0.5 GHz to 80 GHz, GaAs, HEMT, MMIC, Low Noise Wideband Amplifier Data Sheet HMC-AUH312 FEATURES FUNCTIONAL BLOCK DIAGRAM Small signal gain: >8 dB 2 80 GHz distributed amplifier V 1 GG Configurable with or without bias tees for V and V 1 bias DD GG HMC-AUH312 Low power dissipation RFIN/V 1 GG 1 300 mW with bias tee at V = 5 V DD 360 mW without bias tee at V = 6 V DD RFOUT/ 480 mW without bias tee at V = 8 V V DD DD 3 Die size: 1.2 mm 1.0 mm 0.1 mm V V 2 DD GG APPLICATIONS 5 4 Fiber optic modulator drivers Figure 1. Fiber optic photoreceiver postamplifiers Low noise amplifier for test and measurement equipment Point to point and point to multipoint radios Wideband communication and surveillance systems Radar warning receivers GENERAL DESCRIPTION The HMC-AUH312 is a gallium arsenide (GaAs), monolithic The amplifier die occupies 1.2 mm 1.0 mm, facilitating easy microwave integrated circuit (MMIC), HEMT, low noise, integration into a multichip module (MCM). The HMC-AUH312 wideband amplifier die that operates between 500 MHz and can be used with or without a bias tee, and requires off-chip 80 GHz, providing a typical 3 dB bandwidth of 80 GHz. The blocking components and bypass capacitors for the dc supply amplifier provides 10 dB of small signal gain and a maximum lines. Adjustable gate voltages allow for gain adjustment. output amplitude of 2.5 V p-p, which makes it ideal for use in broadband wireless, fiber optic communications, and test equipment applications. Rev. F Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. Tel: 781.329.4700 2019 Analog Devices, Inc. All rights reserved. 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Trademarks and registered trademarks are the property of their respective owners. 13476-001HMC-AUH312 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Theory of Operation ...................................................................... 11 Applications ....................................................................................... 1 Applications Information .............................................................. 12 Functional Block Diagram .............................................................. 1 Applications Overview .............................................................. 12 General Description ......................................................................... 1 Device Mounting ........................................................................ 14 Revision History ............................................................................... 2 Device Operation ....................................................................... 14 Specif icat ions ..................................................................................... 3 Mounting and Bonding Techniques for Millimeterwave GaAs MMICs ............................................................................................. 15 0.5 GHz to 60 GHz Frequency Range ........................................ 3 Handling Guidelines for ESD Protection of GaAs MMICs ........ 15 60 GHz to 80 GHz Frequency Range ......................................... 3 Handling Precautions ................................................................ 15 Recommended Operating Conditions ...................................... 3 Mounting Techniques ................................................................ 16 Absolute Maximum Ratings ............................................................ 5 Wire Bonding .............................................................................. 16 ESD Caution .................................................................................. 5 Outline Dimensions ....................................................................... 17 Pin Configuration and Function Descriptions ............................. 6 Ordering Guide .......................................................................... 17 Interface Schematics..................................................................... 7 Typical Performance Characteristics ............................................. 8 REVISION HISTORY 11/2019Rev. E to Rev. F Changes to Table 6 ............................................................................. 6 Change to Voltage Parameter, Table 4 ........................................... 4 Added Interface Schematics Section ............................................... 7 Changes to Figure 3 ........................................................................... 7 11/2015v04.0615 to Rev. E Changes to Figure 14, Figure 16, and Figure 19 ............................ 9 Changes to Figure 20...................................................................... 10 This Hittite Microwave Products data sheet has been reformatted Added Theory of Operation Section and Figure 21 .................. 11 to meet the styles and standards of Analog Devices, Inc. Added Applications Information Section and Applications Updated Format .................................................................. Universal Overview Section............................................................................ 12 Changes to Title of Data Sheet ............................................... Page 1 Changes to Figure 24 and Figure 25 ............................................ 13 Change Vg1 to V 1, Vg2 to V 2, Vd to V , RFIN to GG GG DD Changes to Device Power-Up Instructions Section and Device RFIN/V 1, and RFOUT to RFOUT/V .................. Throughout GG DD Power-Down Instructions Section ............................................... 14 Changes to General Description Section ...................................... 1 Added Handling Guidelines for ESD Protection of GaAs MMICs Changes to Gain Parameter, Table 2 .............................................. 3 Section and Opening the Protective Packaging Section ................ 15 Changes to Power Dissipation Parameter and Operating Changes to Handling Precautions Section .................................. 15 Temperature Parameter, Table 3 ..................................................... 3 Changes to Mounting Techniques Section ................................. 16 Changes to Power Dissipation Parameter and Operating Updated Outline Dimensions ....................................................... 17 Temperature Parameter, Table 4 ..................................................... 4 Changes to Ordering Guide .......................................................... 17 Changes to Table 5 ............................................................................ 5 Added Figure 2, Renumbered Sequentially .................................. 6 Rev. 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