LTC2874 Quad IO-Link Master Hot Swap Controller and PHY Fea T Descrip T n IO-Link Compatible (COM1/COM2/COM3) The LTC 2874 provides a rugged, 4-port IO-Link power and n 8V to 34V Operation communications interface to remote devices connected n Hot Swap Controller Protected Supply Outputs by cables up to 20m in length. n Discrete Power MOSFETs for Ruggedness and Output supply voltage and inrush current are ramped Flexibility up in a controlled manner using external N-channel n Configurable 100mA (4-Port), 200mA (2-Port), or MOSFETs, providing improved robustness compared to 400mA (1-Port) CQ Drive Capability fully integrated solutions. n Automatic Wake-Up Pulse Generation n Automatic Cable Sensing Wake-up pulse generation, line noise suppression, con- n CQ Pins Protected to 50V nection sensing and automatic restart after fault conditions n Configurable L+ Current Limit with Foldback are supported, along with signaling at 4.8kb/s, 38.4kb/s, n Short Circuit, Input UV/OV and Thermal Protection and 230.4kb/s. n Optional Interrupt and Auto-Retry after Faults Configuration and fault reporting are exchanged using n 2.9V to 5.5V Logic Supply for Flexible Digital Interface a SPI-compatible 4-wire interface that operates at clock n No Damage or Latchup to 8kV HBM ESD rates up to 20MHz. n 38-Lead (5mm 7mm) QFN and TSSOP Packages The LTC2874 implements an IO-Link master PHY. For a T 3669. IO-Link device designs, see the LT n L, LT, LTC, LTM, Linear Technology, the Linear logo, Module are registered trademarks and IO-Link Masters Hot Swap is a trademark of Linear Technology Corporation. IO-Link is a registered trademark of n Intelligent Sensors and Actuators PROFIBUS User Organization (PNO). All other trademarks are the property of their respective owners. n Factory Automation Networks Typical a T Quad-Port 200mA Power Source and Signaling Interface Operating Waveforms 8V TO 34V + CQ1 V SENSE DD 100F 1F LTC2874 0.2 V 2.9V TO 5.5V CQ2 L SENSE 1 20V/DIV 4.7k SENSE 2 IRQ IRQ SENSE 3 CQ3 SENSE 4 V CC 10 4 TXENn GATE1 CQ4 4 TXDn GATE2 1F 2874 TA01b 4s/DIV 4 LOAD: 4nF GATE3 RXDn CQ1, CQ3: SLEW = 0 GATE4 CQ2, CQ4: SLEW = 1 1 L+1 CS 4 C 2 CQ1 SCK 3 1 L+2 SDI 4 2 CQ2 SDO 3 1 L+3 4 2 CQ3 3 1 L+4 4 2 CQ4 GND GND 3 2874 TA01a 2874fb 1 For more information www.linear.com/LTC2874 ion pplica ions pplica ion uresLTC2874 a Te Maxi Mu M r a T (Notes 1, 2, 3) Input Supplies Output Voltages V ........................................................ 0.3V to 40V GATE .......................................... 0.3V to (V ) + 15V DD L+ V ............................................................ 0.3V to 6V IRQ .......................................................... 0.3V to 6V L Input Voltages RXD, SDO ..................................... 0.3V to V + 0.3V L CS, SCK, SDI, TXD .................................. 0.3V to 6V Operating Temperature Range TXEN ............................................ 0.3V to V + 0.3V LTC2874I ..............................................40C to 85C L CQ ................................................... V 50V to 50V Maximum Junction Temperature .......................... 150C DD GATE L+ (Note 4) ................................ 0.3V to 10V Storage Temperature Range .................. 65C to 150C L+ ............................................................. 6V to 50V Lead Temperature (Soldering, 10 sec) + SENSE , SENSE ......................V 2V to V + 2V FE Package .......................................................300C DD DD p c F T TOP VIEW TOP VIEW TXEN4 1 38 TXD4 GATE4 2 37 RXD4 SENSE 4 3 36 TXEN3 38 37 36 35 34 33 32 L+4 4 35 TXD3 CQ4 1 31 TXD3 CQ4 5 34 RXD3 CQ3 2 30 RXD3 CQ3 6 33 CS GATE3 3 29 CS GATE3 7 32 SCK SENSE 3 4 28 SCK SENSE 3 8 31 SDI L+3 5 27 SDI L+3 9 30 GND + SENSE 6 26 GND 39 + 39 SENSE 10 29 GND V 7 GND 25 GND DD GND V 11 28 V L DD GATE2 8 24 V L GATE2 12 27 TXEN2 SENSE 2 9 23 TXEN2 SENSE 2 13 26 TXD2 L+2 10 22 TXD2 L+2 14 25 RXD2 21 CQ2 11 RXD2 CQ2 15 24 SDO CQ1 12 20 SDO 13 14 15 16 17 18 19 CQ1 16 23 IRQ GATE1 17 22 TXEN1 SENSE 1 18 21 TXD1 L+1 19 20 RXD1 UHF PACKAGE 38-LEAD (5mm 7mm) PLASTIC QFN FE PACKAGE T = 150C, = 34C/W (NOTE 5) 38-LEAD PLASTIC TSSOP JMAX JA EXPOSED PAD (PIN 39) IS GND, MUST BE SOLDERED TO PCB T = 150C, = 25C/W (NOTE 5) JMAX JA EXPOSED PAD (PIN 39) IS GND, MUST BE SOLDERED TO PCB 2874fb 2 For more information www.linear.com/LTC2874 GATE1 L+4 SENSE 1 SENSE 4 L+1 GATE4 RXD1 TXEN4 TXD1 TXD4 TXEN1 RXD4 IRQ TXEN3 ion igura on in ings bsolu