High Voltage, Isolated IGBT Gate Driver with Fault Detection Data Sheet ADuM4137 Integrated onto the ADuM4137 is an overcurrent detection FEATURES feature that protects the IGBT in case of overcurrent events. The 6 A peak drive output capability split emitter overcurrent detection is coupled with a high speed, Internal turn off NFET, on resistance: <0.95 two-level turn off in case of faults. Internal turn on PFET, on resistance: <1.18 Split emitter overcurrent detection The ADuM4137 provides a Miller clamp control signal for the Miller clamp output with gate sense input external metal-oxide semiconductor field effect transistor Isolated fault output (MOSFET) to provide robust IGBT turn off with a single rail Isolated temperature sensor read back supply when the gate voltage drops below 2.0 V (typical) and Propagation delay above GND2. Operation with unipolar secondary supplies is Rising: 105 ns typical possible, with or without the Miller clamp operation. Falling: 107 ns typical A low gate voltage detection circuit can trigger a fault if the gate Minimum pulse width: 70 ns voltage does not go above the internal threshold (V ) within VL Operating junction temperature range (40C to +150C) the time allowed from turn on (t ). This circuit allows DVL V and V UVLO DD1 DD2 detection of IGBT device failures that exhibit gate shorts or ASC input other causes of weak drive. 8.3 mm creepage distance The secondary falling UVLO is set to 11.24 V (typical) for Safety and regulatory approvals common IGBT two-level plateau voltage levels. 5 kV rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A The ADuM4137 provides for in field programming of DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 temperature. Two temperature sensor pins allow isolated V = 849 V (reinforced/basic) IORM PEAK monitoring of system temperatures at the IGBTs, sensing diode AEC-Q100 qualified for automotive applications gains and offsets by means of a serial port interface (SPI) bus on the primary side of the device. Values are stored on an EEPROM APPLICATIONS located on the secondary side. Additionally, programming is MOSFET/IGBT gate drivers available for specific voltage offsets, temperature sensing Photovoltaic (PV) inverters reporting frequencies, and important delays. Motor drives The ASC pin on the secondary side on the ADuM4137 allows Power supplies the driver to be switched on from the secondary side if no faults GENERAL DESCRIPTION are present. 1 The ADuM4137 is a single-channel gate driver specifically optimized for driving insulated gate bipolar transistors (IGBTs). Analog Devices, Inc., iCoupler technology provides isolation between the input signal and the output gate drive. The Analog Devices chip scale transformers also provide isolated communication of control information between the high voltage and low voltage domains of the chip. Information on the status of the chip can be read back from the dedicated fault outputs. The ADuM4137 provides isolated fault reporting for overcurrent events, remote temperature overheating events, undervoltage lockout (UVLO), and thermal shutdown (TSD). 1 Protected by U.S. Patents 5,952,849 6,873,065 and 7,075,329. Other patents pending. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 2019 Analog Devices, Inc. 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Technical Support www.analog.com ADuM4137 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Theory of Operation ...................................................................... 15 Applications ....................................................................................... 1 Applications Information .............................................................. 16 General Description ......................................................................... 1 PCB Layout ................................................................................. 16 Revision History ............................................................................... 2 SPI and EEPROM Operation.................................................... 16 Functional Block Diagram .............................................................. 3 User Register Map ...................................................................... 17 Specifications ..................................................................................... 4 User Register Bits ....................................................................... 17 Electrical Characteristics ............................................................. 4 Configuration Register Bits....................................................... 17 SPI Timing Specifications ........................................................... 8 Control Register Bits .................................................................. 18 Package Characteristics ............................................................... 8 SPI Safety ..................................................................................... 19 Regulatory Information ............................................................... 9 Propagation Delay Related Parameters ................................... 19 Insulation and Safety Related Specifications ............................ 9 Protection Features .................................................................... 20 DIN V VDE V 0884-10 (VDE V 0884-10) Insulation Insulation Lifetime ..................................................................... 26 Characteristics ............................................................................ 10 DC Correctness and Magnetic Field Immunity........................... 26 Recommended Operating Conditions .................................... 10 Typical Application Circuit ........................................................... 27 Absolute Maximum Ratings .......................................................... 11 Outline Dimensions ....................................................................... 28 Thermal Resistance .................................................................... 11 Ordering Guide .......................................................................... 28 ESD Caution ................................................................................ 11 Automotive Products ................................................................. 28 Pin Configuration and Function Descriptions ........................... 13 Typical Performance Characteristics ........................................... 14 REVISION HISTORY 8/2019Rev. 0 to Rev. A Change to Features Section ............................................................. 1 Changes to Figure 1 .......................................................................... 3 Changes to Table 1 ............................................................................ 4 Changes to Table 7 .......................................................................... 10 Changes to Applications Information Section ............................ 16 Changes to Figure 18 and Figure 20 ............................................. 21 Changes to Figure 25, Figure 26, Figure 27, and VDD2 UVLO Fault Section .................................................................................... 24 Changes to Figure 28 ...................................................................... 25 Changes to Ordering Guide .......................................................... 28 2/2019Revision 0: Initial Version Rev. A Page 2 of 28