EVALUATION KIT AVAILABLE Click here to ask about the production status of specific part numbers. MAX12930/MAX12931 Two-Channel, Low-Power, 3kV and 5kV Digital Isolators RMS RMS General Description Benefits and Features The MAX12930/MAX12931 are a family of 2-channel, Robust Galvanic Isolation of Digital Signals 3kV/5kV digital galvanic isolators using Maxims Withstands 5kV for 60s (V ) Wide-Body RMS RMS ISO proprietary process technology. These devices transfer Withstands 3kV for 60s (V ) Narrow-Body RMS ISO digital signals between circuits with different power domains Continuously Withstands 848V (V ) Wide- RMS IOWM while using as little as 0.65mW per channel at 1Mbps with 1.8V. Body Continuously Withstands 445V (V ) RMS IOWM The two channels of the MAX12931 transfer data in Narrow-Body opposite directions, and this makes the MAX12931 ideal Withstands 10kV Surge Between GNDA and for isolating the TX and RX lines of a transceiver. The GNDB with 1.2/50s Waveform MAX12930 features two channels transferring data in the High CMTI (50kV/s, typ) same direction. Options to Support a Broad Range of Applications Both devices are available with a maximum data rate 2 Data Rates (25Mbps/150Mbps) of either 25Mbps or 150Mbps and with the default 2 Channel Direction Configurations outputs that are either high or low. The default is 2 Output Default States (High or Low) the state the output assumes when the input is not Low Power Consumption powered, or if the input is open-circuit. See the 1.3mW per Channel at 1Mbps with V = 3.3V DD Ordering Information and Product Selector Guide for 3.3mW per Channel at 100Mbps with V = 1.8V DD suffixes associated with each option. Independent 1.71V to 5.5V supplies on each side of the isolator also make Safety Regulatory Approvals the devices suitable for use as level translators. (see Safety Regulatory Approvals) UL According to UL1577 The MAX12930/MAX12931 are available in an 8-pin, cUL According to CSA Bulletin 5A narrow-body SOIC package. In addition, the MAX12931 VDE 0884-11 Basic Insulation (Narrow SOIC) is available in a 16-pin, wide-body SOIC package. The package material of the 8-pin narrow-body SOIC package Applications has a minimum comparative tracking index (CTI) of 400V, Fieldbus Communications for Industrial Automation which gives it a group II rating in creepage tables. The Isolated RS232, RS-485/RS-422, CAN package material of the 16-pin wide-body SOIC package General Isolation Application has a CTI of 600V, which gives it a group I rating in creep- Battery Management age tables. All devices are rated for operation at ambient Medical Systems temperatures of -40C to +125C. Ordering Information and Product Selector Guide appear at end of data sheet. Functional Diagrams MAX12930 MAX12931 VDDA VDDB VDDA VDDB IN1 OUT1 OUT1 IN1 OUT2 OUT2 IN2 IN2 GNDA GNDB GNDA GNDB 19-8563 Rev 9 11/20MAX12930/MAX12931 Two-Channel, Low-Power, 3kV and 5kV Digital Isolators RMS RMS Absolute Maximum Ratings V to GNDA ........................................................-0.3V to +6V Continuous Power Dissipation (T = +70C) DDA A V to GNDB ........................................................-0.3V to +6V Wide SOIC (derate 14.1mW/C above +70C) ......1126.8mW DDB IN on Side A to GNDA ...........................................-0.3V to +6V Narrow SOIC (derate 5.79mW/C above +70C) ...462.96mW IN on Side B to GNDB ..........................................-0.3V to +6V Operating Temperature Range ......................... -40C to +125C OUT on Side A to GNDA ........................ -0.3V to V + 0.3V Maximum Junction Temperature .....................................+150C DDA OUT on Side B to GNDB ....................... -0.3V to V + 0.3V Storage Temperature Range ............................ -60C to +150C DDB Short-Circuit Duration Soldering Temperature (reflow) .......................................+260C OUT on Side A to GNDA, OUT on Side B to GNDB .....................................Continuous Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 8 NARROW SOIC Package Code S8MS-22 Outline Number 21-0041 Land Pattern Number 90-0096 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 172.8C/W JA Junction to Case ( ) 67.6C/W JC PACKAGE TYPE: 16 WIDE SOIC Package Code W16MS-11 Outline Number 21-0042 Land Pattern Number 90-0107 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 71C/W JA Junction to Case ( ) 23C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com