EVALUATION KIT AVAILABLE Click here to ask about the production status of specific part numbers. MAX13030EMAX13035E 6-Channel High-Speed Logic-Level Translators General Description Features Compatible with 4mA Input Drivers or Larger The MAX13030EMAX13035E 6-channel, bidirectional level translators provide the level shifting necessary for 100Mbps Guaranteed Data Rate 100Mbps data transfer in multivoltage systems. The Six Bidirectional Channels MAX13030EMAX13035E are ideally suited for memory- Clock Return Output (MAX13035E) card level translation, as well as generic level translation Enable Input (MAX13030EMAX13034E) in systems with six channels. Externally applied voltages, 15kV ESD Protection on I/O V Lines CC V and V , set the logic levels on either side of the CC L +1.62V V +3.2V and +2.2V V +3.6V L CC device. Logic signals present on the V side of the device L Supply Voltage Range appear as a higher voltage logic signal on the V side CC Lead-Free, 16-Bump UCSP (2mm x 2mm) and of the device and vice versa. The MAX13035E features 16-pin TQFN (4mm x 4mm) Packages a CLK RET output that returns the same clock signal applied to the CLK V input. L Typical Operating Circuits The MAX13030EMAX13035E operate at full speed with external drivers that source as little as 4mA +3.3V output current. Each I/O channel is pulled up to V +1.8V CC or V by an internal 30A current source, allowing the L MAX13030EMAX13035E to be driven by either push- 0.1F 0.1F 1F pull or open-drain drivers. The MAX13030EMAX13034E feature an enable (EN) V V L CC input that places the device into a low-power shutdown +1.8V +3.3V SYSTEM SD CARD mode when driven low. The MAX13030EMAX13035E MAX13035E CONTROLLER features an automatic shutdown mode that disables the part when V is less than V . The state of I/O V and I/O DAT3 I/O V I/O V L DAT3 CC L CC CC I/O V I/O V V during shutdown is chosen by selecting the appropri- DAT2 L CC DAT2 L I/O V I/O V DAT1 L CC DAT1 ate part version (see Ordering Information/Selector Guide). I/O V DAT0 I/O V CC DAT0 L The MAX13030EMAX13035E accept V voltages from CC I/O V CMD I/O V CC L CMD +2.2V to +3.6V and V voltages from +1.62V to +3.2V, L CLOCK CLK V CLK V L CC CLOCK making them ideal for data transfer between low-voltage CLK RET CLOCK IN ASIC/PLDs and higher voltage systems. The MAX13030E GND GND GND MAX13035E are available in 16-bump UCSP (2mm x 2mm) and 16-pin TQFN (4mm x 4mm) packages, and operate over the extended -40C to +85C temperature range. Typical Operating Circuits continued at end of data sheet. Applications SD Card Level Translation Functional Diagram and Pin Configurations appear at end MiniSD Card Level Translation of data sheet. MMC Level Translation Transflash Level Translation Memory Stick Card Level Translation Ordering Information/Selector Guide I/O V STATE DURING I/O V STATE DURING L CC PART PIN-PACKAGE PKG CODE SHUTDOWN SHUTDOWN MAX13030EEBE+ 16 UCSP High impedance High impedance B16+1 MAX13030EETE+ 16 TQFN-EP** High impedance High impedance T1644+4 MAX13035EETE/V+T 16 TQFN-EP** High impedance High impedance T1644+4 Note: All devices are specified over the -40C to +85C operating Ordering Information/Selector guide continued at end of temperature range. data sheet. +Denotes a lead-free package. **EP = Exposed paddle. 19-0626 Rev 2 2/21MAX13030EMAX13035E 6-Channel High-Speed Logic-Level Translators Absolute Maximum Ratings (All voltages referenced to GND.) Operating Temperature Range ........................... -40C to +85C V , V ...................................................................-0.3V to +4V Storage Temperature Range ............................ -65C to +150C CC L I/O V , CLK V ................................. -0.3V to (V + 0.3V) Junction Temperature ......................................................+150C CC CC CC I/O V , CLK V , CLK RET ....................... -0.3V to (V + 0.3V) Bump Temperature (soldering) ........................................+235C L L L EN............................................................................-0.3V to +4V Lead Temperature (soldering, 10s) .................................+300C Short-Circuit Duration I/O V , I/O V , L CC CLK V , CLK V , CLK RET to GND ....................Continuous CC L Continuous Power Dissipation (T = +70C) A 16-Bump UCSP (derate 8.2mW/C) ............................660mW 16-Pin TQFN (derate 25.0mW/C) ............................2000mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 16 UCSP Package Code B16+1 Outline Number 21-0101 Land Pattern Number THERMAL RESISTANCE, MULTI-LAYER BOARD: Junction to Ambient ( ) 121.3C/W JA Junction to Case ( ) JC 16 TQFN Package Code T1644+4/T1644+4A Outline Number 21-0139 Land Pattern Number 90-0070 THERMAL RESISTANCE, MULTI-LAYER BOARD: Junction to Ambient ( ) 40C/W JA Junction to Case ( ) 6C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com