Click here for production status of specific part numbers. MAX14720/MAX14750 Power-Management Solution General Description Benefits and Features The MAX14720/MAX14750 are compact power-management Extended System Battery Use Time solutions for space-constrained, battery-powered applications Micro-I 250mW Buck-Boost Regulator Q where size and efficiency are critical. Both devices integrate Input Voltage from 1.8V to 5.5V a power switch, a linear regulator, a buck regulator, and a Output Voltage Programmable from 2.5V to 5V buck-boost regulator. 1.1A Quiescent Current Programmable Current Limit The MAX14720 is designed to be the primary power- Micro-I 200mA Buck Regulator management device and is ideal for either non-rechargeable Q battery (coin-cell, dual alkaline) applications or for Input Voltage from 1.8V to 5.5V rechargeable solutions where the battery is removable Output Voltage Programmable from 1.0V to 2.0V and charged separately. The device includes a button 0.9A Quiescent Current monitor and sequencer. Micro-I 100mA LDO Q Input Voltage From 1.71V to 5.5V The MAX14750 works well as a companion to a charger Output Programmable From 0.9V to 4.0V or PMIC in rechargeable applications. It provides direct 0. 9A Quiescent Current pin control of each function and allows greater flexibility Configurable as Load Switch for controlling sequencing. Extend Product Shelf-Life The devices include two programmable micro-I , high- Q Battery Seal Mode (MAX14720) efficiency switching converters: a buck-boost regulator 120nA Battery Current and a synchronous buck regulator. These regulators Power Switch On-Resistance feature a burst mode for increased efficiency during light- 250m (max) at 2.7V load operation. 500m (max) at 1.8V The low-dropout linear regulator has a programmable Battery Impedance Detector output. It can also operate as a power switch that can disconnect the quiescent load of system peripherals. Easy-to-Implement System Control Configurable Power Mode and Reset Behavior The devices also include a power switch with battery- (MAX14720) monitoring capability. The switch can isolate the battery Push-Button Monitoring to Enable Ultra-Low from all system loads to maximize battery life when not Power Shipping Mode operating. It is also used to isolate the battery-impedance Disconnects All Loads From Battery and measurements. This switch can operate as a general- Reduces Leakage to Less than 1A purpose load switch as well. Power-On Reset (POR) Delay and Voltage The MAX14720 includes a programmable power controller Sequencing that allows the device to be configured either for use in Individual Enable Pins (MAX14750) applications that require a true off state or for always-on Voltage Monitor Multiplexer applications. This controller provides a delayed reset signal, 2 I C Control Interface voltage sequencing, and customized button timing for on/off control and recovery hard reset. Applications Both devices also include a multiplexer for monitoring the Wearable Medical Devices power inputs and outputs of each function. Wearable Fitness Devices These devices are available in a 25-bump, 0.4mm pitch, Portable Medical Devices 2.26mm x 2.14mm wafer-level package (WLP) and operate over the -40C to +85C extended temperature range. Ordering Information appears at end of data sheet. 19-7685 Rev 11 2/20MAX14720/MAX14750 Power-Management Solution Absolute Maximum Ratings (Voltages Referenced to GND.) Continuous-Current into HVIN, BIN, SWIN .................1000mA BIN, LIN, SDA, SCL, SWIN, BEN, SWOUT, SWEN, Continuous-Current into Any Other Terminal ................100mA LEN, HVEN, HVIN, HVOUT, MON, CAP, V , Continuous Power Dissipation (multilayer board at +70C): CC MPC, KIN, RST, KOUT ................................... -0.3V to +6.0V 5x5 Array 25-Ball 2.26mm x 2.14mm 0.4mm Pitch WLP HVILX ......................................................-0.3V to V + 0.3V (derate 19.07mW/C) ...................................................1.525W HVIN HVOLX ................................................-0.3V to V + 0.3V Operating Temperature Range .......................... -40C to +85C HVOUT BLX, BOUT ..............................................-0.3V to (V + 0.3V) Junction Temperature ......................................................+150C BIN LOUT ....................................................... -0.3V to (V + 0.3V) Storage Temperature Range ........................... -65C to +150C LIN GND...................................................................... -0.3V to +0.3V Lead Temperature (soldering 10s) .................................+300C Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 25 WLP Package Code W252M2+1 Outline Number 21-0788 Land Pattern Number Refer to Application Note 1891 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 52.43C/W JA For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com