HMC8400-SX Analog Devices

2 GHz to 30 GHz, GaAs pHEMT MMIC Low Noise Amplifier Data Sheet HMC8400 FEATURES GENERAL DESCRIPTION Output power for 1 dB compression (P1dB): 14.5 dBm typical The HMC8400 is a gallium arsenide (GaAs), pseudomorphic Saturated output power (P ): 17 dBm typical SAT high electron mobility transistor (pHEMT), monolithic microwave Gain: 13.5 dB typical integrated circuit (MMIC). The HMC8400 is a wideband low Noise figure: 2 dB noise amplifier that operates between 2 GHz and 30 GHz. The Output third-order intercept (IP3): 26.5 dBm typical amplifier provides 13.5 dB of gain, a 2 dB noise figure, 26.5 dBm Supply voltage: 5 V at 67 mA output IP3, and 14.5 dBm of output power at 1 dB gain compres- 50 matched input/output sion, requiring 67 mA from a 5 V supply. The HMC8400 is self Die size: 2.7 mm 1.35 mm 0.05 mm biased with only a single positive supply needed to achieve a drain current I of 67 mA. The HMC8400 also has a gain control DD APPLICATIONS option, VGG2. The HMC8400 amplifier input/outputs are internally Test instrumentation matched to 50 and dc blocked, facilitating integration into Microwave radios and very small aperture terminals (VSATs) multichip modules (MCMs). All data is taken with the chip Military and space connected via two 0.025 mm (1 mil) wire bonds of minimal Telecommunications infrastructure length 0.31 mm (12 mils). Fiber optics FUNCTIONAL BLOCK DIAGRAM 3 V HMC8400 DD 4 RFOUT V 2 GG 2 1 RFIN Figure 1. Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. Tel: 781.329.4700 20162017 Analog Devices, Inc. All rights reserved. No license is granted by implication or otherwise under any patent or patent rights of Analog Technical Support www.analog.com Devices. Trademarks and registered trademarks are the property of their respective owners. 13852-001HMC8400 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Interface Schematics .....................................................................6 Applications ....................................................................................... 1 Typical Performance Characteristics ..............................................7 General Description ......................................................................... 1 Theory of Operation ...................................................................... 12 Functional Block Diagram .............................................................. 1 Applications Information .............................................................. 13 Revision History ............................................................................... 2 Biasing Procedures ..................................................................... 13 Specifications ..................................................................................... 3 Mounting and Bonding Techniques for Millimeterwave GaAs MMICs ......................................................................................... 13 2 GHz to 6 GHz Frequency Range ............................................. 3 Typical Application Circuit ....................................................... 14 6 GHz to 20 GHz Frequency Range ........................................... 3 Assembly Diagram ..................................................................... 14 20 GHz to 30 GHz Frequency Range ......................................... 4 Outline Dimensions ....................................................................... 15 Absolute Maximum Ratings ............................................................ 5 Ordering Guide .......................................................................... 15 ESD Caution .................................................................................. 5 Pin Configuration and Function Descriptions ............................. 6 REVISION HISTORY 5/2017Rev. A to Rev. B Changes to Figure 1 .......................................................................... 1 Added Figure 32 and Figure 33 Renumbered Sequentially ............ 11 9/2016Rev. 0 to Rev. A Changes to Features Section............................................................ 1 Updated Outline Dimensions ....................................................... 14 Changes to Ordering Guide .......................................................... 14 2/2016Revision 0: Initial Version Rev. B Page 2 of 15