Click here for production status of specific part numbers. LM4040 Improved Precision Micropower Shunt Voltage Reference with Multiple Reverse Breakdown Voltages General Description Benefits and Features The LM4040 is a precision, two-terminal shunt mode, Ultra-Small 3-Pin SC70 Package bandgap voltage reference available in fixed reverse- 0.1% (max) Initial Accuracy breakdown voltages of 2.048V, 2.500V, 3.000V, 3.3V, 100ppm/C (max) Temperature Coefficient 4.096V, and 5.000V. Ideal for space-critical applications, Guaranteed Over -40C to +125C Temperature the LM4040 is offered in the subminiature 3-pin SC70 Range surface-mount package (1.8mm x 1.8mm), 50% smaller than comparable devices in SOT23 surface-mount Wide Operating Current Range: 60A to 15mA packages (SOT23 versions are also available). Low 28V Output Noise (10Hz to 10kHz) RMS Laser-trimmed resistors ensure precise initial accuracy. 2.048V, 2.500V, 3.000V, 3.3V, 4.096V, and 5.000V With a 100ppm/C temperature coefficient, the device Fixed Reverse-Breakdown Voltages is offered in four grades of initial accuracy ranging from No Output Capacitors Required 0.1% to 1%. The LM4040 has a 60A to 15mA shunt Tolerates Capacitive Loads current capability with low dynamic impedance, ensuring stable reverse breakdown voltage accuracy over a wide AEC-Q100 Qualified - Refer to Ordering Information range of operating temperatures and currents. table for /V parts The LM4040 does not require an external stabilizing capacitor while ensuring stability with any capacitive load. Ordering Information appears at end of data sheet. The LM4040 is guaranteed over the temperature range of -40C to +125C. For a 1.225V output version, refer to the LM4041 data sheet. Applications Portable, Battery-Powered Equipment Notebook Computers Cell Phones Industrial Process Controls Automotive 19-1787 Rev 12 5/19LM4040 Improved Precision Micropower Shunt Voltage Reference with Multiple Reverse Breakdown Voltages Absolute Maximum Ratings Reverse Current (cathode to anode)..................................20mA Operating Temperature Range Forward Current (anode to cathode) ..................................10mA LM4040 I ................................................ -40C to +85C Continuous Power Dissipation (T = +70C) LM4040 E ............................................ -40C to +125C A 3-Pin SC70 (derate 2.90mW/C above +70C) ...........235mW Storage Temperature Range ............................ -65C to +150C 3-Pin SOT23 (derate 3mW/C above +70C) ..........238.1mW Junction Temperature ......................................................+150C Lead Temperature (soldering, 10s) .................................+300C Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 3 SOT23 PACKAGE CODE U3+1 Outline Number 21-0051 Land Pattern Number 90-0179 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) N/A JA Junction to Case ( ) N/A JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 336C/W JA Junction to Case ( ) 110.10C/W JC 3 SC70 PACKAGE CODE X3+2 Outline Number 21-0075 Land Pattern Number 90-0208 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 340C/W JA Junction to Case ( ) 115C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 340.40C/W JA Junction to Case ( ) 120C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com