Click here for production status of specific part numbers. MAX14430MAX14432 Four-Channel, Fast, Low-Power, 3kV and 3.75kV Digital Isolators RMS RMS General Description Benefits and Features The MAX14430/MAX14431/MAX14432 are fast, low power, Robust Galvanic Isolation for Fast Digital Signals 4-channel, digital galvanic isolators using Maxims propri- Up to 200Mbps Data Rate etary process technology. These devices transfer digital Continuously Withstands 445V (V ) RMS IOWM Withstands 3.75kV for 60s (V ) Narrow signals between circuits with different power domains RMS ISO while using as little as 0.58mW per channel at 1Mbps with SOIC Package Withstands 3kV for 60s (V ) QSOP Package a 1.8V supply. The MAX14430MAX14432 have an iso- RMS ISO lation rating of 3kV (QSOP package) or 3.75kV Withstands 10kV Surge between GNDA and RMS RMS GNDB with 1.2/50s Waveform Narrow SOIC (narrow SOIC package) for 60 seconds. For applica- Package tions requiring 5kV of isolation, see the MAX14434- RMS Withstands 7.5kV Surge between GNDA and MAX14436. GNDB with 1.2/50s Waveform QSOP Package The MAX14430MAX14432 family offers all three pos- High CMTI (50kV/s, Typical) sible unidirectional channel configurations to accom- Low Power Consumption modate any 4-channel design, including SPI, RS-232, 1.1mW per Channel at 1Mbps with V = 3.3V RS-485, and digital I/O applications. Output enable for DD 3.5mW per Channel at 100Mbps with V = 1.8V the A side of the MAX14431R/S/U/V is active-low, making DD them ideal for isolating a port on a shared SPI bus since Options to Support a Broad Range of Applications the CS signal can directly enable the MISO signal on the 2 Data Rates (25Mbps, 200Mbps) isolator. All other devices in the family have the traditional 3 Channel Direction Configurations active-high enable. 2 Output Default States (High/Low) Devices are available with a maximum data rate of either Two Packages (Narrow SOIC and QSOP) 25Mbps or 200Mbps and with outputs that are either Applications default-high or default-low. The default is the state the Isolated SPI Interface output assumes when the input is either not powered or is Fieldbus Communications for Industrial Automation open-circuit. See the Ordering Information and Product Isolated RS-485/RS-422, CAN Selector Guide for suffixes associated with each option. Battery Management Independent 1.71V to 5.5V supplies on each side of the Medical Systems isolator also make the devices suitable for use as level translators. Safety Regulatory Approvals The MAX14430MAX14432 are available either in a UL According to UL1577 16-pin narrow-body SOIC package with 4mm of creep- cUL According to CSA Bulletin 5A age and clearance, or in a smaller 16-pin QSOP package with 3.8mm of creepage and clearance. The SOIC pack- age material has a minimum comparative tracking index (CTI) of 600V, which gives it a group 1 rating in creepage table. The QSOP package material has a minimum CTI of Ordering Information appears at end of data sheet. 400V, which gives it a group 2 rating in creepage table. All devices are rated for operation at ambient temperatures of -40C to +125C. 19-100198 Rev 3 7/19MAX14430MAX14432 Four-Channel, Fast, Low-Power, 3kV and 3.75kV Digital Isolators RMS RMS Absolute Maximum Ratings V to GNDA ........................................................-0.3V to +6V Continuous Power Dissipation (T = +70C) DDA A V to GNDB ........................................................-0.3V to +6V Narrow SOIC (derate 13.3mW/C above +70C) ....1066.7mW DDB IN , EN on Side A to GNDA ..................................-0.3V to +6V QSOP (derate 9.6mW/C above +70C) ....................771.5mW IN , EN on Side B to GNDB .................................-0.3V to +6V Operating Temperature Range ......................... -40C to +125C OUT on Side A to GNDA ......................-0.3V to (V + 0.3V) Maximum Junction Temperature .....................................+150C DDA OUT on Side B to GNDB .....................-0.3V to (V + 0.3V) Storage Temperature Range ............................ -60C to +150C DDB Short-Circuit Duration Soldering Temperature (reflow) .......................................+260C OUT on Side A to GNDA, OUT on Side B to GNDB .....................................Continuous Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 16 NARROW SOIC Package Code S16MS+12 Outline Number 21-0041 Land Pattern Number 90-0442 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 75C/W JA Junction to Case ( ) 24C/W JC PACKAGE TYPE: 16 QSOP Package Code E16MS+1F Outline Number 21-0055 Land Pattern Number 90-0167 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 103.7C/W JA Junction to Case ( ) 37C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com