Click here for production status of specific part numbers. LM4050/LM4051 50ppm/C Precision Micropower Shunt Voltage References with Multiple Reverse Breakdown Voltages General Description Features The LM4050/LM4051 are precision two-terminal, shunt- 50ppm/C (max) Temperature Coefficient Guaranteed mode, bandgap voltage references available in fixed over the -40C to +125C Temperature Range reverse breakdown voltages of 1.225V, 2.048V, 2.500V, Ultra-Small 3-Pin SC70 Package 3.000V, 3.3V, 4.096V, and 5.000V. Ideal for space-critical 0.1% (max) Initial Accuracy applications, the LM4050/LM4051 are offered in the sub Wide Operating Current Range: 60A to 15mA miniature 3-pin SC70 surface-mount packages (1.8mm x 1.8mm), 50% smaller than comparable devices in Low 28V Output Noise (10Hz to 10kHz) RMS SOT23 surface-mount package (SOT23 versions are also 1.225V, 2.048V, 2.500V, 3.000V, 3.3V, 4.096V, and available). 5.000V Fixed Reverse Breakdown Voltages Laser-trimmed resistors ensure excellent initial accuracy. No Output Capacitors Required With a 50ppm/C temperature coefficient, these devices Tolerates Capacitive Loads are offered in three grades of initial accuracy ranging from 0.1% to 0.5%. The LM4050/LM4051 have a 60A to 15mA AEC-Q100 Qualified, Refer to Ordering Information shunt-current capability with low dynamic impedance, for the Specific /V Versions ensuring stable reverse breakdown voltage accuracy over a wide range of operating temperatures and currents. The Pin Configuration LM4050/LM4051 do not require an external stabilizing capacitor while ensuring stability with any capacitive loads. TOP VIEW The LM4050/LM4051 specifications are guaranteed over the temperature range of -40C to +125C. + + 1 Applications LM4050 3 N.C.* Portable, Battery-Powered Equipment LM4051 Notebook Computers - 2 Cell Phones Industrial Process Controls SC70/SOT23 Automotive *PIN 3 MUST BE LEFT UNCONNECTED OR CONNECTED TO PIN 2. Pin Configuration Ordering Information appears at end of data sheet. V S I + I SHUNT LOAD R S I LOAD V R I SHUNT LM4050 19-2563 Rev 15 7/20LM4050/LM4051 50ppm/C Precision Micropower Shunt Voltage References with Multiple Reverse Breakdown Voltages Absolute Maximum Ratings Reverse Current (cathode to anode)..................................20mA Operating Temperature Range Forward Current (anode to cathode) ..................................10mA LM4050/LM4051 E .............................. -40C to +125C Continuous Power Dissipation (T = +70C) Storage Temperature Range ............................ -65C to +150C A 3-Pin SC70 (derate 2.9mW/C above +70C) ..........235.3mW Junction Temperature ......................................................+150C 3-Pin SOT23 (derate 3mW/C above +70C) ..........238.1mW Lead Temperature (soldering, 10s)..................................+300C Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 3 SOT23 PACKAGE CODE U3+1 Outline Number 21-0051 Land Pattern Number 90-0179 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 336C/W JA Junction to Case ( ) 110.10C/W JC 3 SC70 PACKAGE CODE X3+2 Outline Number 21-0075 Land Pattern Number 90-0208 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 340.40C/W JA Junction to Case ( ) 120C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com