0 Hz/dc to 14 GHz, Single-Pole, Four-Throw MEMS Switch with Integrated Driver Data Sheet ADGM1304 FEATURES GENERAL DESCRIPTION Fully operational down to 0 Hz/dc The ADGM1304 is a wideband, single-pole, four-throw (SP4T) On resistance: 2.9 ( maximum) switch, fabricated using Analog Devices, Inc., microelectro- Off leakage: 0.5 nA (maximum) mechanical system (MEMS) switch technology. This technology 3 dB bandwidth enables a small form factor, wide RF bandwidth, highly linear, 11 GHz (typical) for RF1, RF4 low insertion loss switch that is operational from 0 Hz/dc to 14 GHz (typical) for RF2, RF3 14 GHz, making the ADGM1304 an ideal solution for a wide RF performance characteristics range of RF and precision equipment switching needs. Insertion loss: 0.26 dB (typical) at 2.5 GHz An integrated driver chip generates a high voltage to electro- Isolation: 24 dB (typical) at 2.5 GHz statically actuate a switch that can be controlled by a parallel IIP3: 69 dBm (typical) interface and a serial peripheral interface (SPI). All four switches RF power: 36 dBm (maximum) are independently controllable. Actuation lifetime: 1 billion cycles (minimum) The device is packaged in a 24-lead, 5 mm 4 mm 0.95 mm, Hermetically sealed switch contacts lead frame chip-scale package (LFCSP). On switching time: 75 s (maximum) Integrated driver removes the need for an external driver To ensure optimum operation of the ADGM1304, the Critical Supply voltage: 3.0 V to 3.6 V Operational Requirements section must be followed exactly. CMOS/LVTTL compatible The on resistance (R ) performance of the ADGM1304 is ON Parallel and SPI interface affected by device to device variation, channel to channel Independently controllable switches variation, cycle actuations, settling time post turn on, bias voltage, Switch is in an open state with no power supply present and temperature changes. Requirement to avoid floating nodes on all RFx pins (see the Floating Node section) COMPANION PRODUCTS 24-lead, 5 mm 4 mm 0.95 mm, LFCSP Quad Parametric Measurement Unit (PMU): AD5522 Operating temperature range: 0C to 85C SP4T MEMS Switch: ADGM1004 Low Noise, LDO Regulators: ADP7142, LT1962, LT3045-1 APPLICATIONS Additional companion products on the ADGM1304 product Relay replacements page Automatic test equipment: RF/high speed digital and mixed signals Load and probe boards: RF/high speed digital and mixed signals RF test instrumentation Reconfigurable filters and attenuators High performance RF switching Rev. G Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. Tel: 781.329.4700 20162021 Analog Devices, Inc. All rights reserved. No license is granted by implication or otherwise under any patent or patent rights of Analog Technical Support www.analog.com Devices. Trademarks and registered trademarks are the property of their respective owners. ADGM1304 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Low Power Mode ....................................................................... 26 Applications ...................................................................................... 1 Typical Operating Circuit ......................................................... 26 General Description ......................................................................... 1 Applications Information ............................................................. 28 Companion Products ....................................................................... 1 Power Supply Rails ..................................................................... 28 Revision History ............................................................................... 2 Power Supply Recommendations ............................................ 28 Functional Block Diagram .............................................................. 4 Switchable RF Attenuator ......................................................... 28 Specifications .................................................................................... 5 Reconfigurable RF Filter ........................................................... 28 Timing Characteristics ................................................................ 7 Critical Operational Requirements .............................................. 30 Absolute Maximum Ratings ........................................................... 9 System Error Considerations Due to On-Resistance Drift .. 30 Thermal Resistance ...................................................................... 9 On-Resistance Shift Due to Temperature Shock Post Actuations ................................................................................... 30 ESD Caution.................................................................................. 9 Hot Switching ............................................................................. 30 Pin Configuration and Function Descriptions .......................... 10 Floating Node ............................................................................. 31 Typical Performance Characteristics ........................................... 12 Cumulative On Switch Lifetime ............................................... 32 Eye Diagrams .............................................................................. 17 Handling Precautions ................................................................ 32 Test Circuits .................................................................................... 18 Register Summary and Details ..................................................... 33 Terminology .................................................................................... 21 Switch Data Register .................................................................. 33 Theory of Operation ...................................................................... 23 Outline Dimensions ....................................................................... 34 Parallel Digital Interface ............................................................ 23 Ordering Guide .......................................................................... 34 SPI Digital Interface ................................................................... 24 Internal Oscillator Feedthrough .............................................. 26 Internal Oscillator Feedthrough Mitigation ........................... 26 REVISION HISTORY 2/2021Rev. F to Rev. G Added Figure 61 ............................................................................. 31 Changes to Features Section ........................................................... 1 Deleted Table 8 Renumbered Sequentially ................................ 31 Added Companion Products Section ............................................ 1 Changes to Mechanical Shock Precautions Section .................. 32 Changes to Note 3, Table 1 ............................................................. 6 Added Note 4, Table 1 Renumbered Sequentially ...................... 6 1/2020Rev. E to Rev. F Deleted Figure 6 Renumbered Sequentially .............................. 12 Changes to Figure 1 .......................................................................... 4 Changes to Figure 38 and Figure 39 ............................................ 18 Changes to Figure 42 ..................................................................... 19 1/2020Rev. D to Rev. E Changes to Figure 44, Figure 45, and Figure 46 ......................... 20 Reorganized Layout ........................................................... Universal Changes to Table 6 ......................................................................... 23 Changes to Features Section and General Description Section ..... 1 Changes to Addressable Mode Section and Figure 49 Caption ..... 24 Changes to Table 1 ............................................................................ 5 Added Figure 50 Renumbered Sequentially .............................. 24 Added Timing Characteristics and Table 2 Renumbered Moved Daisy-Chain Mode Section .............................................. 25 Sequentially ........................................................................................7 Changes to Typical Operating Circuit Section ........................... 26 Added Figure 2 to Figure 4 Renumbered Sequentially ............... 8 Added Power Supply Rails Section, Power Supply Changes to Table 3 ............................................................................ 9 Recommendations Section, Figure 55, and Table 7 Changes to Figure 5 and Table 5 .................................................. 10 Renumbered Sequentially ............................................................. 28 Deleted Figure 7 and Figure 9 Renumbered Sequentially ....... 12 Changes to System Error Considerations Due to On-Resistance Added Figure 6 to Figure 11 ......................................................... 12 Drift Section .................................................................................... 30 Deleted Figure 14 and Figure 17 .................................................. 13 Added On-Resistance Shift Due to Temperature Shock Post Added Figure 12 to Figure 14 ....................................................... 13 Actuations Section, Figure 59, Hot Switching Section, and Added Figure 19 ............................................................................. 14 Figure 60 .......................................................................................... 30 Added Figure 26 to Figure 29 ....................................................... 15 Rev. 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