GaAs pHEMT MMIC Low Noise Amplifier, 0.3 GHz to 20 GHz Data Sheet HMC1049 FEATURES FUNCTIONAL BLOCK DIAGRAM Low noise figure: 1.7 dB 2 3 High gain: 16 dB HMC1049 P1dB output power: 15 dBm 4 Supply voltage: 7 V at 70 mA RFOUT/V DD Output IP3: 27 dBm 50 matched input/output Die size: 1.43 mm 2.9 mm 0.1 mm 1 APPLICATIONS RFIN V GG 7 6 5 Point-to-point radios Point-to-multipoint radios Figure 1. Military and space Test instrumentation GENERAL DESCRIPTION The HMC1049 is a GaAs MMIC low noise amplifier (LNA) that V can be applied to Pad 2 with V = 7 V or to Pad 4 with DD DD operates between 0.3 GHz and 20 GHz. This LNA provides 16 dB VDD = 4 V. Pad 4 requires a bias tee. The HMC1049 is also of small signal gain, a 1.7 dB noise figure, and an Output IP3 of internally matched to 50 for ease of integration into multichip 27 dBm, requiring only 70 mA from a 7 V supply. The P1dB modules (MCMs). All data is taken with the chip in a 50 test output power of 16 dBm enables the LNA to function as a local fixture connected via 0.025 mm (1 mil) diameter wire bonds of oscillator (LO) driver for balanced, I/Q or image rejection mixers. 0.31 mm (12 mil) length. Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20152017 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. V DD ACG1 ACG3 ACG2 12956-001HMC1049 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................7 Applications ....................................................................................... 1 Application Circuit ......................................................................... 11 Functional Block Diagram .............................................................. 1 Assembly Diagram ..................................................................... 11 General Description ......................................................................... 1 Mounting and Bonding Techniques for Millimeterwave GaAs MMICs ............................................................................................. 12 Revision History ............................................................................... 2 Handling Precautions ................................................................ 12 Specifications ..................................................................................... 3 Mounting ..................................................................................... 12 Absolute Maximum Ratings ............................................................ 4 Wire Bonding ............................................................................. 13 ESD Caution.................................................................................. 4 Outline Dimensions ....................................................................... 14 Pin Configuration and Function Descriptions ............................. 5 Ordering Guide .......................................................................... 14 Interface Schematics .................................................................... 6 This Hittite Microwave Products data sheet has been reformatted REVISION HISTORY to meet the styles and standards of Analog Devices, Inc. 6/2017Rev. A to Rev. B 1/2015Rev. 00.0414 to Rev. A Changed HMC1049 Bare Die to HMC1049 .............. Throughout Updated Format .................................................................. Universal Changes to Ordering Guide .......................................................... 14 Edits to Figure 14 ............................................................................... 7 Updated Outline Dimensions ....................................................... 13 Changes to Ordering Guide .......................................................... 13 Rev. B Page 2 of 14