LTM8001 36V , 5A Module IN Regulator with 5-Output Configurable LDO Array Fea T Descrip T n Complete Step-Down Switch Mode Power Supply The LTM 8001 is a 36V , 5A step-down Module regu- IN with Configurable Array of Five LDOs lator with a 5-output configurable LDO array. Operating n Step-Down Switching Power Supply over an input voltage range of 6V to 36V, the LTM8001 Adjustable 10% Accurate Output Current Limit buck regulator supports an output voltage range of 1.2V Constant-Current, Constant-Voltage Operation to 24V. Following the buck regulator is an array of five Wide Input Voltage Range: 6V to 36V 1.1A linear regulators whose outputs may be connected 1.2V to 24V Output Voltage in parallel to accommodate a wide variety of load combi- n Configurable Output LDO Array nations. Three of these LDOs are tied to the output of the Five 1.1A Parallelable Outputs buck regulator, while the other two are tied together to Outputs Adjustable from 0V to 24V an undedicated input. Low Output Noise: 90V (100Hz to 1MHz) RMS The low profile package (3.42mm) enables utilization of n 15mm 15mm 3.42mm Surface Mount unused space on the bottom of PC boards for high density BGA Package point of load regulation. The LTM8001 is packaged in a thermally enhanced, compact (15mm 15mm) and low profile (3.42mm) overmolded ball grid array (BGA) pack- a T age suitable for automated assembly by standard surface n FPGA, DSP, ASIC and Microprocessor Supplies mount equipment. The LTM8001 is available with SnPb n Servers and Storage Devices (BGA) or RoHS compliant terminal finish. n RF Transceivers L, LT, LTC, LTM, Module, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents, including 7199560, 7321203. Typical a T 5A Output DC/DC Module Converter 1.8V V IN45 V OUT0 1A V 1.2V IN V V IN0 OUT1 6V TO 36V LDO 1 1A 10F SET1 510k 1.1V RUN V OUT2 1.5A LDO 2 BIAS123 STEP-DOWN SET2 SWITCHING 3.3V BIAS45 LTM8001 V OUT3 REGULATOR COMP LDO 3 SET3 SS 0.9V V OUT4 V 1.5A LDO 4 REF SET4 ILIM V + SYNC OUT5 LDO 5 GND RT FBO SET5 4.7F 4.7F 2.2F 470F 100F 45.3k 54.9k 121k 118k 19.6k 8001 TA01 350kHz 8001fd 1 For more information www.linear.com/LTM8001 ion pplica ions pplica ion uresLTM8001 a Te Maxi Mu M r a T p in c F T (Note 1) TOP VIEW V ...........................................................................40V IN0 V SET4 V SET3 SET2 V OUT4 OUT3 OUT2 V , BIAS45 ...........................................................25V IN45 11 V OUT5 V OUT1 BIAS123 ....................................................................25V 10 FB0, RT, COMP, ILIM, V .........................................3V SET5 REF 9 SET1 V BIAS45 V .....................................................................25V REF OUT0-5 8 ILIM BIAS123 SYNC RUN, SYNC, SS ...........................................................6V 7 RT V IN45 SET1-5 (Relative to V , Respectively) ............0.3V GND OUT1-5 BANK 3 6 COMP Current Into SET1-5 ............................................. 10mA BANK 2 FBO 5 Current Into RUN Pin ............................................100A SS V OUT0 4 RUN BANK 4 Maximum Junction Temperature (Notes 2, 3) ....... 125C 3 Peak Solder Reflow Body Temperature ................. 245C V IN0 2 BANK 1 Storage Temperature.............................. 55C to 125C 1 A B C D E F G H J K L BGA PACKAGE 121 PADS (15mm 15mm 3.42mm) T = 125C, = 16.1C/W, = 5.99C/W, = 13.4C/W, = 4.98C/W JMAX JA JCbottom JCtop JB VALUES DETERMINED PER JEDEC 51-9, 51-12 WEIGHT = 1.8 GRAMS o r Der i n F Ma T PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2) LTM8001EY PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 40C to 125C LTM8001IY PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 40C to 125C LTM8001IY SnPb (63/37) LTM8001Y e0 BGA 3 40C to 125C LTM8001MPY PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 55C to 125C LTM8001MPY SnPb (63/37) LTM8001Y e0 BGA 3 55C to 125C Consult Marketing for parts specified with wider operating temperature Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly Terminal Finish Part Marking: LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8001fd 2 For more information www.linear.com/LTM8001 ion or ion igura on ings bsolu