAC to be put into a low power state, and a PD The AD5570 DAC comes complete with a set of reference CLR pin that allows the output to be cleared to 0 V. buffers. The reference buffers allow a single, positive reference The AD5570 is available in a 16-lead SSOP. to be used. The voltage on REFIN is gained up and inverted internally to give the positive and negative reference for the PRODUCT HIGHLIGHTS DAC core. Having the reference buffers on-chip eliminates the 1. 1 LSB maximum INL and DNL. need for external components such as inverters, precision 2. Buffered voltage output up to 14 V. amplifiers, and resistors, thereby reducing the overall solution 3. Output controlled during power-up. size and cost. The AD5570 uses a versatile 3-wire interface that is compatible 4. On-board reference buffers. with SPI, QSPI, MICROWIRE, and DSP interface standards. 5. Wide temperature range of 40C to +125C. Data is presented to the part as a 16-bit serial word. Serial data 6. 5 kV HBM ESD classification. is available on the SDO pin for daisy-chaining purposes. Data Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Fax: 781.461.3113 2010 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. 03760-001AD5570 TABLE OF CONTENTS Features .............................................................................................. 1 DAC Architecture....................................................................... 16 Applications....................................................................................... 1 Reference Buffers........................................................................ 16 Functional Block Diagram .............................................................. 1 Serial Interface ............................................................................ 16 General Description ......................................................................... 1 Transfer Function....................................................................... 17 Product Highlights ........................................................................... 1 CLR Clear ( )................................................................................. 17 Revision History ............................................................................... 2 Power-Down ( ) ..................................................................... 17 PD Specifications..................................................................................... 3 Power-On Reset.......................................................................... 17 Timing Characteristics..................................................................... 5 Serial Data Output (SDO)......................................................... 17 Standalone ..................................................................................... 5 Applications Information .............................................................. 19 Timing Characteristics..................................................................... 6 Typical Operating Circuit ......................................................... 19 Daisy-Chaining and Readback ................................................... 6 Layout Guidelines....................................................................... 20 Absolute Maximum Ratings............................................................ 8 Opto-Isolators............................................................................. 20 ESD Caution.................................................................................. 8 Microprocessor Interfacing....................................................... 21 Pin Configuration and Function Descriptions............................. 9 Evaluation Board........................................................................ 22 Terminology .................................................................................... 10 Outline Dimensions....................................................................... 24 Typical Performance Characteristics ........................................... 11 Ordering Guide .......................................................................... 24 General Description ....................................................................... 16 REVISION HISTORY 11/10Rev. B to Rev. C Added HBM ESD Classification to Features and Product Highlights Section ............................................................................ 1 Added ESD Parameter to Table 4 ................................................... 8 Changes to Ordering Guide .......................................................... 24 9/06Rev. A to Rev. B Updated Format..................................................................Universal Changes to Table 3............................................................................ 6 Changes to Figure 43...................................................................... 21 Changes to AD5570 to 8xC51 Interface Section ........................ 21 Changes to Ordering Guide .......................................................... 24 4/05Rev. 0 to Rev. A Changes to Table 1............................................................................ 3 Changes to Table 4............................................................................ 8 Added Figure 16.............................................................................. 12 Revision 0: Initial Version Rev. C Page 2 of 24