71 GHz to 76 GHz, E-Band I/Q Upconverter Data Sheet HMC8118 FEATURES GENERAL DESCRIPTION Conversion loss: 11 dB typical The HMC8118 is an integrated E-band gallium arsenide (GaAs) Sideband rejection: 33 dBc typical monolithic microwave integrated circuit (MMIC) in-phase/ Input power for 1 dB compression (P1dB): 14 dBm typical quadrature (I/Q) upconverter chip that operates from 71 GHz Input third-order intercept (IP3): 22 dBm typical to 76 GHz. The HMC8118 provides a small signal conversion Input second-order intercept (IP2): 5 dBm typical loss of 11 dB with 33 dBc of sideband rejection across the 6 local oscillator (LO) leakage at RFOUT: 27 dBm typical frequency band. The device uses an image rejection mixer that RF return loss: 6 dB typical is driven by a 6 LO multiplier. Differential I and Q mixer inputs LO return loss: 18 dB typical are provided. The inputs can be driven with differential I and Q Die size: 3.601 mm 1.609 mm 0.05 mm baseband waveforms for direct conversion applications. Alternatively, the inputs can be driven using an external 90 APPLICATIONS hybrid and two external 180 hybrids for single sideband E-band communication systems applications. All data includes the effect of a 1 mil gold wire High capacity wireless backhaul wedge bond on the intermediate frequency (IF) ports. Test and measurement FUNCTIONAL BLOCK DIAGRAM 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 IFIP 4 IFIN 3 6 IFQN 2 IFQP 1 24 23 22 HMC8118 Figure 1. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. 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RFOUT V GMIX V DAMP2 V GAMP V DAMP1 V DMULT V GX3 V GX2 LOIN 13095-001HMC8118 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Upper Sideband (USB) Selected, IF = 1000 MHz .................. 16 Applications ....................................................................................... 1 Upper Sideband (USB) Selected, IF = 2000 MHz .................. 18 General Description ......................................................................... 1 Spurious Performance, LSB ...................................................... 20 Functional Block Diagram .............................................................. 1 Spurious Performance, USB...................................................... 21 Revision History ............................................................................... 2 Theory of Operation ...................................................................... 22 Specifications ..................................................................................... 3 Applications Information .............................................................. 23 Absolute Maximum Ratings ............................................................ 4 Biasing Sequence ........................................................................ 23 Thermal Resistance ...................................................................... 4 Single SideBand Upconversion ................................................. 23 ESD Caution .................................................................................. 4 Assembly Diagram ......................................................................... 25 Pin Configuration and Function Descriptions ............................. 5 Mounting and Bonding Techniques for Millimeterwave GaAs MMICs ............................................................................................. 26 Interface Schematics..................................................................... 6 Handling Precautions ................................................................ 26 Typical Performance Characteristics ............................................. 7 Mounting ..................................................................................... 26 Lower Sideband (LSB) Selected, IF = 1000 MHz ..................... 7 Wire Bonding .............................................................................. 26 Return Loss Peformance .............................................................. 9 Outline Dimensions ....................................................................... 27 Lower Sideband (LSB) Selected, IF = 500 MHz ..................... 10 Ordering Guide .......................................................................... 27 Lower Sideband (LSB) Selected, IF = 2000 MHz ................... 12 Upper Sideband (USB) Selected, IF = 500 MHz .................... 14 REVISION HISTORY 2/16Revision A: Initial Version Rev. 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