EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX14838/MAX14839 24V Pin-Configurable Industrial Sensor Output Drivers General Description The MAX14838/MAX14839 24V/100mA drivers are Benefits and Features optimized for use in industrial sensors. These devices High Configurability Simplifies Design integrate all of the high-voltage (24V) circuitry commonly Pin-Selectable High-Side (PNP), Low-Side (NPN), found in industrial sensors, including a configurable PNP/ or Push-Pull Driver NPN/push-pull driver and an integrated linear regulator Pin-Configurable NO/NC Logic that meets common sensor power requirements. Integrated Protection Provides Robust Sensor The MAX14838/MAX14839 are pin-configurable. Logic Solutions inputs allow the driver to be configured for high-side Reverse-Polarity Protection on DO, V , and GND CC (PNP), low-side (NPN), or push-pull operation. An 4.75V to 34V Supply Range (MAX14839) additional input allows the user to select between normal- Driver is Short-Circuit Protected ly-open and normally-closed logic. FAULT Output for Fault Indication V Hot Plug Protection The MAX14838 features an onboard 5V linear regulator, CC while the MAX14839 features a 3.3V linear regulator. Thermal Shutdown Protection 1kV/500 Surge Protection Each device includes two LED drivers for visual feedback. 8kV IEC 61000-4-2 Air Gap ESD Protection One LED driver reflects the output logic status and the 6kV IEC 61000-4-2 Contact ESD Protection other is a general-purpose driver that can be used to -40C to +105C Temperature Range signal a fault condition. Fast Turn-Off of Inductive Loads Up to 1.5H The DO output, supply (V ), and ground (GND) pins are CC Saves Space on Board reverse polarity-protected and are protected against IEC Available in 12-Pin TDFN-EP (3mm x 3mm) or ESD and surge events. 12-Bump WLP (2.1mm x 1.6mm) The MAX14838 and MAX14839 operate from a wide sup- Dual Integrated 2mA LED Drivers ply range and are available in a 12-pin TDFN-EP package (3mm x 3mm) or a 12-bump wafer-level package (WLP) Applications (2.1mm x 1.6mm) and operate over the -40C to +105C Industry Binary Sensors temperature range. Proximity Switches Ordering Information appears at end of data sheet. Capacitive and Inductive Sensors Typical Application Circuit LEDS LED2 LDO V 24V CC 100nF 100nF FAULT DO SENSOR OUT LED2IN MAX14838 AFE 10nF DIN MAX14839 NPN GND GND PP NO 19-7465 Rev 3 10/18MAX14838/MAX14839 24V Pin-Configurable Industrial Sensor Output Drivers Absolute Maximum Ratings (All voltages referenced to GND, unless otherwise specified.) Continuous Power Dissipation (T = +70C) A V .........................................................................-36V to +36V Multiple-Layer Board CC LDO .........................................................................-0.3V to +6V (derate at 24.4mW/C above +70C) ........................1950mW DO Higher of (V - 36V) and -36V Operating Temperature Range ......................... -40C to +105C ........................................................... CC Lower of (V + 36V) and +36V Junction Temperature ......................................................+150C CC DIN, NPN, PP, NO, LDO2IN, FAULT .......................-0.3V to +6V Storage Temperature Range .............................-65C to +150 C LEDS, LED2 ....... -0.3V to the higher of (V - 0.3V) and +0.3V Solder Temperature (Reflow) .........................................+260 C CC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 12 TDFN Package Code TD1233+1 Outline Number 21-0664 Land Pattern Number 90-0397 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 41C/W JA Junction to Case ( ) 8.5C/W JC PACKAGE TYPE: 12 WLP Package Code W121C2+1 Outline Number 21-0009 Land Pattern Number Refer to Application Note 1891 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 62C/W JA For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com