X-On Electronics has gained recognition as a prominent supplier of HMC8119 Up-Down Converters across the USA, India, Europe, Australia, and various other global locations. HMC8119 Up-Down Converters are a product manufactured by Analog Devices. We provide cost-effective solutions for Up-Down Converters, ensuring timely deliveries around the world.

HMC8119 Analog Devices

HMC8119 electronic component of Analog Devices
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See Product Specifications
Part No. HMC8119
Manufacturer: Analog Devices
Category: Up-Down Converters
Description: Up-Down Converters E-band 81 - 86 GHz I/Q Up-converter
Datasheet: HMC8119 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
25: USD 93.3211 ea
Line Total: USD 2333.03 
Availability - 0
MOQ: 25  Multiples: 25
Pack Size: 25
Availability Price Quantity
0
Ship by Fri. 21 Feb to Thu. 27 Feb
MOQ : 1
Multiples : 1
1 : USD 180.9957
4 : USD 150.6212
15 : USD 144.8266
30 : USD 139.2514
100 : USD 133.9085

0
Ship by Fri. 21 Feb to Thu. 27 Feb
MOQ : 25
Multiples : 25
25 : USD 126.2482

0
Ship by Wed. 19 Feb to Fri. 21 Feb
MOQ : 25
Multiples : 25
25 : USD 93.3211
100 : USD 93.3211
250 : USD 87.9162

   
Manufacturer
Product Category
Product
RF Frequency
IF Frequency
LO Frequency
Operating Supply Voltage
Operating Supply Current
Maximum Operating Temperature
Mounting Style
Package / Case
P1dB - Compression Point
Packaging
Package Case
Technology
Brand
Minimum Operating Temperature
Nf Noise Figure
Oip3 Third Order Intercept
P1db Compression Point
Rohs Mouser
Series
Cnhts
Hts Code
Mxhts
Oip3 - Third Order Intercept
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We are delighted to provide the HMC8119 from our Up-Down Converters category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HMC8119 and other electronic components in the Up-Down Converters category and beyond.

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81 GHz to 86 GHz, E-Band I/Q Upconverter Data Sheet HMC8119 FEATURES GENERAL DESCRIPTION Conversion loss: 10 dB typical The HMC8119 is an integrated E-band gallium arsenide (GaAs) Sideband rejection: 22 dBc typical pseudomorphic (pHEMT) monolithic microwave integrated Input power for 1 dB compression (P1dB): 16 dBm typical circuit (MMIC), in-phase/quadrature (I/Q) upconverter chip Input third-order intercept (IP3): 24 dBm typical that operates from 81 GHz to 86 GHz. The HMC8119 provides Input second-order intercept (IP2): 5 dBm typical a small signal conversion loss of 10 dB with 22 dBc of sideband 6 local oscillator (LO) leakage at RFOUT: 23 dBm typical rejection across the frequency band. The device uses an image RF return loss: 12 dB typical rejection mixer that is driven by a 6 LO multiplier. Differential LO return loss: 20 dB typical I and Q mixer inputs are provided. The inputs can be driven Die size: 3.601 mm 1.609 mm 0.05 mm with differential I and Q baseband waveforms for direct conver- sion applications. Alternatively, the inputs can be driven using APPLICATIONS an external 90 hybrid and two external 180 hybrids for single- E-band communication systems sideband applications. All data includes the effect of a 1 mil High capacity wireless backhaul gold wire wedge bond on the intermediate frequency (IF) ports. Test and measurement FUNCTIONAL BLOCK DIAGRAM 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 IFIP 4 IFIN 3 6 IFQN 2 IFQP HMC8119 1 24 23 22 Figure 1. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 2016 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. RFOUT V GMIX V DAMP2 V GAMP V DAMP1 V DMULT V GX3 V GX2 LOIN 13098-001HMC8119 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Lower Sideband (LSB) Selected, IF = 1000 MHz ................... 16 Applications ....................................................................................... 1 Lower Sideband (LSB) Selected, IF = 2000 MHz ................... 18 General Description ......................................................................... 1 Spurious Performance, USB...................................................... 20 Functional Block Diagram .............................................................. 1 Spurious Performance, LSB ...................................................... 21 Revision History ............................................................................... 2 Theory of Operation ...................................................................... 22 Specifications ..................................................................................... 3 Applications Information .............................................................. 23 Absolute Maximum Ratings ............................................................ 4 Biasing Sequence ........................................................................ 23 Thermal Resistance ...................................................................... 4 Single Sideband Upconversion ................................................. 23 ESD Caution .................................................................................. 4 Assembly Diagram ......................................................................... 25 Pin Configuration and Function Descriptions ............................. 5 Mounting and Bonding Techniques for Millimeterwave GaAs MMICs ............................................................................................. 26 Interface Schematics..................................................................... 6 Handling Precautions ................................................................ 26 Typical Performance Characteristics ............................................. 7 Mounting ..................................................................................... 26 Upper Sideband (USB) Selected, IF = 500 MHz ...................... 7 Wire Bonding .............................................................................. 26 Return Loss Performance ............................................................ 9 Outline Dimensions ....................................................................... 27 Upper Sideband (USB) Selected, IF = 1000 MHz .................. 10 Ordering Guide .......................................................................... 27 Upper Sideband (USB) Selected, IF = 2000 MHz .................. 12 Lower Sideband (LSB) Selected, IF = 500 MHz ..................... 14 REVISION HISTORY 2/16Revision A: Initial Version Rev. A Page 2 of 27

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
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Analog Devices Hittite
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