LTM4632 Ultrathin, Triple Output, Step-Down Module Regulator for DDR-QDR4 Memory FEATURES DESCRIPTION n Complete DDR-QDR4 SRAM Power Solution The LTM 4632 is an ultrathin triple output step-down Including VDDQ, VTT, VTTR (or VREF) Module (power module) regulator to provide complete 2 n Solution in 0.5cm (Dual-Sided PCB) power solution for DDR-QDR4 SRAM. Operating from a n Wide Input Voltage Range: 3.6V to 15V 3.6V to 15V input voltage, the LTM4632 supports two 3A n 3.3V Input Compatible with V Tied to INTV output rails, both sink and source capable, for VDDQ and IN CC n 0.6V to 2.5V Output Voltage Range VTT, plus a 10mA low noise reference VTTR output. Both n Dual 3A DC Output Current with Sink and Source VTT and VTTR track and are equal to VDDQ/2. Housed Capability in a 6.25mm 6.25mm 1.82mm LGA and 6.25mm n 1.5%, 10mA Buffered VTTR = VDDQ/2 Output 6.25mm 2.42mm BGA packages, the LTM4632 includes n 3A VDDQ + 3A VTT or Dual Phase Single 6A VTT the switching controller, power FETs, inductors and sup- n 1.5% Maximum Total Output Voltage Regulation port components. Alternatively, the power module can Error Over Load, Line and Temperature also be configured as a two phase single 6A output n Current Mode Control, Fast Transient Response VTT. Only a few ceramic input and output capacitors are n External Frequency Synchronization needed to complete the design. n Multiphase Parallelable with Current Sharing The LTM4632 supports selectable Burst Mode operation n Selectable Burst Mode Operation (CH1 only) and output voltage tracking for supply rail n Overvoltage Input and Overtemperature Protection sequencing. Its high switching frequency and current n Power Good Indicator mode control enable a very fast transient response to n Ultrathin 6.25mm 6.25mm 1.82mm LGA and line and load changes without sacrificing stability. 6.25mm 6.25mm 2.42mm BGA Packages Fault protection features include overvoltage input, over- current and overtemperature protection. APPLICATIONS The LTM4632 is available with SnPb (BGA) or RoHS com- n DDR Memory Power Supply pliant terminal finish n General Purpose Point-of-Load Conversion All registered trademarks and trademarks are the property of their respective owners. n Telecom, Networking and Industrial Equipment TYPICAL APPLICATION Output Efficiency vs Load Current QDR4 Memory Power Module Regulator 95 VDDQ 90 1.3V, 3A 22F PGOOD1 PGOOD2 V IN 4V V IN 85 3.6V TO 15V V OUT1 RUN1 VTT 10F V OUT2 RUN2 0.65V, 3A 25V LTM4632 22F 80 INTV VTTR 4V CC SYNC/MODE FB1 VTTR 75 TRACK/SS1 COMP1 0.65V, 10mA VDDQ V DDQIN COMP2 70 GND 52.3k 5V INPUT 12V INPUT 4632 TA01a 65 0 1 2 3 LOAD CURRENT (A) 4632 TA01b Rev. D 1 Document Feedback For more information www.analog.com EFFICIENCY (%)LTM4632 ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (See Pin Functions, Pin Configuration Table) (Note 1) V ............................................................. 0.3V to 16V IN TOP VIEW V ............................................................. 0.3V to 6V SYNC/ OUT COMP2 GND MODE GND COMP1 PGOOD1, PGOOD2 ..................................... 0.3V to 16V 5 GND RUN1, RUN2 ...................................... 0.3V to V +0.3V PGOOD2 IN V PGOOD1 DDQIN 4 FB1 INTV , TRACK/SS1, V , VTTR ......... 0.3V to 3.6V INTV CC CC DDQIN V IN VTTR 3 TRACK/SS1 SYNC/MODE, COMP1, COMP2, V IN RUN1 RUN2 2 FB1, FB2 ................................................0.3V to INTV V IN CC V IN GND Operating Internal Temperature Range V 1 V OUT2 OUT1 (Notes 2, 3, 5) ........................................ 40C to 125C A B C D E Storage Temperature Range .................. 55C to 125C LGA PACKAGE 25-LEAD (6.25mm 6.25mm 1.82mm) BGA PACKAGE 25-LEAD (6.25mm 6.25mm 2.42mm) Peak Solder Reflow Body Temperature .................260C T = 125C, = 17C/W, = 11C/W, JMAX JCtop JCbottom + = 22C/W, = 20C/W JB BA JA WEIGHT = 0.21g ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2) LTM4632EV PBF Au (RoHS) LTM4632V e4 LGA 3 40C to 125C LTM4632IV PBF Au (RoHS) LTM4632V e4 LGA 3 40C to 125C LTM4632EY PBF SAC305 (RoHS) LTM4632Y e1 BGA 3 40C to 125C LTM4632IY PBF SAC305 (RoHS) LTM4632Y e1 BGA 3 40C to 125C LTM4632IY SnPb (63/37) LTM4632Y e0 BGA 3 40C to 125C Contact the factory for parts specified with wider operating temperature Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures LGA and BGA Package and Tray Drawings Rev. D 2 For more information www.analog.com