LTM8049 Dual SEPIC or Inverting Module DC/DC Converter FEATURES DESCRIPTION n Two Complete Switch Mode Power Supplies The LTM 8049 is a Dual SEPIC/Inverting Module (power n SEPIC or Inverting Topology module) DC/DC Converter. Each of the two outputs can be n Wide Input Voltage Range: 2.6V to 20V easily configured as a SEPIC or Inverting converter by sim- n 2.5V to 24V or 2.5V to 24V Output Voltage ply grounding the appropriate output rail. The LTM8049 n 1A at 5V from 12V includes power devices, inductors, control circuitry and OUT IN n Selectable Switching Frequency: 200kHz to 2.5MHz passive components. All that is needed to complete the n Power Good Outputs for Event Based Sequencing design are input and output caps, and small resistors to n User Configurable Undervoltage Lockout set the output voltages and switching frequency. Other n (e4) RoHS Compliant Package with Gold Pad Finish components may be used to control the soft-start and n Low Profile 15mm 9mm 2.42mm Surface Mount undervoltage lockout. BGA Package The LTM8049 is packaged in a thermally enhanced, com- pact (15mm 9mm) over-molded Ball Grid Array (BGA) APPLICATIONS package suitable for automated assembly by standard n Battery Powered Regulator surface mount equipment. The LTM8049 is available with n Local Negative Voltage Regulator SnPb (BGA) or RoHS compliant terminal finish. n All registered trademarks and trademarks are the property of their respective owners. Low Noise Amplifier Power TYPICAL APPLICATION 12V from 2.7V to 20V Maximum Load Current vs V OUT IN IN IN 1.5 V V IN1 OUT1P V V IN OUT1 2.7V TO 20V 12V 4.7F FBX1 RUN1 2 130k V OUT1N RT1 1.0 22F 80.6k CLKOUT1 1MHz SYNC2 LTM8049 RT2 80.6k 0.5 V V IN2 OUT2P 1MHz 47F FBX2 RUN2 143k V OUT2N V OUT2 SYNC1 12V 0 0 5 10 15 20 V (V) IN PINS NOT USED: SS1, SS2, PG1, PG2, CLKOUT2, SHARE1, SHARE2 8049 TA01a 8049 TA01 Rev B 1 Document Feedback For more information www.analog.com LOAD CURRENT (A)LTM8049 ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) V , RUNn, PGn .......................................................20V TOP VIEW INn SYNCn, FBXn ..............................................................5V BANK 2 A V BANK 4 IN1 SSn ..........................................................................2.5V V OUT1P B RUN1 SHAREn ......................................................................2V BANK 1 GND FBX1 C SS1 V (V = 0V) ..................................................25V OUTP OUTN PG1 D SYNC1 V (V = 0V) ................................................25V OUTN OUTP BANK 6 CLKOUT1 V OUT1N E Maximum Internal Temperature ............................ 125C RT1 SHARE2 Maximum Solder Temperature ..............................260C F SHARE1 Storage Temperature.............................. 55C to 125C G RT2 BANK 7 CLKOUT2 V OUT2N H SYNC2 PG2 FBX2 J SS2 K RUN2 BANK 5 V BANK 3 OUT2P L V IN2 1 2 3 4 5 6 7 BGA PACKAGE 77-LEAD (15mm 9mm 2.42mm) T = 125C, = 16.2C/W, = 3.8C/W, = 8.8C/W, JMAX JA JB JCtop = 3.8C/W, = 4.6C/W, WEIGHT = 0.8g, JCbottom JCboard VALUES DETERMINED PER JEDEC 51-9, 51-12 ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2) LTM8049EY PBF SAC305 (RoHS) LTM8049Y e1 LTM8049IY PBF BGA 3 40C to 125C LTM8049IY SnPb (63/37) LTM8049 e0 Device temperature grade is indicated by a label on the shipping container. This product is not recommended for second side reflow. This product is moisture sensitive. For more information, go Pad or ball finish code is per IPC/JEDEC J-STD-609. to Recommended BGA PCB Assembly and Manufacturing BGA Package and Tray Drawings Procedures. Rev B 2 For more information www.analog.com