EVALUATION KIT AVAILABLE Click here to ask about the production status of specific part numbers. MAX14782E 500Kbps 3.3V to 5V RS-485/RS-422 Transceiver with 35kV HBM ESD Protection General Description Benefits and Features Integrated Protection Increases End Equipment The MAX14782E is a half duplex RS-485/422 transceiver Up-Time that operates at either 3.3V or 5V rails with high 35kV ESD performance and up to 500kbps data rate. High ESD Protection 35kV HBM ESD per JEDEC JS-001-2012 20kV Air Gap ESD per IEC 61000-4-2 12kV Contact ESD per IEC 61000-4-2 4kV EFT per IEC 61000-4-4 Short-Circuit-Protected Outputs True Fail-Safe Receiver Prevents False Transition- Functional Diagram on Receiver Input Short or Open Events Hot-Swap Capability Eliminates False Transitions V CC During Power-Up or Hot Insertion 3V to 5.5V Supply Voltage Range Data Rates up to 500kbps MAX14782E -40C to +125C Operating Temperature Allows Up to 32 Transceivers On the Bus RO R Low 10A (max) Shutdown Current for Lower Power Consumption RE B Applications SHUTDOWN A Motion Controllers DE Field Bus Networks Encoder Interfaces Backplane Buses DI D GND Ordering Information/Selector Guide appear at end of data sheet. 19-6776 Rev 2 7/20MAX14782E 500Kbps 3.3V to 5V RS-485/RS-422 Transceiver with 35kV HBM ESD Protection Absolute Maximum Ratings (Voltages referenced to GND.) Junction Temperature ......................................................+150 C V .....................................................................-0.3V to +6.0V Storage Temperature Range ............................ -65 C to +150C CC RO ............................................................ -0.3V to (V + 0.3V) Continuous Power Dissipation (T = +70C) CC A RE, DE, DI ............................................................-0.3V to +6.0V SO (derate at 7.6mW/C above +70C) ......................606mW TDFN-EP (derate at 24.4mW/C above +70C) ........1951mW A, B (V 3.6V) .............................................-8.0V to +13.0V CC MAX (derate at 4.8mW/C above +70C)..................387mW A, B (V < 3.6V) .............................................-9.0V to +13.0V CC Lead Temperature (soldering, 10s) .................................+300C Short-Circuit Duration (RO, A, B) to GND .................Continuous Soldering Temperature (reflow) ...................................... +260 C Operating Temperature Range MAX14782EA ............................................. -40 C to +125C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 8 SO Package Code S8+4 Outline Number 21-0041 Land Pattern Number 90-0096 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 132C/W JA Junction to Case ( ) 38C/W JC PACKAGE TYPE: 8 TDFN Package Code T833+2 Outline Number 21-0137 Land Pattern Number 90-0059 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 41C/W JA Junction to Case ( ) 8C/W JC PACKAGE TYPE: 8 MAX Package Code U8+1 Outline Number 21-0036 Land Pattern Number 90-0092 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 206C/W JA Junction to Case ( ) 42C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com