Click here for production status of specific part numbers. MAX13046E/MAX13047E Single- and Dual-Bidirectional Low-Level Translator General Description Features The MAX13046E/MAX13047E 15kV ESD-protected Bidirectional Level Translation bidirectional level translators provide level shifting for Operation Down to +1.1V on V L data transfer in a multivoltage system. The MAX13046E Ultra-Low Supply Current in Shutdown Mode 1A is a single-channel translator, and the MAX13047E is a (max) dual-channel translator. Externally applied voltages, V CC Guaranteed Push-Pull Driving Data Rate and V , set the logic level on either side of the device. The L 8Mbps (+1.2V V +3.6V, V +5.5V) L CC MAX13046E/MAX13047E utilize a transmission-gate- 16Mbps (+1.8V V V +3.3V) L CC based design to allow data translation in either direction (V V ) on any single data line. The MAX13046E/ Extended ESD Protection on the I/O V Lines L CC CC 15kV Human Body Model MAX13047E accept V from +1.1V to the minimum of L either +3.6V or (V + 0.3V), and V from +1.65V 15kV IEC61000-4-2 Air-Gap Discharge Method CC CC 8kV IEC61000-4-2 Contact Discharge to +5.5V, making these devices ideal for data transfer between low-voltage ASICs/PLDs and higher voltage Low Supply Current systems. Short-Circuit Protection The MAX13046E/MAX13047E feature a shutdown mode Space-Saving DFN and UTQFN Packages that reduces supply current to less than 1A thermal short-circuit protection, and 15kV ESD protection on Pin Configurations the V side for enhanced protection in applications that CC route signals externally. The MAX13046E/MAX13047E TOP VIEW operate at a guaranteed data rate of 8Mbps when push- MAX13046E pull driving is used. V I/O V CC SHDN CC The MAX13046E is available in a 6-pin DFN package, 6 5 4 and the MAX13047E is available in a 10-pin UTQFN. Both devices are specified over the extended -40C to +85C operating temperature range. Applications + 1 2 3 2 I C and 1-Wire Level Translation V GND I/O V L1 L CMOS Logic-Level Translation DFN Cell Phones 1mm x 1.5mm Portable Devices MAX13047E V N.C. CC Ordering Information/Selector Guide 7 6 NUMBER OF TOP PART PIN-PACKAGE CHANNELS MARK 8 5 I/O V I/O V CC2 CC1 6 DFN MAX13046EELT+ 1 OC GND 9 4 SHDN (1mm x 1.5mm) 10 UTQFN 10 3 N.C. MAX13047EEVB+ 2 AAC I/O V L1 (1.4mm x 1.8mm) + 1 2 Note: All devices are specified over the extended -40C to I/O V V +85C operating temperature range. L2 L UTQFN +Denotes a lead-free/RoHS-compliant package. 1.4mm x 1.8mm 1-Wire is a registered trademark of Maxim Integrated Products, Inc. Typical Application Circuits appear at end of data sheet. 19-4149 Rev 2 10/19MAX13046E/MAX13047E Single- and Dual-Bidirectional Low-Level Translator Absolute Maximum Ratings (All voltages referenced to GND.) Junction-to-Ambient Thermal Resistance ( ) (Note 1) JA V ..........................................................................-0.3V to +6V 6-Pin DFN ................................................................477C/W CC V ............................................................................-0.3V to +4V 10-Pin UTQFN ..........................................................20.1C/W L I/O V ..................................................... -0.3V to (V + 0.3V) Junction-to-Ambient Thermal Resistance ( ) (Note 1) CC CC JC I/O V ..........................................................-0.3V to (V + 0.3V) 6-Pin DFN ...............................................................20.1C/W L L SHDN ......................................................................-0.3V to +6V 10-Pin UTQFN ........................................................143.1C/W Short-Circuit Duration I/O V , I/O V to GND ........Continuous Operating Temperature Range ........................... -40C to +85C L CC Power Dissipation (T = +70C) Junction Temperature ......................................................+150C A 6-Pin DFN (derate 2.1mW/C above +70C) ............168mW Storage Temperature Range ............................ -65C to +150C 10-Pin UTQFN (derate 6.9mW/C above +70C) .......559mW Lead Temperature (soldering, 10s) .................................+300C Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (V = +1.65V to +5.5V, V = +1.1V to minimum of either +3.6V or ((V + 0.3V)), I/O V and I/O V are unconnected, T = -40C CC L CC L CC A to +85C, unless otherwise noted. Typical values are V = +3.3V, V = +1.8V at T = +25C.) (Notes 2, 3) CC L A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY V > 3.3V 1.1 3.6V CC V Supply Range V V L L V 3.3V 1.1 V + 0.3V CC CC V Supply Range V 1.65 5.5 V CC CC Supply Current from V I 10 A CC QVCC Supply Current from V I 15 A L QVL V Shutdown-Mode Supply Current I T = +25C, SHDN = GND 0.03 1 A CC SD-VCC A V Shutdown-Mode Supply Current I T = +25C, SHDN = GND 0.03 1 A L SD-VL A I/O V and I/O V Shutdown-Mode L CC I T = +25C, SHDN = GND 0.02 0.5 A SD-LKG A Leakage Current SHDN Input Leakage T = +25C 0.02 0.1 A A ESD PROTECTION Human Body Model 15V I/O V (Note 4) IEC 61000-4-2 Air-Gap Discharge 15V kV CC IEC 61000-4-2 Contact Discharge 8V All Other Pins Human Body Model 2 kV LOGIC-LEVEL THRESHOLDS I/O V Input-Voltage High V V - 0.2 V L IHL L I/O V Input-Voltage Low V 0.15 V L ILL Maxim Integrated 2 www.maximintegrated.com