MAX13171E/MAX13173E/MAX13175E TXD A (103) TXD B SCTE A (113) SCTE B TXC A (114) TXC B RXC A (115) RXC B RXD A (104) RXD B SG (102) SHIELD (101) RTS A (105) RTS B DTR A (108) DTR B DCD A (107) DCD B DSR A (109) DSR B CTS A (106) CTS B LL A (141) 19-4595 Rev 3 8/11 Multiprotocol, Pin-Selectable Data Interface Chipset General Description Features Supports V.28 (RS-232), V.10 (RS-423), V.11 The MAX13171E along with the MAX13173E/ (RS-449/V.36, RS-530, RS-530A, X.21) and V.35 MAX13175E, form a complete pin-selectable data termi- Protocols nal equipment (DTE) or data communication equipment (DCE) interface port that support the V.28 (RS-232), Pin-Selectable Cable Termination Using the V.10/V.11 (RS-449/V.36, RS-530, RS-530A, X.21), and MAX13175E V.35 protocols. The MAX13171E transceivers carry the Pin-Selectable DCE/DTE Configurations high-speed clock and data signals, while the MAX13173E transceivers carry the control signals. The MAX13171E 20/40Mbps (max) Data Rate in RS-449, RS-530, can be terminated by the MAX13175E pin-selectable RS-530A, X.21, and V.35 resistor termination network. The MAX13175E contains six True Fail-Safe Receivers while Maintaining V.11 pin-selectable, multiprotocol cable termination networks. and V.35 Compatibility The MAX13171E/MAX13173E have an internal charge Operates Over a Wide +3.135V to +5.5V V CC pump and low-dropout transmitter output stages that Supply Range allow V.10-, V.11-, V.28-, and V.35-compliant operation from a single supply. The MAX13171E/MAX13173E fea- Flexible V Logic Reference Input Allows L ture a no-cable mode that reduces supply current and Interfacing Down to 1.62V disables all transmitter and receiver outputs (high imped- Extended ESD Protection for All the Transmitter ance). Short-circuit current limiting and thermal shutdown Outputs and Receivers Inputs to GND circuitry protects the receiver and transmitter outputs against excessive power dissipation. The MAX13171E/ Small, 5mm x 7mm, 38-Pin TQFN Package MAX13173E have extended ESD protection for all the transmitter outputs and receivers inputs. Ordering Information The MAX13171E/MAX13173E/MAX13175E operate over the +3.135V to +5.5V supply range and are available in PIN- PART TEMP RANGE 5mm x 7mm, 38-pin TQFN packages. These devices oper- PACKAGE ate over the -40C to +85C extended temperature range. MAX13171EETU+ -40 C to +8 5C 38 TQFN-EP* Applications MAX13173EETU+ -40 C to +8 5C 38 TQFN-EP* Data Networking Telecommunication MAX13175EETU+ -40 C to +8 5C 38 TQFN-EP* Equipment +Denotes a lead(Pb)-free/RoHS-compliant package. PCI Cards *EP = Exposed pad. Data Routers CSU and DSU Data Switches Typical Operating Circuit LL CTS DSR DCD DTR RTS RXD RXC TXC SCTE TXD MAX13173E MAX13171E T4 T3 T2 T1 T3 T2 T1 R4 R3 R2 R1 R3 R2 R1 MAX13175E 18 13 5 10 8 22 6 23 20 19 4 1 7 16 3 9 17 12 15 11 24 14 2 DB-25 CONNECTOR Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLEMultiprotocol, Pin-Selectable Data Interface Chipset ABSOLUTE MAXIMUM RATINGS (All voltages to GND, unless otherwise noted.) Logic-Output Voltages Supply Voltages R OUT ........................................................-0.3V to (V + 0.3V) L V ........................................................................ -0.3V to +6V Transmitter Outputs CC V ........................................................................... -0.3V to +6V T OUT , T OUT /R IN L V ..................................................................... +0.3V to -7.1V (no-cable, V.28, V.10 modes) ...............................-15V to +15V EE V .................................................................... -0.3V to +7.1V Short-Circuit Duration to GND..................................Continuous DD V to V ............................................................-0.3V to +6V Receiver Inputs DD CC Logic-Input Voltages R IN , T OUT /R IN ............................................-15V to +15V M0, M1, M2, DCE/DTE, LATCH, INVERT, T IN..... -0.3V to +6V R INA to R INB, T3OUTA/R3INA Termination Network Inputs to T3OUTB/R3INB ................................................-15V to +15V R A, R B, R C.......................................................-15V to +15V Continuous Power Dissipation (T = +70C) A R A to R B (only for high-Z state) .....................................14V 38-Pin TQFN (derate 35.7mW/C above +70C) ........2857mW R A to R B...........................................................................6V Operating Temperature Range ...........................-40C to +85C R A to R C (only for high-Z state) .....................................14V Junction Temperature......................................................+150C R A to R C...........................................................................3V Storage Temperature Range ............................-65C to +150C R B to R C (only for high-Z state) .......................................3V Lead Temperature (soldering, 10s) ................................+300C Soldering Temperature (reflow) ......................................+260C PACKAGE THERMAL CHARACTERISTICS (Note 1) TQFN Junction-to-Ambient Thermal Resistance ( ) .............28C/W JA Junction-to-Case Thermal Resistance ( ) ....................1C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to