EFFICIENCY (%) LTM8055/LTM8055-1 36V , 8.5A Buck-Boost IN Module Regulator FEATURES DESCRIPTION n Complete Buck-Boost Switch Mode Power Supply The LTM 8055/LTM8055-1 is a 36V , buck-boost IN n V Equal, Greater, Less Than V Module (micromodule) regulator. Included in the pack- OUT IN n Wide Input Voltage Range: 5V to 36V age are the switching controller, power switches, inductor n 12V/3A Output from 6V and support components. A resistor to set the switching IN n 12V/6A Output from 12V frequency, a resistor divider to set the output voltage, IN n 12V/8.5A Output from 24V and input and output capacitors are all that are needed IN n Up to 97.5% Efficient to complete the design. Other features such as input and n Adjustable Input and Output Average Current Limits output average current regulation may be implemented n Input and Output Current Monitors with just a few components. The LTM8055/LTM8055-1 n Parallelable for Increased Output Current operates over an input voltage range of 5V to 36V, and n Wide Output Voltage Range: 1.2V to 36V can regulate output voltages between 1.2V and 36V. The n Selectable Switching Frequency: 100kHz to 800kHz SYNC input and CLKOUT output allow easy synchronization. n Synchronization from 200kHz to 700kHz The LTM8055/LTM8055-1 is housed in a compact over- n External Compensation (LTM8055-1) molded ball grid array (BGA) package suitable for auto- n 15mm 15mm 4.92mm BGA Package mated assembly by standard surface mount equipment. The LTM8055/LTM8055-1 is RoHS compliant. Buck-Boost Selection Table APPLICATIONS LTM8054 LTM8055/LTM8055-1 LTM8056 n High Power Battery-Operated Devices V (Operation) 36 36 58 IN n Industrial Control V Abs Max 40 40 60 IN n Solar Powered Voltage Regulator V Abs Max 40 40 60 OUT n Solar Powered Battery Charging I (Peak) 5.4 8.5 5.5 OUT 24V , 12V All registered trademarks and trademarks are the property of their respective owners. IN OUT Package 15 11.25mm 15 15mm 4.92mm BGA 3.42mm BGA Pin and Function Compatible TYPICAL APPLICATION Maximum Output Current and Efficiency vs V IN 12V from 5V to 36V Buck-Boost Regulator OUT IN IN 10 98 EFFICIENCY 96 V LTM8055/ V V IN OUT IN V OUT 8 LTM8055-1 5V TO 36V 12V SV IN OUTPUT 94 I OUT I IN CURRENT 6 92 68F 4.7F 100k RUN 50V 90 4 2 CTL 22F CLKOUT SS 88 25V I SYNC INMON 2 I COMP 36.5k OUTMON 11k 86 FB RT LL MODE GND 8055 TA01a 0 84 0 10 20 30 40 f = 600kHz V (V) SW IN 8055 TA01b Rev C 1 Document Feedback For more information www.analog.com OUTPUT CURRENT (A)LTM8055/LTM8055-1 ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) V , SV , V , RUN, I , I Voltage .....................40V TOP VIEW IN IN OUT IN OUT BANK 3 FB, SYNC, CTL, MODE Voltage ...................................6V SV V IN IN I , I Voltage .............................................6V INMON OUTMON 11 LL Voltage .................................................................15V 10 Maximum Junction Temperature (Notes 2, 3) ....... 125C I 9 BANK 1 IN Storage Temperature.............................. 55C to 125C GND 8 Peak Solder Reflow Body Temperature ................. 245C 7 6 5 4 RUN BANK 2 V OUT 3 I INMON 2 I OUTMON 1 GND A B C D E F G H J K L IOUT LL RT FB SS CLKOUT MODE SYNC CTL COMP BGA PACKAGE 121-LEAD (15mm 15mm 4.92mm) T = 125C, = 20.5C/W, = 11.0C/W, = 21.2C/W, = 10.5C/W, JMAX JA JCbottom JCtop JB WEIGHT = 2.8g, VALUES DETERMINED PER JEDEC JESD51-9, 51-12 ORDER INFORMATION PART NUMBER TERMINAL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (SEE NOTE 2) DEVICE FINISH CODE LTM8055EY PBF SAC305 (RoHS) LTM8055Y e1 BGA 3 40C to 125C LTM8055IY PBF SAC305 (RoHS) LTM8055Y e1 BGA 3 40C to 125C LTM8055IY SnPb(63/37) LTM8055Y e0 BGA 3 40C to 125C LTM8055MPY PBF SAC305 (RoHS) LTM8055Y e1 BGA 3 55C to 125C LTM8055MPY SnPb(63/37) LTM8055Y e0 BGA 3 55C to 125C LTM8055EY-1 PBF SAC305 (RoHS) LTM8055Y-1 e1 BGA 3 40C to 125C LTM8055IY-1 PBF SAC305 (RoHS) LTM8055Y-1 e1 BGA 3 40C to 125C Device temperature grade is indicated by a label on the shipping This product is not recommended for second side reflow. container. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. Pad or ball finish code is per IPC/JEDEC J-STD-609. BGA Package and Tray Drawings Rev C 2 For more information www.analog.com