DEMO MANUAL LB2223B Multi-Footprint Mini Boards Lab Board LB2223B INSTRUCTIONS Each of the pin landing pads is connected to an edge 3. Place the tip of the soldering iron on top of the pin pad to simplify wiring surface mount packages into other until the solder underneath melts and a connection is circuits. Additionally a center trace with pads at each formed to the pad. Or, if using the center pad, heat that end (and a center pad on the two boards on the right) is pad instead by placing one or two soldering irons on included for use as a ground trace. the connected center trace pads. Recommended use: 4. Solder the remaining pins. 1. Apply a thin layer of solder to one of the corner pin 5. Chip capacitors can be placed and soldered from a landing pads (or the center pad, if using an exposed corner pad to a center trace ground pad. pad package, e.g. MSOP-8E, SOIC-8E, DFN-8). 6. Solder wires to the edge pads as needed to wire this 2. Place the IC on the board, aligning the pins with the lab board into a larger design. Double-sided tape can landing pads. be used to secure the lab board to a larger board. All registered trademarks and trademarks are the property of their respective owners. BOARD PHOTO Lab Board LB2223B Is Designed to Support Prototyping with the Following Packages: MSOP-10 SOT-23-3 MSOP-8 SOIC-8 SC70-5 3x3 DFN-10 SOT-23-5 MSOP-8E SOIC-8E SC70-6 SOT-23-6 3x3 DFN-8 SOT-23-8 Rev. 0 1DEMO MANUAL LB2223B ESD Caution ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. 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