EVALUATION KIT AVAILABLE MAX11156 18-Bit, 500ksps, 5V SAR ADC with Internal Reference in TDFN General Description Benefits and Features The MAX11156 18-bit, 500ksps, SAR ADC offers excellent High DC/AC Accuracy Improves Measurementuality AC and DC performance with true bipolar input range, 18-Bit Resolution with No Missing Codes small size, and internal reference. The MAX11156 measures 500ksps Throughput Rate Without Pipeline Delay/ a 5V (10V ) input range while operating from a Latency P-P 94.6dB SNR and -101.4dB THD at 10kHz single 5V supply. A patented charge-pump architecture allows direct sampling of high-impedance sources. The 1.6 LSB Transition Noise RMS 0.5 LSB DNL (typ) and 2.8 LSB INL (typ) MAX11156 integrates an optional internal reference and buffer, saving additional cost and space. Highly Integrated ADC Saves Cost and Space 6ppm/C (typ) Internal Reference This ADC achieves 94.6dB SNR and -101.4dB THD (typ). Internal Reference Buffer The MAX11156 guarantees 18-bit no-missing codes and 5V Bipolar Analog Input Range 2.8 LSB INL (typ). Wide Supply Range and Low Power Simplify The MAX11156 communicates using an SPI-compatible Power-Supply Design serial interface at 2.5V, 3V, 3.3V, or 5V logic. The serial 5V Analog Supply interface can be used to daisy-chain multiple ADCs in 2.3V to 5V Digital Supply parallel for multichannel applications and provides a busy 25.8mW Power Consumption at 500ksps indicator option for simplified system synchronization and 10A in Shutdown Mode timing. Multi-Industry Standard Serial Interface and The MAX11156 is offered in a 12-pin, 3mm x 3mm, Small Package Reduce Size TDFN package and is specified over the -40C to +85C SPI/QSPI/MICROWIRE /DSP-Compatible Serial temperature range. Interface Applications 3mm x 3mm Tiny 12-Pin TDFN Package Data Acquisition Systems Industrial Control Systems/Process Control Medical Instrumentation QSPI is a trademark of Motorola, Inc. Automatic Test Equipment MICROWIRE is a registered trademark of National Semiconductor Corporation. Selector Guide and Ordering Information appear at end of data sheet. Typical Operating Circuit 14-Bit to 18-Bit SAR ADC Family 14-BIT 16-BIT 16-BIT 18-BIT 500ksps 250ksps 500ksps 500ksps V OVDD 1F1DD F (5V) (2.3V TO 5V) 5V Input MAX11167 MAX11166 MAX11156 SCLK 10 Internal AIN+ DIN MAX11169 MAX11168 MAX11158 INTERFACE HOST 5V 18-BIT ADC DOUT AIN- AND CONTROL CONTROLLER 4.7nF Reference MAX9632 CNVST MAX11156 CONFIGURATION REGISTER 0 to 5V Input REF MAX11161 MAX11160 MAX11150 INTERNAL REFERENCE Internal REF BUF MAX11165 MAX11164 MAX11154 10F REFIO Reference 0.1F AGNDS GND 0 to 5V Input External MAX11262 MAX11163 MAX11162 MAX11152 Reference 19-6622 Rev 2 10/15MAX11156 18-Bit, 500ksps, 5V SAR ADC with Internal Reference in TDFN Absolute Maximum Ratings V to GND ............................................................-0.3V to +6V Continuous Power Dissipation (T = +70NC) DD A OVDD to GND ....... -0.3V to the lower of (V + 0.3V) and +6V TDFN (derate 18.2mW/NC above +70NC) ..................1349mW DD AIN+ to GND ........................................................................Q7V Operating Temperature Range ........................... -40NC to +85NC AIN-, REF, REFIO, AGNDS Junction Temperature ......................................................+150NC to GND ............... -0.3V to the lower of (V + 0.3V) and +6V Storage Temperature Range ............................ -65NC to +150NC DD SCLK, DIN, DOUT, CNVST Lead Temperature (soldering, 10s) .................................+300NC to GND ............... -0.3V to the lower of (V + 0.3V) and +6V Soldering Temperature (reflow) .......................................+260NC DD Maximum Current into Any Pin...........................................50mA Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) TDFN Junction-to-Ambient Thermal Resistance ( q )........59.3C/W JA Junction-to-Case Thermal Resistance ( q ) ............22.5C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 4.75V to 5.25V, V = 2.3V to 5.25V, f = 500ksps, V = 4.096V, Reference Mode 3 T = T to T , unless DD OVDD SAMPLE REF A MIN MAX otherwise noted. Typical values are at T = +25NC.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ANALOG INPUT (Note 3) Input Voltage Range AIN+ to AIN-, K = 5.0/4.096 -K x V +K x V V REF REF -(V + +(V + DD DD AIN+ to GND 0.1) 0.1) Absolute Input Voltage Range V AIN- to GND -0.1 +0.1 Input Leakage Current Acquisition phase -10 +0.001 +10 A Input Capacitance 16 pF Input-Clamp Protection Current Both inputs -20 +20 mA DC ACCURACY (Note 4) Resolution N 18 Bits No Missing Codes 18 Bits Offset Error -15 2.8 +15 LSB Offset Temperature Coefficient 0.002 LSB/C Gain Error -10 3.1 +10 LSB Gain Error Temperature 0.023 LSB/C Coefficient Integral Nonlinearity -6 2.8 +6 LSB Differential Nonlinearity DNL Guaranteed by design -0.9 0.5 +0.9 LSB Positive Full-Scale Error -17 +17 LSB Negative Full-Scale Error -15 +15 LSB Maxim Integrated 2 www.maximintegrated.com